Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7240973 | Crawler, crawler pin, crawler bush, and crawler manufacturing method A crawler having a crawler pin and a crawler bush having lubrication between the crawler pin and the crawler bush without lowering the strength of the crawler at the running time, thereby to prevent the creak or seizure, as might otherwise be caused at the running t... | 07/10/2007 |
| 7157152 | Copper-tin-oxygen alloy plating The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellen... | 01/02/2007 |
| 7145243 | Photo-thermal induced diffusion Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, s... | 12/05/2006 |
| 7087919 | Layered resistance variable memory device and method of fabrication The invention is related to methods and apparatus for providing a resistance variable memory element with improved data retention and switching characteristics. According to one embodiment of the invention, a resistance variable memory element is provided having at ... | 08/08/2006 |
| 6956174 | Tip structures An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having fi... | 10/18/2005 |
| 6905782 | Tarnish deterring tin coating The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer compr... | 06/14/2005 |
| 6686041 | Coloring master pellet for optical molded article and colored optical disk substrate Coloring master pellets for an optical molded article which are formed from a coloring composition, comprising a transparent thermoplastic resin (component A) containing a colorant (component B), wherein the proportion of pellets having colorant concentra... | 02/03/2004 |
| 6541127 | Swash plate of swash plate type compressor In order to improve the wear resistance of the swash plate of a swash-plate type compressor, on which plate copper alloy is flame-sprayed, a composite material, which consists of copper or first copper alloy (for example Cu--Pb alloy) including at least u... | 04/01/2003 |
| 6492036 | Porous electrode wire for use in electrical discharge machining and method of manufacturing the same The present invention relates to a porous electrode wire for use in electrical discharge machining and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which results fr... | 12/10/2002 |
| 6482535 | Porous electrode wire for use in electrical discharge machining and method of manufacturing the same The present invention relates to a porous electrode wire for use in electrical discharge machining device and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which res... | 11/19/2002 |
| 6326685 | Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite s... | 12/04/2001 |
| 6322898 | Inorganic conversion coatings for ferrous substrates The formation of passivation coatings on ferrous substrates is disclosed by heating the substrate in an aqueous 1.0 to 6.0 M basic metal hydroxide treatment bath containing SiO2 and a water-soluble glycol, at a temperature that is effective to ... | 11/27/2001 |
| 6316128 | High strength clad material having excellent moldability A three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, wherein t... | 11/13/2001 |
| 6309762 | Replaceable wear resistant surfaces An article of manufacture having a wear-resistant cylindrical surface is made up of a metallurgically tough base steel with a substantially cylindrical surface, a thin, cylindrical metal sleeve mated to and affixed to the cylindrical surface of the base s... | 10/30/2001 |
| 6309759 | Sliding bearing and its production method A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction int... | 10/30/2001 |
| 6306523 | Method of manufacturing porous electrode wire for electric discharge machining and structure of the electrode wire The present invention relates to a porous electrode wire for use in electrical discharge machining and the method of manufacturing the same. The wire improves the machining speed at least 15% compared with a conventional zinc coated wire, which results fr... | 10/23/2001 |
| 6265085 | Bonding material and bump The bonding material for an electronic component comprises a metal material and fine resin particles dispersed in the metal material. Such a material may form an electrical "bump" for the component.... | 07/24/2001 |
| 6203931 | Lead frame material and process for manufacturing the same The present invention provides a lead frame material and a process for manufacturing a lead frame material. The process includes forming an intermediate layer on a lead frame substrate by vacuum deposition and forming a top protective layer on the interme... | 03/20/2001 |
| 6197435 | Substrate An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the... | 03/06/2001 |
| 6139979 | Lead-free solder and soldered article A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the... | 10/31/2000 |
| 6136460 | Tin coatings incorporating selected elemental additions to reduce discoloration A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing ti... | 10/24/2000 |
| 6126992 | Optical articles comprising isosorbide polyesters and method for making same An optical article made of a transparent polymer which includes terephthaloyl moieties, optionally, other aromatic diacid moieties; ethylene glycol moieties; isosorbide moieties; and, optionally, one or more other diol moieties, wherein the polymer has an... | 10/03/2000 |
| 6117565 | Babbitted bearing having an improved bonding layer and a method of depositing same A babbitted bearing is disclosed. The babbitted bearing includes a bearing backing and a layer of iron electroplated to the backing. A layer of babbitt material is bonded to the layer of electroplated iron. The electroplated layer provides a favorable bon... | 09/12/2000 |
| 6103395 | Composite multilayer bearing material A laminated composite material, and a method of improving the surface hardness of laminated composite materials, wherein selected regions of the carrier material of the laminated composite system are treated with high-energy beams, and the temperature con... | 08/15/2000 |
| 6083633 | Multi-layer diffusion barrier for a tin coated electrical connector An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barr... | 07/04/2000 |
| 6060179 | Cu-Pb alloy bearing and producing method therefor Disclosed is a Cu--Pb alloy bearing and a producing method thereof. The Cu--Pb alloy bearing consists of a backing metal layer and a Cu--Pb bearing alloy layer which is bonded to the backing metal layer and whose matrix contains dispersed Pb-phase grains.... | 05/09/2000 |
| 6042919 | Structurally stable optical data storage medium An improved optical data storage medium and a method of forming and utilizing such a medium. One such optical data storage medium has a substrate having an upper surface including a series of physical deformations which encode data. A reflective film stac... | 03/28/2000 |
| 6025081 | Copper-based bearing material and sliding bearing for internal combustion engines The copper-based sliding material has improved seizure resistance, even if it is free of Pb, and enables thinning of the overlay. The copper alloy provided consists of from 0.1 to 2% of Ag, from 1 to 10% of Sn, and the balance consisting of Cu and unavoid... | 02/15/2000 |
| 6013381 | Fluorinated fluxless soldering A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder ... | 01/11/2000 |
| 6013382 | Apparatus and method for inhibiting the leaching of lead in water A copper alloy plumbing fixture containing interdispersed lead particles coated non-continuously on a water contact surface to resist the leaching of lead into potable water systems. The leach resistant fixture is prepared by immersing conventional copper... | 01/11/2000 |
| 5972526 | Decorative member A white decorative member comprising: a substrate; a primary plate layer having a thickness of at least 1 μm and covering the substrate, which is composed of Cu (alloy); an Sn--Cu--Pd alloy plate layer having a thickness of at least 0.2 μm and covering ... | 10/26/1999 |
| 5837356 | Wiring board and method for manufacturing the same A wiring board constructed of an integral combination of an insulating substrate including 60-95% by weight of a powder of an inorganic insulating material and 5-40% by weight of a thermosetting resin which joins the particles of the powder of an inorgani... | 11/17/1998 |
| 5629098 | Epoxy adhesives and copper foils and copper clad laminates using same This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula R--(G)n... | 05/13/1997 |
| 5532070 | Solder-precoated conductor circuit substrate and method of producing the same It is to establish a solder precoated conductor circuit substrate capable of conducting the fine pitch mounting and being excellent in the productivity and a technique of producing the same. In the solder precoated conductor circuit substrate, the solder ... | 07/02/1996 |
| 5525433 | Epoxy adhesives and copper foils and copper clad laminates using same This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formula R--(G)n... | 06/11/1996 |
| 5296300 | Method treating terne steel A method of treating a terne coating to accelerate the patina on the terne coating. The terne coated metal is coated with a specially formulated asphalt based paint which produces a semi-transparent or translucent, dull finish on the terne coated metal. T... | 03/22/1994 |
| 5102456 | Tetra aza ligand systems as complexing agents for electroless deposition of copper An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable... | 04/07/1992 |
| 5069979 | Plated copper alloy material Plated copper alloy material with an undercoat plating and an overcoat plating on the copper alloy, wherein the undercoat plating consists essentially of 0.03% to 5% by weight of zinc (Zn) and the remainder of copper (Cu) in the substantial part thereof, ... | 12/03/1991 |
| 5045405 | Sliding surface bearing for high loads In a sliding surface bearing for high loads, comprising a sliding layer (2), which has physically been applied in a vacuum directly to a bearing metal layer (1) and consists of a base material with finely divided inclusions (6), which are substantially in... | 09/03/1991 |
| 5045410 | Low phosphorus containing band-shaped and/or filamentary material A band-shaped and/or filamentary material, having a phosphorus containing metal and/or metal alloy inner layer such as phosphor bronze, deoxidized copper or other similar phosphorus containing material, and a lead alloy outer layer, particularly a lead-ti... | 09/03/1991 |
