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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 7368046 | Layered composite material for plain bearings, production and use thereof The invention is a method for the production of a composite multilayer material having a backing layer, a bearing metal layer of a copper alloy or an aluminum alloy, a nickel intermediate layer and an overlay consisting of about 0-20 wt. % copper and about 0-20 wt. ... | 05/06/2008 |
| 7309920 | Chip structure and process for forming the same A chip or wafer comprises a semiconductor substrate, first and second transistors on the semiconductor substrate, first and second metal layers over the semiconductor substrate, an insulating layer on the first and second metal layers, a third and fourth metal layer... | 12/18/2007 |
| 7229699 | Bearing having embedded hard particle layer and overlay and method of manufacture A multilayer sliding bearing includes a rigid metal backing having a metal bearing liner attached thereto. The metal bearing liner includes a metal bearing liner layer which is attached to the bearing surface of the metal backing layer and at least one metal overpla... | 06/12/2007 |
| 7078110 | Slide bearing A slide bearing is described with a bearing metal layer on copper basis as applied to a carrier and a running layer made of an alloy of aluminum and tin which is applied physically onto the bearing metal layer in vacuum. In order to combine favorable resistance agai... | 07/18/2006 |
| 7074496 | Multilayer aluminum-base alloy slide member A multilayer aluminum-base alloy bearing formed by bonding a bearing alloy layer made of an aluminum-base alloy to a steel back metal through an intermediate layer made of an aluminum-base alloy, the intermediate layer being composed of two layers, that is, a lower ... | 07/11/2006 |
| 7070088 | Method of semiconductor device assembly including fatigue-resistant ternary solder alloy Method for assembling a semiconductor device having fatigue-resistant interconnection fillet provides a semiconductor chip with at least one solder bump comprising an alloy of tin and lead with a melting temperature higher than the solder paste used. Further, a sold... | 07/04/2006 |
| 7019394 | Circuit package and method of plating the same A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to ... | 03/28/2006 |
| 6872252 | Lead-based perovskite buffer for forming indium phosphide on silicon A method of forming a high quality epitaxial indium phosphide layer on a silicon substrate and a semiconductor device formed by the same method are described. In one aspect, a lead-based perovskite buffer is formed on a silicon substrate, and an epitaxial indium pho... | 03/29/2005 |
| 6803116 | Method of bonding a conductive adhesive and an electrode, and a bonded electrode obtained thereby The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive fill... | 10/12/2004 |
| 6760396 | Coated metal articles and method of making The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and ... | 07/06/2004 |
| 6635123 | Copper preservative treatment A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly u... | 10/21/2003 |
| 6579647 | Tin-clad substrates for use as current collectors, batteries comprised thereof and methods for preparing same The present invention provides a current collector for a battery which comprises a lead or lead alloy substrate and a thin cladding of tin, batteries utilizing such a current collector and methods for manufacturing such batteries. Preferably the tin cladd... | 06/17/2003 |
| 6541127 | Swash plate of swash plate type compressor In order to improve the wear resistance of the swash plate of a swash-plate type compressor, on which plate copper alloy is flame-sprayed, a composite material, which consists of copper or first copper alloy (for example Cu--Pb alloy) including at least u... | 04/01/2003 |
| 6309759 | Sliding bearing and its production method A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction int... | 10/30/2001 |
| 6265085 | Bonding material and bump The bonding material for an electronic component comprises a metal material and fine resin particles dispersed in the metal material. Such a material may form an electrical "bump" for the component.... | 07/24/2001 |
| 6221503 | Electrode modification using an unzippable polymer paste A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated ci... | 04/24/2001 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer rat... | 04/03/2001 |
| 6203929 | Gold plated solder material and method of fluxless soldering using solder A solder material 10 suitable for fluxless soldering attachment of a component 12 to a substrate 14 in a microelectronic assembly 16 such as a hybrid package comprises a core 18 and a gold layer 20 on the core. The core can comprise an alloy of tin and le... | 03/20/2001 |
| 6197435 | Substrate An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the... | 03/06/2001 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has ... | 12/12/2000 |
| 6136460 | Tin coatings incorporating selected elemental additions to reduce discoloration A method of introducing an anti-tarnish agent into the matrix of a tin coating to reduce oxidation and/or yellowing of the tin coating. The agent is preferably zinc, indium or phosphorous and can be deposited in a molten form to alloy with the existing ti... | 10/24/2000 |
| 6095404 | Method for assembling high temperature electronics A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The s... | 08/01/2000 |
| 6037065 | Spheres useful in a detachable connective medium for ball grid array assemblies A connective medium is provided for use in ball grid assemblies for detachable connections between electronic devices and circuit boards. The medium includes novel, discrete spheres defining an inner metallic, spherical core and one or more outer, electri... | 03/14/2000 |
| 6013381 | Fluorinated fluxless soldering A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder ... | 01/11/2000 |
| 5972526 | Decorative member A white decorative member comprising: a substrate; a primary plate layer having a thickness of at least 1 μm and covering the substrate, which is composed of Cu (alloy); an Sn--Cu--Pd alloy plate layer having a thickness of at least 0.2 μm and covering ... | 10/26/1999 |
| 5901901 | Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly In a semiconductor assembly with a solder material layer and a method for soldering the semiconductor assembly, a silicon semiconductor body with a diffusion barrier layer is provided with a solder material layer, preferably a tin layer. The semiconductor... | 05/11/1999 |
| 5856028 | Process for producing a metal-coated, metallized component of aluminum nitride ceramic and metal-coated component obtained thereby A component of aluminum nitride metallized with a metallizing paste containing: (i) a pulverulent glass of the MnO--Al2 O3 --SiO2 system as an adhesion promotor having a mean particle size of 2-15 μm; (ii) a refractory me... | 01/05/1999 |
| 5840391 | Decorative glass sheet with simulated beveled pane and method for forming the same A decorative glass sheet simulating a multi-pane, camed window or door, and a method for forming the same. The decorative glass sheet includes a glass panel having an outer surface. At least one groove is formed through the outer surface and into the glas... | 11/24/1998 |
| 5770323 | Bearings Bearings are described having composite overlay coatings. The composite overlay coating comprises an electro co-deposited soft metallic matrix having incorporated therein from 0.05 to 2 wt % of a hard metal oxide, said material exhibiting a Vickers hardne... | 06/23/1998 |
| 5629098 | Epoxy adhesives and copper foils and copper clad laminates using same This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula R--(G)n... | 05/13/1997 |
| 5593790 | Interference super-resolution using two magnetic layer construction A magneto-optic recording medium having two magneto-optic layers exchange-coupled to each other. The Curie temperature, TC1, of the first layer is less than that of the second layer, TC2. The magneto-optic effect is large for tempera... | 01/14/1997 |
| 5532070 | Solder-precoated conductor circuit substrate and method of producing the same It is to establish a solder precoated conductor circuit substrate capable of conducting the fine pitch mounting and being excellent in the productivity and a technique of producing the same. In the solder precoated conductor circuit substrate, the solder ... | 07/02/1996 |
| 5525433 | Epoxy adhesives and copper foils and copper clad laminates using same This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formula R--(G)n... | 06/11/1996 |
| 5476726 | Circuit board with metal layer for solder bonding and electronic circuit device employing the same A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal ... | 12/19/1995 |
| 5434012 | Multilayer slide bearing and bearing assembly A slide bearing which is preferably used in combination with a low-rigid aluminum alloy housing. The slide bearing has a high coefficient of thermal expansion so that it can satisfactorily follow up deformation of the housing, and the bearing also has an ... | 07/18/1995 |
| 5432013 | Sliding bearing for light alloy housing A sliding bearing has a back metal made of a copper alloy which has a high followability with respect to deformation of a light alloy housing, and with this construction, the sliding bearing is excellent in fretting resistance and migration resistance. Th... | 07/11/1995 |
| 5384205 | Multi-layer slide bearing having Al-Sn alloy layer with high fatigue strength and conformability A multi-layer bearing having an Al--Sn bearing alloy layer which has high fatigue strength and good conformability with a mating member further comprising a backing steel plate and an intermediate bonding layer of another aluminum alloy. The Al--Sn alloy ... | 01/24/1995 |
| 5362574 | Multilayer aluminum-based alloy bearing having superior compatibility and superior fatigue resistance A multilayer aluminum-based alloy plain bearing having superior compatibility and superior fatigue resistance, comprising a steel back metal, an aluminum alloy intermediate bonding layer bonded to the steel back metal, and an Al--Sn--Si family bearing all... | 11/08/1994 |
| 5300368 | Highly wear-resistant overlay with improved slip and a method of its production Highly wear-resistant sliding bearings with good sliding properties are difficult to manufacture by electrochemical deposition of the sliding alloy, because the corresponding electrolyte solutions are unstable. Conventional sliding alloys are also too har... | 04/05/1994 |
| 5223347 | Creep resistant composite alloys A fabrication method of strengthening metallic alloys by composite technology has been developed by mixing steel shots or aggregates with conventional alloys, thus preventing cold flow or creep. Preventing creep is advantageous in thermal plugs which must... | 06/29/1993 |
