Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
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| Number | Title | Issue Date |
| 7455915 | Selective application of conductive material to substrates by pick and place of compliant contact arrays Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material layers. Padstacks may include a first conductive top layer, one or more un... | 11/25/2008 |
| 7223481 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a ... | 05/29/2007 |
| 7175920 | Copper foil for high-density ultra-fine printed wiring board The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 02/13/2007 |
| 7134197 | Plastic lead frames utilizing reel-to-reel processing Reel-to-reel manufacturing methods and systems are disclosed herein. In general, one or more plastic parts (e.g., plastic substrate) can be transported on a carrier for manufacturing of a final product based initially on the part or substrate. A reel-to-reel mechani... | 11/14/2006 |
| 7026059 | Copper foil for high-density ultrafine printed wiring boad The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electr... | 04/11/2006 |
| 7005195 | Metallic-based adhesion materials A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity ... | 02/28/2006 |
| 6994918 | Selective application of conductive material to circuit boards by pick and place A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a fi... | 02/07/2006 |
| 6984456 | Flexible printed wiring board for chip-on flexibles There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wirin... | 01/10/2006 |
| 6924043 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the n... | 08/02/2005 |
| 6919137 | High-strength solder joint A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a... | 07/19/2005 |
| 6805964 | Protective coatings for improved tarnish resistance in metal foils In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal shee... | 10/19/2004 |
| 6746785 | Device for setting a defined electric potential on a ferrite core of an inductive component and/or for reducing damping of the inductive component by losses induced by its magnetic field A metal layer is bonded to the ferrite core of an inductive component. A defined electric potential is thereby set for the ferrite core of an inductive component and/or the damping of the inductive component is reduced which is caused by losses induced from its magn... | 06/08/2004 |
| 6737153 | Circuit board and method for manufacturing the same, and electronic apparatus comprising it A circuit board comprising a composite resin and a metal plate, the metal plate forming circuit patterns. The composite resin comprises 70-95 parts by weight of inorganic filler, and 5-30 parts by weight of a resin composition including a thermosetting resin and a h... | 05/18/2004 |
| 6645606 | Electrical device having metal pad bonded with metal wiring and manufacturing method thereof A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the ... | 11/11/2003 |
| 6605369 | Surface-treated copper foil and method for producing the same The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substr... | 08/12/2003 |
| 6579591 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an ... | 06/17/2003 |
| 6537675 | Protective coatings for improved tarnish resistance in metal foils In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a... | 03/25/2003 |
| 6485843 | Apparatus and method for mounting BGA devices A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printe... | 11/26/2002 |
| 6475629 | Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosett... | 11/05/2002 |
| 6455177 | Stabilization of GMR devices A stabilized GMR device includes a GMR stack having a first and a second edge. Stabilization means are positioned adjacent to the first and the second edge of the GMR stack for stabilizing the GMR stack. The GMR stack includes a first layer of ferromagnet... | 09/24/2002 |
| 6329072 | Microporous copper film and electroless copper plating solution for obtaining the same A printed circuit board comprising a metal copper film having 105 to 109 micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a ... | 12/11/2001 |
| 6329074 | Copper foil for printed wiring board having excellent chemical resistance and heat resistance This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a sub... | 12/11/2001 |
| 6326685 | Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite s... | 12/04/2001 |
| 6218030 | Soldered product A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected p... | 04/17/2001 |
| 6171714 | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat la... | 01/09/2001 |
| 6153320 | Magnetic devices with laminated ferromagnetic structures formed with improved antiferromagnetically coupling films A magnetic device uses laminated ferromagnetic layers containing antiferromagnetically coupled ferromagnetic films coupled together with improved antiferromagnetically coupling (AFC) films. The AFC films are formed of the binary and ternary alloys compris... | 11/28/2000 |
| 6114048 | Functionally graded metal substrates and process for making same The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional inse... | 09/05/2000 |
| 5895533 | Beryllium-copper bonding material For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy t... | 04/20/1999 |
| 5627079 | Refunctionalized oxyfluorinated surfaces Permanently substituted oxyfluorinated surfaces can be formed on non-fluorinated substrates having a fluorinated surface or fluorocarbon coating applied by gas phase surface fluorination or plasma deposition. The oxyfluorinated surfaces can be refunctiona... | 05/06/1997 |
| 5573860 | Bimetal It is an object of the present invention to provide a bimetal having a same or wider proportional temperature range than a bimetal using a 42 wt % Ni--Fe alloy as a low thermal expansion alloy, and a higher bending characteristic of a large bending coeffi... | 11/12/1996 |
| 5562973 | Ceramic multi-layer wiring board In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multi-layer is a non-copper metal having a melting point higher than a temperature at which the ceramic multi-layer i... | 10/08/1996 |
| 5441818 | Electro-deposition coated member, process for producing electro-deposition coated member, and electro-deposition coating use therefor An electro-deposition coated member comprises a substrate having thereon an electro-deposition coating film. The electro-deposition film contains a powder comprising a ceramic powder having an average particle diameter of from 0.1 to 5 μm, the particle s... | 08/15/1995 |
| 5439732 | Ceramic multi-layer wiring board In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is ... | 08/08/1995 |
| 5257733 | Process for thermodynamically treating a region joining two members and product thereof This invention relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified b... | 11/02/1993 |
| 5151308 | High density thermal spray coating A high density, substantially oxide-free metal layer is deposited by spray deposition on a substrate in an atmosphere containing ambient air having an oxygen content above about 0.1% by weight. This is accomplished by directing a supersonic-velocity jet s... | 09/29/1992 |
| 5145733 | Electro-deposition coated member An electro-deposition coated member has a metal substrate or a non-metal substrate having been subjected to metal plating, a chemically colored film provided on said substrate, and a conductive electro-deposition coating film formed on said chemically col... | 09/08/1992 |
| 4808246 | Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production A composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has... | 02/28/1989 |
| 4795670 | Multilayer ceramic substrate with circuit patterns A multilayer ceramic substrate with multilayered circuit patterns, the improvement in which internal conductors for wiring are formed by a Ag base conductive materials capable of being co-fired with multilayered green ceramic substrate sheets in an oxidiz... | 01/03/1989 |
| 4740666 | Electrical discharge machining electrode An improved electrical discharge machining electrode permitting improved cutting action to be achieved at the same level of electrical power being applied to the wire electrode. Such improvement is attributable to a particular configuration and the materi... | 04/26/1988 |
| 4637962 | Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production An article in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory ... | 01/20/1987 |
