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| Number | Title | Issue Date |
| 8435722 | Method for fabricating liquid crystal display device A method for fabricating a liquid crystal display includes: forming a gate electrode on a substrate; sequentially providing an insulation layer, a semiconductor layer and an etch stopper layer on the gate electrode; patterning the etch stopper layer and the semicond... | 05/07/2013 |
| 8431329 | Self-aligned spacer multiple patterning methods Self-aligned spacer multiple patterning method are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. | 04/30/2013 |
| 8431330 | Surface-treating agent for pattern formation and pattern-forming method using the surface-treating agent A surface-treating agent for forming a resist pattern, includes: a compound represented by formula (1) as defined in the specification, wherein the surface-treating agent is used in a step between a formation of a first resist pattern on a first resist film and a fo... | 04/30/2013 |
| 8426115 | Patterning process and resist composition A pattern is formed by coating a first positive resist composition comprising a copolymer comprising lactone-containing recurring units, acid labile group-containing recurring units and carbamate-containing recurring units, and a photoacid generator onto a substrate... | 04/23/2013 |
| 8404430 | Multi-chip reticle photomasks A multi-chip reticle, methods of designing and fabricating multi-chip reticles, a system for designing a multi-chip reticle, and a method of fabricating integrated circuit chips using the multi-chip reticle. The multi-chip reticle includes a transparent substrate ha... | 03/26/2013 |
| 8399180 | Three dimensional integration with through silicon vias having multiple diameters A method is disclosed which includes patterning a photoresist layer on a substrate of a structure, removing a first portion of the photoresist layer to expose a first area of the substrate, etching the first area to form a cavity having a first depth, removing a sec... | 03/19/2013 |
| 8338083 | Methods of forming electronic devices Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture. ... | 12/25/2012 |
| 8329384 | Resist-modifying composition and pattern forming process A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and... | 12/11/2012 |
| 8293458 | Method for forming fine pattern in semiconductor device Disclosed is a method for manufacturing fine patterns of semiconductor devices using a double exposure patterning process for manufacturing the second photoresist patterns by simply exposing without an exposure mask. The method comprises the steps of: forming a firs... | 10/23/2012 |
| 8247164 | Resist film forming method The method prepares a substrate provided thereon with a first resist film having a first pattern of first pillars spaced at intervals, the pillars having a first height, and forms a second resist film on the substrate. The second resist film is formed by alternately... | 08/21/2012 |
| 8211624 | Method for pattern formation and resin composition for use in the method A pattern forming method includes (1) selectively exposing a first resist layer, and developing the exposed first resist layer to form a first pattern, (2) applying a resin composition containing a hydroxyl group-containing resin and a solvent to the first pattern, ... | 07/03/2012 |
| 8206894 | Resist pattern-forming method and resist pattern miniaturizing resin composition A resist pattern-forming method includes forming a first resist pattern using a first positive-tone radiation-sensitive resin composition. A resist pattern-miniaturizing resin composition is applied to the first resist pattern. The resist pattern-miniaturizing resin... | 06/26/2012 |
| 8202682 | Method of manufacturing semiconductor device, and resist coating and developing system A method of manufacturing a semiconductor device includes: forming a resist layer on an underlayer, forming an exposed pattern in the resist layer, wherein the exposed pattern comprises a soluble layer and an insoluble layer, forming a resist pattern by removing the... | 06/19/2012 |
| 8198016 | Patterning process The present invention provides a patterning process, in which a resistance with regard to an organic solvent used for a composition for formation of a reverse film is rendered to a positive pattern to the degree of necessity and yet solubility into an alkaline etchi... | 06/12/2012 |
| 8178285 | Method for manufacturing piezoelectric/electrostrictive film type element A manufacturing method for a piezoelectric/electrostrictive film type element and a film constituting a laminated vibrator made of laminations of an electrode film and a piezoelectric/electrostrictive film in a plane position. The piezoelectric/electrostrictive film... | 05/15/2012 |
| 8173358 | Method of forming fine patterns of a semiconductor device A method of forming fine patterns of a semiconductor device includes forming a plurality of first mask patterns on a substrate such that the plurality of first mask patterns are separated from one another by a space located therebetween, in a direction parallel to a... | 05/08/2012 |
| 8173356 | Three dimensional scaffold and method of fabricating the same A three dimensional scaffold having a three dimensional structure is easily fabricated by employing a lithography process used in a semiconductor manufacturing process. A method of fabricating the same is also disclosed have a conformational structure. In the method... | 05/08/2012 |
| 8173357 | Method of forming etching mask, etching method using the etching mask, and method of fabricating semiconductor device including the etching method The method of forming an etching mask includes: forming a mask layer on an object layer that is to be etched, to form an etching mask used in etching the object layer; forming a first mask layer on the mask layer, the first mask layer having a first pattern that is ... | 05/08/2012 |
| 8163466 | Method for selectively adjusting local resist pattern dimension with chemical treatment A method forms a first patterned mask (comprising rectangular features and/or rounded openings) on a planar surface and forms a second patterned mask on the first patterned mask and the planar surface. The second patterned mask covers protected portions of the first... | 04/24/2012 |
| 8158332 | Method of manufacturing a semiconductor device A method of fabricating a semiconductor device according to an embodiment includes: forming a first resist pattern made of a first resist material on a workpiece material; irradiating an energy beam onto the first resist pattern, the energy beam exposing the first r... | 04/17/2012 |
| 8137898 | Method for manufacturing semiconductor device Disclosed is a method for manufacturing a semiconductor device. The method comprises: forming a resist layer over a substrate; exposing the resist layer to light thereby to form a first exposed pattern and a second exposed pattern on the resist layer, the second exp... | 03/20/2012 |
| 8133661 | Superimpose photomask and method of patterning Provided is a photomask that includes a substrate having a first region and a second region, a first pattern disposed in the first region of the substrate, and a second pattern disposed in the second region of the substrate. The first and second patterns are a decom... | 03/13/2012 |
| 8110340 | Method of forming a pattern of a semiconductor device A pattern for a gate line is formed using a first photoresist pattern and a first BARC layer. A pad and patterns for a select line, which has a width that is larger than that of the gate line, are formed using a second photoresist pattern and a second BARC layer. Th... | 02/07/2012 |
| 8110339 | Multi-tone resist compositions Multi-tone resists can enhance the resolution limit of a lithographic process by advantageously using the changeable solubility of a resist composition as a function of lithographic radiation dosage. By imaging a multi-tone resist with different doses of lithographi... | 02/07/2012 |
| 8110341 | Method for manufacturing a semiconductor device by using first and second exposure masks A method is disclosed for manufacturing a semiconductor device. The method includes: forming a substrate including a cell region and an outside region, wherein the outside region is adjacent to the cell region; forming a line-shaped pattern over the substrate using ... | 02/07/2012 |
| 8101338 | Method of forming micro pattern of semiconductor device The present invention relates to a method of forming a micro pattern of a semiconductor device. According to an aspect of the present invention, a first photoresist layer and a second photoresist layer with different exposure types are formed over a semiconductor su... | 01/24/2012 |
| 8053174 | Manufacturing method for wiring In the case in which a film for a resist is formed by spin coating, there is a resist material to be wasted, and the process of edge cleaning is added as required. Further, when a thin film is formed on a substrate using a vacuum apparatus, a special apparatus or eq... | 11/08/2011 |
| 8043794 | Method of double patterning, method of processing a plurality of semiconductor wafers and semiconductor device A method of double patterning is disclosed. The method includes forming a first photosensitive layer; exposing the first photosensitive layer using a first reticle; developing the first photosensitive layer thereby forming a first image pattern including first eleme... | 10/25/2011 |
| 8043795 | Method of forming resist pattern Disclosed is a method of forming a resist pattern, including: applying a positive resist composition on a support 1 to form a first resist film 2; selectively exposing the first resist film 2 through a first mask pattern, and developing it to fo... | 10/25/2011 |
| 8039203 | Integrated circuits and methods of design and manufacture thereof Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes depositing a gate material over a semiconductor substrate, and depositing a first resist layer over the gate material. A first mask is us... | 10/18/2011 |
| 8026044 | Method of forming fine patterns of semiconductor device A method of forming fine patterns on a semiconductor substrate includes forming a first pattern, including first line patterns having a feature size F and an arbitrary pitch P, and forming a second pattern, including second line patterns disposed between adjacent fi... | 09/27/2011 |
| 8003303 | Intensity selective exposure method and apparatus A gradated photomask is provided. The photomask includes a first region including a first plurality of sub-resolution features and a second region including a second plurality of sub-resolution features. The first region blocks a first percentage of the incident rad... | 08/23/2011 |
| 8003302 | Method for fabricating patterns using a photomask Disclosed herein is a method for fabricating a pattern using a photomask that includes forming a first light shielding layer pattern over a substrate; forming a first resist layer pattern aligned to the first light shielding layer pattern over the first light shield... | 08/23/2011 |
| 8003301 | Manufacturing method for semiconductor device A manufacturing method for a semiconductor device having patterns including two adjacent sides forming a corner portion with an external angle and a periodic pattern with a high density arrangement in the same layer is provided with (a) the step of exposing the firs... | 08/23/2011 |
| 7998660 | Exposure method An exposure method is disclosed. A wafer coated with a photoresist layer having an exposure threshold dose is provided. The wafer has at least a central region and a peripheral region. Then, a compensating light beam having a first dose directs on the photoresist la... | 08/16/2011 |
| 7939247 | Process of patterning small scale devices A process is provided that includes forming a first mask on an underlying layer, where the mask has two adjacent portions with an open gap therebetween, and depositing a second mask material within the open gap and at an inclined angle with respect to an upper surfa... | 05/10/2011 |
| 7914974 | Anti-reflective imaging layer for multiple patterning process Novel methods of double patterning a photosensitive resin composition are provided. The methods involve applying the photosensitive composition to a substrate and thermally crosslinking the composition. The crosslinked layer can be used to provide reflection control... | 03/29/2011 |
| 7906271 | System and method for making photomasks The present disclosure is directed a method for preparing a system of photomask patterns for implementing a drawn pattern on a substrate with a multi-patterning lithography process. The method comprises receiving data describing a drawn pattern. A first photomask pa... | 03/15/2011 |
| 7887997 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch control circuit A manufacturing method for conducting films on two opposite surfaces of a transparent substrate of a touch control circuit, includes: contacting a first photoresist layer having photosensitive and discolored emulsion on a first conducting coat formed on a first surf... | 02/15/2011 |
| 7887995 | Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed ... | 02/15/2011 |
