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| Number | Title | Issue Date |
| 7829199 | Solder, and mounted components using the same An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprisin... | 11/09/2010 |
| 7754343 | Ternary alloy column grid array Techniques and structures have been developed for providing lead-free column grid array interconnect structures. An exemplary interconnect has a body, a first joint, and a second joint, all having compositions off the eutectic composition in a ternary alloy system, ... | 07/13/2010 |
| 7547479 | Tin-coated printed circuit boards with low tendency to whisker formation A coated article, which contains (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a tin-containing layer, wherein the layer (ii) is positioned between the layer (i) and the layer (iii). The a... | 06/16/2009 |
| 7473476 | Soldering method, component to be joined by the soldering method, and joining structure It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering mat... | 01/06/2009 |
| 7361996 | Semiconductor device having tin-based solder layer and method for manufacturing the same A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base member through the first metal layer, the first alloy layer and the t... | 04/22/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7331797 | Electrical connector and a manufacturing method thereof A manufacturing method for an electrical connector is provided. The electrical connector includes a main portion and a plurality of supporting members that are connected with the main portion. The supporting members are applied with a plurality of metal layers there... | 02/19/2008 |
| 7325716 | Dense intermetallic compound layer Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing... | 02/05/2008 |
| 7294028 | Electrical contact An electric contact, in particular an electric contact of a plug-in connector, has a metallic substrate to which a contact layer is applied. The contact layer is arranged as a structured layer. ... | 11/13/2007 |
| 7276296 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 10/02/2007 |
| 7274091 | Semiconductor device and method of manufacturing a semiconductor device There is provided a semiconductor device including, a bed, a brazing filler metal formed on a first surface of the bed, a barrier metal film formed on a first surface of the brazing filler metal, a alloy film formed on a first surface of the barrier metal film, a se... | 09/25/2007 |
| 7263913 | Big and bearing shell The invention relates to a big end bearing shell (4, 6) for a connecting rod (2), consisting of titanium or a titanium alloy. The shell comprises a support layer (8, 20) consisting of steel and an anti-friction layer (16, 26) for the cran... | 09/04/2007 |
| 7238433 | Plated automotive part and method A plated automotive part and method of plating are provided. One or more semi-bright finish layers of nickel are plated onto an automotive part. One or more bright finish layers of nickel are plated onto the outermost, semi-bright finish layer of nickel. One or more... | 07/03/2007 |
| 7235309 | Electronic device having external terminals with lead-free metal thin film formed on the surface thereof A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. ... | 06/26/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7215014 | Solderable metal finish for integrated circuit package leads and method for forming A packaged integrated circuit includes a die surrounded by an encapsulant in which leads are used to electrically connect the die, which is internal to the encapsulant, externally. The leads have a primary metal that is used for electrical conduction and physical su... | 05/08/2007 |
| 7192809 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 03/20/2007 |
| 7173510 | Thermal fuse and method of manufacturing fuse A thermal fuse includes a fusible alloy including tin, a couple of lead conductors connected to both ends of the fusible alloy, respectively, and a surface layer on the lead conductors, respectively. The surface layer is made of tin or alloy including tin as main su... | 02/06/2007 |
| 7160629 | Tin plating Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating. ... | 01/09/2007 |
| 7157152 | Copper-tin-oxygen alloy plating The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellen... | 01/02/2007 |
| 7156283 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux ... | 01/02/2007 |
| 7152302 | Superconductor connection structure A method of producing an electrical connection structure between at least two superconducting lines. The method comprises adding metal powder or alloy powder to a superconducting material comprising magnesium diboride, intervening the superconducting material betwee... | 12/26/2006 |
| 7150781 | Pyrophosphoric acid bath for use in copper-tin alloy plating The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound b... | 12/19/2006 |
| 7145243 | Photo-thermal induced diffusion Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, s... | 12/05/2006 |
| 7132172 | Composite material for use in the manufacture of electrical contacts and a method for its manufacture An electrically conductive composite material for use in the manufacture of electrical contact components, consisting of a metal strip and a contact layer made of a silver or tin contact material, which contact layer is applied at least to one side of the metal stri... | 11/07/2006 |
| 7127806 | Method for marking coaxial cable jumper assembly including plated outer assembly A jumper coaxial cable assembly includes a jumper coaxial cable and at least one solder-type connector secured thereto. The cable may include an outer conductor, which, in turn, includes aluminum with a tin layer thereon. The tin layer permits an aluminum outer cond... | 10/31/2006 |
| 7122894 | Wiring substrate and process for manufacturing the same A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer. ... | 10/17/2006 |
| 7087315 | Method for forming plating film A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining th... | 08/08/2006 |
| 7067200 | Joined bodies and a method of producing the same A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains... | 06/27/2006 |
| 7037559 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 05/02/2006 |
| 7029529 | Method and apparatus for metallization of large area substrates A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stampi... | 04/18/2006 |
| 7025600 | Semiconductor device having external contact terminals and method for using the same A method of using a semiconductor device having a plurality of external contact terminals formed of springy wires, usable in a stable state free from variation of contact voltage for a long period even if a contact terminal repeatedly makes contact several hundreds ... | 04/11/2006 |
| 7023686 | High-voltage ceramic capacitor A high-voltage ceramic capacitor which includes a capacitor element, at least one metal terminal, and at least one solder joint portion. The capacitor element has electrodes on opposing surfaces of a ceramic porcelain. The metal terminal has one end surface facing o... | 04/04/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
| 7005404 | Substrates with small particle size metal oxide and noble metal catalyst coatings and thermal spraying methods for producing the same A substrate having a catalytic surface thereon characterized as a coating of metal oxide and noble metal particles in the nominal diameter size distribution range of | 02/28/2006 |
| 7001671 | Kinetic sprayed electrical contacts on conductive substrates The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form... | 02/21/2006 |
| 6982030 | Reduction of surface oxidation during electroplating Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorpora... | 01/03/2006 |
| 6960396 | Pb-free solder-connected structure and electronic device Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whisk... | 11/01/2005 |
| 6923692 | Electrical connectors incorporating low friction coatings and methods for making them Electrical connectors incorporate a composite coating of molybdenum disulfide and a metal, preferably tin, for one or both of the contact surfaces of the electrical connector. The coating provides for a low coefficient of friction, low contact resistance, and good e... | 08/02/2005 |
| 6921865 | Superconductor connection structure Electrical connection of superconducting lines can be achieved by using a low-melting point metal, by mechanical contact of superconducting lines or by welding. According to these methods, however, critical current and critical magnetic field at the connection point... | 07/26/2005 |
