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Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 8182932 | Sn-plated copper alloy strip having improved fatigue characteristics The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or ... | 05/22/2012 |
| 8142906 | Sn-plated copper or Sn-plated copper alloy having excellent heat resistance and manufacturing method thereof In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a co... | 03/27/2012 |
| 7972709 | Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and... | 07/05/2011 |
| 7871710 | Conductive material for a connecting part Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided betwee... | 01/18/2011 |
| 7824776 | Plated material and electric and electronic parts using the plated material A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cuâ€... | 11/02/2010 |
| 7820303 | Conductive material for connecting part and method for manufacturing the conductive material There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 Î... | 10/26/2010 |
| 7763363 | Bearing for motorized fuel pump A bearing for a motorized fuel pump is made of a Cu—Ni based sintered alloy, composed of: 21 to 35% by mass of Ni, 5 to 12% by mass of Sn, 3 to 7% by mass of C, 0.1 to 0.8% by mass of P, and the balance of Cu and inevitable impurities. A matrix of the bearing is f... | 07/27/2010 |
| 7651785 | Tin-plated product There is provided a tin-plated product which has a small deterioration of contact resistance with age, an excellent wear resistance and a low coefficient of friction. A coating of a composite material, which contains 0.1 to 1.0 wt % of carbon particles dispersed in ... | 01/26/2010 |
| 7368046 | Layered composite material for plain bearings, production and use thereof The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. ... | 05/06/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7296370 | Electroplated metals with silvery-white appearance and method of making Metals having a silvery-white appearance and methods of producing the same. In one embodiment, the composite material of the present invention comprises a metallic core, a first layer, and a second layer. The first layer encases the external surfaces of the metallic... | 11/20/2007 |
| 7294411 | Brazing product and method of its manufacture The invention relates to a brazing sheet product comprising a core sheet, a clad layer on said core sheet made of an aluminum alloy containing silicon in an amount in the range of 4 to 14% by weight, an optional layer comprising nickel on the outersurface of said cl... | 11/13/2007 |
| 7294028 | Electrical contact An electric contact, in particular an electric contact of a plug-in connector, has a metallic substrate to which a contact layer is applied. The contact layer is arranged as a structured layer. ... | 11/13/2007 |
| 7282444 | Semiconductor chip and manufacturing method for the same, and semiconductor device The invention provides a semiconductor chip manufacturing method including the steps of: forming a concave portion extended in the thickness direction of a semiconductor substrate which has a front surface and a rear surface and has a function device formed on the f... | 10/16/2007 |
| 7273540 | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being ... | 09/25/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7267861 | Solder joints for copper metallization having reduced interfacial voids A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, w... | 09/11/2007 |
| 7262497 | Bumpless assembly package A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second contacts formed on the upper surface of the substrate, wherein one of the ... | 08/28/2007 |
| 7235309 | Electronic device having external terminals with lead-free metal thin film formed on the surface thereof A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. ... | 06/26/2007 |
| 7192656 | Zinc galvanizing method for a single surface of a metal tube A zinc galvanizing method for a single surface of a metal tube includes a first step of preparing metal tubes, a second step of galvanizing the metal tubes, a third step of acid washing, a fourth step of washing the metal tubes with water, and a final fifth step of ... | 03/20/2007 |
| 7189630 | Layer sequence for producing a composite material for electromechanical components The invention relates to a layer sequence on a substrate made from copper, a copper-based alloy, a copper-plated substrate or a nickel or a nickel-based alloy for production of a composite material, in which a covering layer, consisting of tin or a tin-based alloy, ... | 03/13/2007 |
| 7179417 | Sn—Zn lead-free solder alloy, its mixture, and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/20/2007 |
| 7175804 | Sn-Zn lead-free solder alloy, and solder junction portion An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt %... | 02/13/2007 |
| 7175805 | Tin-zinc lead-free solder, its mixture, and solder-joined part An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least, and further containing 0.0015 to 0.1 wt % magnesium, said magnesium content ... | 02/13/2007 |
| 7173510 | Thermal fuse and method of manufacturing fuse A thermal fuse includes a fusible alloy including tin, a couple of lead conductors connected to both ends of the fusible alloy, respectively, and a surface layer on the lead conductors, respectively. The surface layer is made of tin or alloy including tin as main su... | 02/06/2007 |
| 7172662 | Copper alloy material for parts of electronic and electric machinery and tools A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of ... | 02/06/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7154321 | Digital delay line A digital delay line including a first feedback delay line having a first number of interlinked first delay elements, at least one second feedback counter having a second number of second interlinked counting elements, the counting elements being clocked by one of t... | 12/26/2006 |
| 7153591 | Sliding member Disclosed is a sliding member having a bearing alloy layer, an intermediate layer of Ni or a Ni alloy formed on the bearing alloy layer, and an overlay layer of a Sn alloy containing Cu formed on the intermediate layer. There exist Sn—Cu compounds in the overlay l... | 12/26/2006 |
| 7150781 | Pyrophosphoric acid bath for use in copper-tin alloy plating The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound b... | 12/19/2006 |
| 7151049 | Electroplating compositions and methods Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, a... | 12/19/2006 |
| 7148426 | Lead-free solder, and connection lead and electrical component using said lead-free solder In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip ... | 12/12/2006 |
| 7147933 | Tin-silver coatings The present invention relates to improved coatings for electrical or electronic connectors such as contacts or terminals used in automotive applications. Coatings in accordance with the present invention preferably comprise binary tin-silver coatings consisting of m... | 12/12/2006 |
| 7145243 | Photo-thermal induced diffusion Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, s... | 12/05/2006 |
| 7104850 | Low insertion-force connector terminal, method of producing the same and substrate for the same The present invention is to provide low insertion-force connector terminals. A self-assembled monolayer is deposited on the surface of the connector terminals. The deposited connector terminals do not require a special lever for adjusting contact pressure. The conne... | 09/12/2006 |
| 7098534 | Sacrificial component A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacr... | 08/29/2006 |
| 7090732 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 08/15/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7080451 | Method for manufacturing an electronic component A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is... | 07/25/2006 |
