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...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 7393594 | Laminated metal thin plate formed by electrodeposition and method of producing the same A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical ... | 07/01/2008 |
| 7318963 | Composite chromium plating film and sliding member having the same and method for manufacture thereof A composite chromium plating film containing hard particles in network-shaped microcracks, a surface-occupying ratio of the microcracks being 10 to 20% by area, a distribution density of the microcracks being 1,200 to 2,500/cm, and the amount of the above hard parti... | 01/15/2008 |
| 7288327 | Plated structures or components Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from t... | 10/30/2007 |
| 7285319 | Engraved surface and method An engraved surface in a metallic workpiece and an engraving method therefor, for use in providing a decorative metallic surface. An engraved pattern is formed in a workpiece prior to the formation of an electroplated layer that continuously extends over the engrave... | 10/23/2007 |
| 7215916 | Endless metal belt, fixing belt and heat fixing device Objects of the present invention are to provide an endless metal belt superior in flexing resistance and durability, to provide a fixing belt using the endless metal belt, and to provide a heat fixing device with high durability and high reliability. The objects are... | 05/08/2007 |
| 7179541 | Heat treatment method for a cold-rolled strip with an Ni and/or Co surface coating, sheet metal producible by said method and battery can producible by said method A method for heat treatment of a cold rolled strip with a surface coating of Ni and/or Co and incorporated non-metallic elements C and/or S, if need be with the addition of Fe, In, Pd, Au and/or Bi, whereby the cold rolled strip has a low carbon content. Since the c... | 02/20/2007 |
| 7160629 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 01/09/2007 |
| 7157152 | Copper-tin-oxygen alloy plating The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellen... | 01/02/2007 |
| 7144637 | Multilayer, corrosion-resistant finish and method The present invention provides a black, chrome-free, multilayer corrosion protection finish designed to meet extended corrosion properties. This corrosion-resistant finish is engineered to meet a minimum of 500 salt spray testing hours to white corrosion, and 1500 s... | 12/05/2006 |
| 7125610 | Capacitor containing aluminum anode foil anodized in low water content glycerine-phosphate electrolyte without a pre-anodizing hydration step A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. The capacitor has a CV Product of at least 9 μF-V/cm2 at 250 volts. Furthermore, the capacitor is formed by th... | 10/24/2006 |
| 7063897 | Slide member A Bi base material of which a Miller index (202) face has the index of orientation of not less than 30% and in which the (202) face has the index of orientation assuming a maximum value as compared with those of other faces forms a minute structure and has a surface... | 06/20/2006 |
| 7022417 | Metal belt and coated belt A metal belt of the present invention is formed to be endless by electroforming, has a crystal orientation in which a crystal orientation ratio I(200)/I(111) is not less than 80 and not more than 250, mainly contains nickel, and has an excellen... | 04/04/2006 |
| 7022419 | Composite plating film and a process for forming the same A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubri... | 04/04/2006 |
| 7018720 | Layer sequence built on a substrate in thin-film technology The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a me... | 03/28/2006 |
| 6994919 | Brazing product and method of manufacturing a brazing product The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of... | 02/07/2006 |
| 6989087 | Metal finishes A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver or silver alloy whereby the ... | 01/24/2006 |
| 6989199 | Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-... | 01/24/2006 |
| 6984453 | Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pre... | 01/10/2006 |
| 6982012 | Method of manufacturing steel sheet having excellent workability and shape accuracy A method of manufacturing a high strength steel sheet containing, in mass %, C: 0.02 to 0.04%, Si: at most 0.4%, Mn: 0.5-3.0%, P: at most 0.15%, S: at most 0.03%, Al: at most 0.50%, N: at most 0.01%, and Mo: 0.01-1.0%. The method includes performing hot rough rollin... | 01/03/2006 |
| 6974636 | Protective coating for turbine engine component A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum... | 12/13/2005 |
| 6974533 | Platinum electrode and method for manufacturing the same An improved electrode and method for manufacturing the improved electrode wherein the electrode having a fractal surface coating of platinum [which the present inventor refers to as “platinum gray”] with a increase in surface area of at least 5 times when compar... | 12/13/2005 |
| 6969557 | Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same The invention provides a surface-treated copper foil which can sufficiently ensure adhesive strength with a low-dielectric substrate used in forming a printed wiring board for high-frequency applications and can minimize transmission losses. There is provided a surf... | 11/29/2005 |
| 6939621 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 09/06/2005 |
| 6938552 | Corrosion-resistant structure incorporating zinc or zinc-alloy plated lead or lead-alloy wires and method of making same Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bulle... | 09/06/2005 |
| 6902827 | Process for the electrodeposition of low stress nickel-manganese alloys A process for electrodepositing a low stress nickel-manganese multilayer alloy on an electrically conductive substrate is provided. The process includes the steps of immersing the substrate in an electrodeposition solution containing a nickel salt and a manganese sa... | 06/07/2005 |
| 6893738 | Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited cop... | 05/17/2005 |
| 6893739 | Steel plate and a hot dip galvanizing steel plate having superior electric and magnetic shielding property A steel plate and a hot-dip galvanized steel plate, superior in terms of high electromagnetic shield capacity. The steel plate is prepared from a composition comprising C, N and S in an amount of 0.150% by weight or less in total; Mn in an amount of 0.1 to 1.0% by w... | 05/17/2005 |
| 6887561 | Methods and producing conductor layers on dielectric surfaces A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic so... | 05/03/2005 |
| 6884523 | Electronic component and method of manufacturing the same An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crysta... | 04/26/2005 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer thickness has formed in a first plating time, biasing is interrupted during s... | 04/26/2005 |
| 6878458 | Metal foil for current collector of secondary battery and method of producing the same A metal foil for a current collector of a secondary battery formed by electrodeposition and has a thickness (T) of 8 to 40 μm, the metal foil satisfying the following formulae: 4.9×108≦T×S×Y≦31×108 4.5≦ε... | 04/12/2005 |
| 6869684 | Protection of a surface by partially subjecting it to an electrochemical treatment In a method of providing a surface with a protection layer having at least a first surface area (2) and a second surface area (1), which surface areas (1, 2) are distinguishable in that the surface areas (1, 2) differ from each other in a... | 03/22/2005 |
| 6866765 | Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction... | 03/15/2005 |
| 6852427 | Chromium-free antitarnish adhesion promoting treatment composition The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions... | 02/08/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6849344 | Fabricated titanium article having improved corrosion resistance A titanium article having improved corrosion resistance resulting from a direct or indirect attachment of a platinum group metal or alloy thereof or incorporation of this metal or alloy thereof into a minor surface portion of the article. ... | 02/01/2005 |
| 6844082 | Gas distribution plate with anodized alumnium coating A new and improved, anodized aluminum gas distribution plate for process chambers, particularly an etch chamber. The gas distribution plate includes an aluminum body having multiple gas flow openings extending therethrough and an alumina anodized coating or layer on... | 01/18/2005 |
| 6841264 | Doctor or coater blade and method in connection with its manufacturing The invention relates to a doctor or coater blade (1) of steel, having a nickel coating comprising abrasion resistant particles, said coating being constituted by an electrolytic nickel layer comprising abrasion resistant particles. The coating preferably com... | 01/11/2005 |
| 6837980 | Bond enhancement antitarnish coatings Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals,... | 01/04/2005 |
| 6835442 | Flexible printed wiring board A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on ... | 12/28/2004 |
