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| Number | Title | Issue Date |
| 7238432 | Metal member coated with metal layers There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentia... | 07/03/2007 |
| 7235309 | Electronic device having external terminals with lead-free metal thin film formed on the surface thereof A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. ... | 06/26/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7147933 | Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of m... | 12/12/2006 |
| 7063896 | Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof A method is proposed for preparing a structured metallic surface of a body or for the structuring close to the surface or the generation of metallic structures, first of all on a first metal layer or on a first intermetallic layer a second metal layer or a second in... | 06/20/2006 |
| 7029760 | Plated material and method of manufacturing the same, terminal member for connector, and connector A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer | 04/18/2006 |
| 6972156 | Body formed of set, initially pasty material and including an electrically conducting path and a method of making such a body A body (5) of set, initially pasty material, such as concrete, includes an electrically conducting path formed by a concentrated layer (6) of electrically conducting magnetizable elements, such as fibers (F) or granules (G), embedded in the initially p... | 12/06/2005 |
| 6939621 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 09/06/2005 |
| 6923692 | Electrical connectors incorporating low friction coatings and methods for making them Electrical connectors incorporate a composite coating of molybdenum disulfide and a metal, preferably tin, for one or both of the contact surfaces of the electrical connector. The coating provides for a low coefficient of friction, low contact resistance, and good e... | 08/02/2005 |
| 6924044 | Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of m... | 08/02/2005 |
| 6908691 | Metal strip for epitaxial coatings and method for the production thereof The aim of the invention is to provide a metal strip for epitaxial coating with a biaxially textured layer, this metal strip, however, being able to be produced in an uncomplicated manner and having a high tensile strength, low magnetic losses and/or a high electric... | 06/21/2005 |
| 6896976 | Tin antimony solder for MOSFET with TiNiAg back metal A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder. ... | 05/24/2005 |
| 6872470 | Nickel-gold plating exhibiting high resistance to corrosion A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential ... | 03/29/2005 |
| 6844054 | Thermal management material, devices and methods therefor The present invention provides thermal devices, materials and methods for use in transferring heat from heat sources. One embodiment comprises a thermal transfer body that has first and second end portions and includes a thermally anisotropic material that conducts ... | 01/18/2005 |
| 6828052 | Surface treated electrically conductive metal element and method of forming same An electrically conductive metal element comprises an electrically conductive metal substrate having a layer of Ni—Sn alloy overlying an electrically conductive surface of the substrate and at least one layer of Ag or of Ag containing Sn overlying the Ni—Sn allo... | 12/07/2004 |
| 6770383 | Plated material, method of producing same, and electrical/electronic part using same To provide a plated material having both high heat-resistance and good insertability/extractability. The plated material comprises an undercoating of any one of metals belonging to group 4, group 5, group 6, group 7, group 8, group 9 or group 10 of the periodic tabl... | 08/03/2004 |
| 6759142 | Plated copper alloy material and process for production thereof A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness ... | 07/06/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6692841 | Joined structure of dissimilar metallic materials A friction welded joint structure includes friction welded dissimilar first and second metallic materials. The first metallic material has a rigidity greater than the second metallic material. The angle of the first metallic material to a free edge of the... | 02/17/2004 |
| 6677055 | Tape structure and manufacturing method A tape structure and method of fabricating the tape structure. The method includes plating a metal such as silver, bismuth, gold, magnesium, nickel, or palladium over leads so that recess cavities and whiskers on the leads are greatly reduced.... | 01/13/2004 |
| 6641930 | Electrically conductive metal tape and plug connector An electrically conductive metal tape for manufacturing electrical contact components and a plug connector made of it. The metal tape has a base material made of copper or a copper alloy having a metallic coating, applied by molten technology, made of a t... | 11/04/2003 |
| 6613451 | Metallic material Ni alloy or Cu alloy containing P and/or B is plated on a base metal consisting of Cu or Cu alloy as an intermediate layer, Sn or Sn alloy is further plated on the content of P or B in the plating layer is limited by carrying out reflow treatment, whereby... | 09/02/2003 |
| 6565983 | Electrical contact element and use of the contact element An electrical contact element for electrically connecting an electric device and providing current transmission in an electric device wherein the electrical contact element comprises a metallic body, and wherein at least one contact surface, present on th... | 05/20/2003 |
| 6528181 | Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same A plated steel sheet and a connection terminal material using the plated steel sheet have low contact resistance and excellent corrosion resistance. The coated film, which has excellent adhesion, is formed by coating a stainless steel base sheet which is ... | 03/04/2003 |
| 6521358 | Lead frame for semiconductor device and method of producing same A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than... | 02/18/2003 |
| 6514630 | Au-based clad composite material, producing method thereof and micromotor using the same To provide a contact material suitable for a commutator of a micromotor which can improve wear resistance and prolong the life of the micromotor by improving an Au-based clad composite material provided at an outermost layer with Au or an Au alloy. The pr... | 02/04/2003 |
| 6503641 | Interconnects with Ti-containing liners An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, ... | 01/07/2003 |
| 6485843 | Apparatus and method for mounting BGA devices A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printe... | 11/26/2002 |
| 6475643 | Plated electrical leads A plated lead for electrical devices is plated with a Sn-based lead-free alloy containing 0.001-0.1 weight percent of Ga. The formation of oxides in a hot dipping bath can be suppressed by the presence of 0.001-0.1 weight percent of P in the alloy.... | 11/05/2002 |
| 6468677 | Electroluminescent high pressure laminate The invention relates to laminates including at least a first resin impregnated sheet having an electroluminescent compound dispersed therein and electrical leads coupling the electroluminescent compound to a source of electrical energy. The laminate is m... | 10/22/2002 |
| 6461540 | Conductive paste and multi-layer ceramic electronic component using the same A conductive paste for forming external electrodes of a multi-layer ceramic electronic component contains an Ag-based conductive component, an organic vehicle and a glass frit. The glass frit in the conductive paste contains B2 O3, S... | 10/08/2002 |
| 6399220 | Conformable nickel coating and process for coating an article with a conformable nickel coating The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or iron alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to a... | 06/04/2002 |
| 6395402 | Electrically conductive polymeric foam and method of preparation thereof Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting... | 05/28/2002 |
| 6368734 | NTC thermistors and NTC thermistor chips An NTC thermistor has an electrically insulating substrate, a temperature-sensitive film on a surface of the substrate containing oxide of rare earth elements such as LaCoO3 as its principal component by at least 50 weight %, and a pair of elec... | 04/09/2002 |
| 6336979 | Wear resistant copper base alloy, method of preparing the same and electrical part using the same Wear resistant copper or a wear resistant copper base alloy having formed on the outermost surface thereof an oxide layer having a thickness of 10-1000 nm and a layer of an intermetallic compound primarily comprising Cu--Sn having a thickness of 0.1-10 μ... | 01/08/2002 |
| 6335107 | Metal article coated with multilayer surface finish for porosity reduction In accordance with the invention, a metal substrate is coated with a multilayer surface finish comprising, in succession, an amorphous metal underlayer, a corrosion-resistent metal middle layer and one or more outer layers of precious metal. In an exempla... | 01/01/2002 |
| 6274254 | Electrodeposited precious metal finishes having wear resistant particles therein An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In... | 08/14/2001 |
| 6254979 | Low friction electrical terminals A low friction, low contact resistance coating for electrical terminal members, especially members made of copper base alloys and low carbon steel alloys and plastics, is formed of a coarse electroplate of tin or silver characterized by grains having an a... | 07/03/2001 |
| 6245448 | Lead frame with reduced corrosion A palladium plated lead frame (34) for integrated circuit devices has a nickel strike (36) and a palladium/nickel alloy layer (38) separating the copper base metal (28) from the nickel intermediate layer (40) in order to prevent a galvanic potential from ... | 06/12/2001 |
| 6245166 | Material for sliding contact, composite clad material, and small-sized direct current motor using the same An object of the present invention is to provide a material for a sliding contact whose alloy composition does not contain an environmentally detrimental substance such as Cd, which exhibits excellent contact resistance, whose electrical functions are goo... | 06/12/2001 |
