Quotables
"There is practically no chance communications space satellites will be used to provide better telephone, telegraph, television, or radio service inside the United States."
T. Craven, FCC Commissioner ; 1961
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a... | 10/21/2008 |
| 7396588 | Curable composition, varnish and laminate A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 μm, an aspect ratio of 5 or less, and the proporti... | 07/08/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7383629 | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical proce... | 06/10/2008 |
| 7356916 | Circuit-formed substrate and method of manufacturing circuit-formed substrate A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not ... | 04/15/2008 |
| 7348080 | Low temperature polyimide adhesive compositions and methods relating thereto The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an... | 03/25/2008 |
| 7348069 | Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate A first ceramic substrate includes a substrate (2) and a glaze layer (3), wherein the glaze layer has a surface having an Ra of 0.02 μm or less and a Ry of 0.25 μm or less. A second ceramic substrate is formed by subjecting a glass layer (24) ... | 03/25/2008 |
| 7332231 | Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same A ceramic substrate for a thin film electronic component, a production method thereof, and a thin film electronic component using the ceramic substrate A first substrate (1) includes a dense glass-ceramic mixed layer (33) containing glass in its surfac... | 02/19/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7311966 | Porous insulating film and its laminates A porous insulating film comprising a highly heat resistant resin film having a fine porous structure with a mean pore size of 0.01-5 μm in at least the center of the film, and a porosity of 15-80%. A laminate is prepared by forming a heat resistant adhesive layer ... | 12/25/2007 |
| 7303811 | Porous insulating film and its laminates A porous insulating film comprising a highly heat resistant resin film having a fine porous structure with a mean pore size of 0.01-5 μm in at least the center of the film, and a porosity of 15-80%. A laminate is prepared by forming a heat resistant adhesive layer ... | 12/04/2007 |
| 7304392 | Die for forming an optical element, and production method as well as regeneration method of the same A die for forming an optical element, comprising: (i) a base member having a base surface which comprises a foundation area including a die surface to form an optical surface of the optical element and a peripheral area provided around the foundation area; (i... | 12/04/2007 |
| 7301228 | Semiconductor device, method for manufacturing same and thin plate interconnect line member The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devices 410a and 410 | 11/27/2007 |
| 7294389 | Microstructure array and a microlens array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating ... | 11/13/2007 |
| 7291380 | Laser enhanced plating for forming wiring patterns A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region. ... | 11/06/2007 |
| 7282255 | Flexible printed circuit board and process for producing the same The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for producing the same. In the present invention, in the flexible printe... | 10/16/2007 |
| 7283035 | Radio frequency data communications device with selectively removable antenna portion and method An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry an... | 10/16/2007 |
| 7279216 | Identifiable flexible printed circuit board and method of fabricating the same The invention discloses an identifiable flexible printed circuit board (PCB) and a method of fabricating the same. The identifiable flexible PCB includes a flexible substrate, a conductive layer, and a printing ink layer. First, the conductive layer is formed over a... | 10/09/2007 |
| 7273654 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a me... | 09/25/2007 |
| 7263766 | Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers... | 09/04/2007 |
| 7258819 | Voltage variable substrate material The present invention provides an improved voltage variable material (“VVM”). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having... | 08/21/2007 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 05/29/2007 |
| 7217462 | Metal foil-clad laminate The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: wherein R and Φ are as defined in t... | 05/15/2007 |
| 7217463 | Machine direction oriented polymeric films and methods of making the same This invention relates to a film comprising a machine direction oriented polymeric film prepared from (A) at least one propylene homopolymer or copolymer or lend of two or more thereof, wherein (A) has a melt flow rate from about 6 to about 30 and (B) an olefin elas... | 05/15/2007 |
| RE39615 | Adhesive compositions and copper foils and copper clad laminates using same The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula | 05/08/2007 |
| 7214424 | Heat-peelable pressure-sensitive adhesive sheet A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-exp... | 05/08/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7211735 | Processes for manufacturing multilayer flexible wiring boards A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual la... | 05/01/2007 |
| 7208062 | Method of producing multilayer printed wiring board Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting res... | 04/24/2007 |
| 7208539 | Thermosetting resin composition, and prepreg and laminated board using the same The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using... | 04/24/2007 |
| 7192651 | Resin composition and prepreg for laminate and metal-clad laminate A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition. ... | 03/20/2007 |
| 7179552 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a ... | 02/20/2007 |
| 7179550 | Member for supporting magnetic disc substrates, process of producing the same, and magnetic disc device using the same A member of supporting magnetic disc substrates is provided, comprising a ceramic sinter containing a ceramic component and at least one conductive component selected from a group consisting of iron, niobium, tin zinc, copper, nickel, cobalt, and chromium, wherein t... | 02/20/2007 |
| 7179520 | Circuit substrate, electro-optic device and electronic equipment A circuit substrate is described where the circuit substrate has a first wiring group extending in a first direction and a second wiring group extending in a second direction substantially orthogonal to the first direction. The first wiring group of the circuit subs... | 02/20/2007 |
| 7180006 | Tape substrate and method for fabricating the same A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern... | 02/20/2007 |
| 7172805 | Method for manufacturing a sequential backplane A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a dielectric layer with a channel formed therein to define a perimeter of a connector area is provided. The dielectric layer is bonded to the multi-layer board s... | 02/06/2007 |
| 7169331 | Conductive paste and ceramic multilayer substrate A conductive paste used for forming conductive sinters includes a mixture of a copper powder coated with a metal oxide and a metal oxide powder, and an organic vehicle. The content of the metal oxide used for coating the copper powder is in the range of about 0.05% ... | 01/30/2007 |
| 7166361 | Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R′m(H)... | 01/23/2007 |
