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| Number | Title | Issue Date |
| 7985487 | Corrosion resistant conductive parts Disclosed is a corrosion resistant conductive part, which is made by forming a thin plated gold layer of thickness 100 nm or less on a stainless steel sheet, and for which high corrosion resistance is guaranteed even with a very thin gold layer. The part is characte... | 07/26/2011 |
| 7514156 | Layered article A multi-layered article includes first and second external layers of soft electroplated gold material. An intermediate layer of hard electroplated gold material is arranged between the first and second external layers. Each of the layers has a substantially uniform ... | 04/07/2009 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal... | 08/19/2008 |
| 7407715 | Method of brazing and article made therefrom A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected... | 08/05/2008 |
| 7331797 | Electrical connector and a manufacturing method thereof A manufacturing method for an electrical connector is provided. The electrical connector includes a main portion and a plurality of supporting members that are connected with the main portion. The supporting members are applied with a plurality of metal layers there... | 02/19/2008 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7252872 | Joined structures of ceramics An object of the present invention is to provide a joined structure effective for preventing crack formation after thermal cycles. The joined structure has a ceramic member 1, a metal member 4 to be joined, and a metal fixed member 3 fixed to th... | 08/07/2007 |
| 7247396 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 07/24/2007 |
| 7238432 | Metal member coated with metal layers There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentia... | 07/03/2007 |
| 7233072 | Electronic part and surface treatment method of the same There is provided a surface treatment method for an electronic part, which uses a metal not containing lead and tin and having excellent solder wettability, is economical and has high reliability. In the surface treatment method for the electronic part in which a so... | 06/19/2007 |
| 7211340 | Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the ... | 05/01/2007 |
| 7169486 | Highly oriented perpendicular magnetic recording media A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a ma... | 01/30/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7141311 | Ferrite thin film for high frequency and method for preparation thereof The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the ... | 11/28/2006 |
| 7097897 | Powder coated strap and method for making same A corrosion-resistant coated strap is formed from an elongated metal strap base element having a width and a thickness and defining first and second sides and a pair of edge regions. A coating is applied and cured onto the base element. The coating has a substantial... | 08/29/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7067191 | Method to increase wear resistance of a tool or other machine component A layer system in particular for tools or machine components operated under insufficient lubrication or under dry operation conditions, is proposed, which system, starting from the base body, comprises a hard substance layer system, subsequently a metallic layer and... | 06/27/2006 |
| 7053126 | Process for producing noble-metal type fine-particle dispersion, coating liquid for forming transparent conductive layer, transparent conductive layered structure and display device A process for producing a noble-metal type fine-particle dispersions, having the steps of an agglomeration step of adding a hydrazine solution to a dispersion in which primary particles of noble-metal type fine particles have been made to stand monodisperse in a sol... | 05/30/2006 |
| 7011697 | Electroless gold plating solution An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper c... | 03/14/2006 |
| 7001683 | Separator for fuel cell and method for producing the same A separator for a fuel cell includes a gold covering layer formed on the surface of stainless steel plate. A method for producing a separator, prevents exfoliation and fracture of the gold covering layer but obtains corrosion resistance and durability. Voids are for... | 02/21/2006 |
| 6991675 | Electroless displacement gold plating solution and additive for use in preparing plating solution An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement go... | 01/31/2006 |
| 6974635 | Package for electronic component, lid material for package lid, and production method for lid material A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer and composed of a Ni-based metal, such as pure Ni, mainly comprising... | 12/13/2005 |
| 6953620 | Coating system and method for its manufacture and its use A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a wa... | 10/11/2005 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexin... | 08/30/2005 |
| 6932897 | Titanium-containing metals with adherent coatings and methods for producing same A method for plating a titanium-containing metal, comprising the steps of: (a) surface treating the titanium-containing metal in a solution consisting essentially of an aqueous solvent and hydrochloric acid for a period of time sufficient to activate the surface of ... | 08/23/2005 |
| 6923625 | Method of forming a reactive material and article formed thereby A method for preventing contamination, oxidation and gas absorption of reactive materials, and articles formed thereby. The method generally entails depositing a first layer of a reactive material and a second layer of a substantially nonreactive material so that th... | 08/02/2005 |
| 6881499 | Bonded member comprising different materials and production method thereof A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the... | 04/19/2005 |
| 6878461 | Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same There is provided contact, sliding, fitting-in and ornamental members having a surface treatment structure in which contact resistance is low, and lubricating property and wear resistance are excellent, and capable of being used suitably for any use of contact, slid... | 04/12/2005 |
| 6878463 | Method of machining glass A low cost, durable mask for use in structuring anodically bondable glass materials and other structurable glass materials. ... | 04/12/2005 |
| 6872470 | Nickel-gold plating exhibiting high resistance to corrosion A nickel-gold plating exhibiting high resistance to corrosion, which has a nickel plating layer formed on a base metal (1) and a gold plating layer (3) formed thereon, characterized in that the nickel plating layer (2) has a corrosion potential ... | 03/29/2005 |
| 6872465 | Solder In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and th... | 03/29/2005 |
| 6869671 | Enabling nanostructured materials via multilayer thin film precursor and applications to biosensors A thin film based nanoporous alumina template has been developed which allows the in situ removal of an electrically insulating alumina barrier layer at the pore bases. This barrier free nanoporous system has great utility for electrodeposition of a wide variety of ... | 03/22/2005 |
| 6866765 | Electrolytic copper-plated R-T-B magnet and plating method thereof An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction... | 03/15/2005 |
| 6863995 | Method for brazing components using a Ni-Au-P ternary brazing alloy, the assembly so produced and the ternary alloy A method for using a novel ternary nickel-gold-phosphorus brazing alloy for joining nickel-based components together and the assembly so formed. ... | 03/08/2005 |
| 6863991 | Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (... | 03/08/2005 |
| 6852210 | Plating method and plating bath precursor used therefor To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing ... | 02/08/2005 |
| 6828052 | Surface treated electrically conductive metal element and method of forming same An electrically conductive metal element comprises an electrically conductive metal substrate having a layer of Ni—Sn alloy overlying an electrically conductive surface of the substrate and at least one layer of Ag or of Ag containing Sn overlying the Ni—Sn allo... | 12/07/2004 |
| 6811894 | Ceramic turbine blade attachment having high temperature, high stress compliant layers and method of fabrication thereof A nickel base single crystal compliant layer on a ceramic blade has the capability to sustain high stresses and high operating temperature. Layers of nickel and platinum bonded on a single crystal superalloy over a sputtered gold-chromium layer support the high stre... | 11/02/2004 |
| 6797405 | Method for uniform electrochemical reduction of apertures to micron and submicron dimensions using commercial biperiodic metallic mesh arrays and devices derived therefrom A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting... | 09/28/2004 |
| 6797409 | Electrodeposition process and a layered composite material produced thereby An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second all... | 09/28/2004 |
