Quotables
"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8420225 | Metallic laminate composite A metallic laminate composite having a first alloy layer having a low coefficient of thermal expansion, and a second alloy layer having a higher coefficient of thermal expansion. Additional and optional layers may be included in the laminate composite. ... | 04/16/2013 |
| 7358152 | Wafer bonding of thinned electronic materials and circuits to high performance substrate A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to... | 04/15/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7273667 | Longitudinal multi-layer magnetic recording medium A magnetic recording medium capable of attaining high in-plane recording density of 100 Mbits or more per 1 mm2 is provided. Magnetic recording medium is provided in which underlayers, a first magnetic layer, a first intermediate layer, a second magnetic ... | 09/25/2007 |
| 7241641 | Attachment of integrated circuit structures and other substrates to substrates with vias Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads... | 07/10/2007 |
| 7208343 | Semiconductor chip, chip stack package and manufacturing method A semiconductor chip with conductive wiring that is routed to the edge of the substrate from the chip's backside. A plurality of such semiconductor chips are stacked and electrically connected using a wiring element that is a circuit board or conductive adhesive str... | 04/24/2007 |
| 7201827 | Process and structure to fabricate spin valve heads for ultra-high recording density application A method for forming a bottom spin-valve GMR sensor having ultra-thin layers of high density and smoothness and possessing oxygen surfactant layers as a result of the layers being sputtered in a mixture of Ar and O2. A particularly novel feature of the me... | 04/10/2007 |
| 7157161 | CrB and CrMoB as third underlayer to refine grains The Hr and SNR of a magnetic recording medium are increased and the signal pulse narrowed by employing a tri-layer underlayer structure containing Cr or a Cr alloy wherein the second underlayer contains Cr and B, the first underlayer preferably contains substantiall... | 01/02/2007 |
| 7138195 | Perpendicular magnetic recording media and magnetic storage A double layer perpendicular magnetic recording medium having a high medium S/N ratio at a recording density of 50 Gb/in2 or higher and a magnetic storage apparatus with a lower error rate and excellent reliability are provided. In a perpendicular magneti... | 11/21/2006 |
| 7102524 | Die frame apparatus and method of transferring dies therewith A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. A ring shaped groove is formed in a first surface of a wafer around a plurality of dies. The wafer is scribed to form a grid of grooves in the firs... | 09/05/2006 |
| 7098518 | Die-level opto-electronic device and method of making same In one embodiment of the invention, a die-level opto-electronic device comprises a semiconductor die having edges and a photonic device exposed on a first surface. The device includes a conductive structure formed in the die and away from the edges of the die, the c... | 08/29/2006 |
| 7064002 | Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the interposer or other substrate. The interposer may be positioned at le... | 06/20/2006 |
| 7064005 | Semiconductor apparatus and method of manufacturing same A semiconductor apparatus that allow miniaturization of a multichip module using an interposer substrate and a method of manufacturing the same are provided. It is configured that an embedded electrode (4) penetrating through an interposer substrate (1... | 06/20/2006 |
| 7060376 | Amorphous soft underlayers for perpendicular recording media A perpendicular magnetic recording medium having a substrate, an amorphous soft underlayer and a magnetic layer for perpendicular recording has reduced DC noise and surface roughness, which reduces the head-to-media spacing and the head-to-amorphous soft underlayer ... | 06/13/2006 |
| 7034401 | Packaging substrates for integrated circuits and soldering methods A packaging substrate (310) includes a semiconductor interposer (120) and at least one other intermediate substrate (110), e.g. a BT substrate. The semiconductor interposer has first contact pads (136C) attachable to dies (124) abo... | 04/25/2006 |
| 7029937 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A depression is formed from a first surface of a semiconductor substrate. An insulating layer is provided on the bottom surface and an inner wall surface of the depression. A conductive portion is provided inside the insulating layer. A second surface of the semicon... | 04/18/2006 |
| 7026223 | Hermetic electric component package An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/ou... | 04/11/2006 |
| 7023347 | Method and system for forming a die frame and for transferring dies therewith A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is... | 04/04/2006 |
| 7005195 | Metallic-based adhesion materials A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity ... | 02/28/2006 |
| 7001825 | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and a plurality of conductive layers in the opening. In some embodiments,... | 02/21/2006 |
| 6994918 | Selective application of conductive material to circuit boards by pick and place A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a fi... | 02/07/2006 |
| 6962867 | Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. Th... | 11/08/2005 |
| 6958285 | Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings In some embodiments, a fabrication method comprises: forming a structure that has one or more substrates, wherein the one or more substrates are either a single substrate or a plurality of substrates bonded together, wherein the structure comprises a non-electronica... | 10/25/2005 |
| 6924048 | Magnetic recording medium and a magnetic storage apparatus A magnetic storage device has a magnetic layer, the magnetic crystal grains of which are separated by a nonmagnetic phase. The typical crystal grain is in the approximate shape of a sphere or an ellipsoid. The thickness of the magnetic crystal grains, which is in th... | 08/02/2005 |
| 6919137 | High-strength solder joint A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a... | 07/19/2005 |
| 6916725 | Method for manufacturing semiconductor device, and method for manufacturing semiconductor module To form through electrodes effectively without deteriorating the quality of the through electrodes, a semiconductor substrate is spin etched at its back surface, thereby thinning down the semiconductor substrate, making opening sections penetrate the semiconductor s... | 07/12/2005 |
| 6805964 | Protective coatings for improved tarnish resistance in metal foils In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal shee... | 10/19/2004 |
| 6773535 | Article and method for controlled debonding of elements using shape memory alloy actuators A separable bonding system including two opposed rigid adherends and a deformed shape memory alloy element disposed between and adhesively bonded to facing surfaces of the two rigid adherends. A method of adhesively bonding and selectively debonding and separating a... | 08/10/2004 |
| 6746785 | Device for setting a defined electric potential on a ferrite core of an inductive component and/or for reducing damping of the inductive component by losses induced by its magnetic field A metal layer is bonded to the ferrite core of an inductive component. A defined electric potential is thereby set for the ferrite core of an inductive component and/or the damping of the inductive component is reduced which is caused by losses induced from its magn... | 06/08/2004 |
| 6673469 | Arrangement for decreasing galvanic corrosion between metal components Arrangement (1) for decreasing galvanic corrosion between metal components that includes at least a first component (2) in which a first metal is a part, and at least a second component (3) in which a second metal is a part, whereby the first metal has a ... | 01/06/2004 |
| 6537675 | Protective coatings for improved tarnish resistance in metal foils In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a... | 03/25/2003 |
| 6485843 | Apparatus and method for mounting BGA devices A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printe... | 11/26/2002 |
| 6455177 | Stabilization of GMR devices A stabilized GMR device includes a GMR stack having a first and a second edge. Stabilization means are positioned adjacent to the first and the second edge of the GMR stack for stabilizing the GMR stack. The GMR stack includes a first layer of ferromagnet... | 09/24/2002 |
| 6322903 | Package of integrated circuits and vertical integration A first level packaging wafer is made of a semiconductor or insulating material. The bumps on the wafer are made using vertical integration technology, without solder or electroplating. More particularly, vias are etched part way into a first surface of t... | 11/27/2001 |
| 6255006 | Magnetic recording medium A magnetic recording medium comprising a non-magnetic substrate having thereon a non-magnetic undercoat, a magnetic film and optionally a protective film. The magnetic film comprises a material containing Co as a main component. The non-magnetic undercoat... | 07/03/2001 |
| 6245444 | Micromachined element and method of fabrication thereof A micromachined element mounted to a substrate, the element including a cantilever having a proximal portion attached to the substrate and a coilable distal portion terminating in a free distal end. The coilable distal portion, upon being heated, is capab... | 06/12/2001 |
| 6221508 | Magnetic recording media In a magnetic storage apparatus having a magnetic recording medium, a drive unit for driving this medium in a prespecified recording direction, a magnetic head assembly including a recorder section and reproduction section, means for causing the magnetic ... | 04/24/2001 |
| 6153320 | Magnetic devices with laminated ferromagnetic structures formed with improved antiferromagnetically coupling films A magnetic device uses laminated ferromagnetic layers containing antiferromagnetically coupled ferromagnetic films coupled together with improved antiferromagnetically coupling (AFC) films. The AFC films are formed of the binary and ternary alloys compris... | 11/28/2000 |
| 6090496 | Magnetic recording medium and non-magnetic alloy film A magnetic recording medium having sufficiently low noise and high coercive force suitable for use with a MR head. The magnetic recording medium comprises a non-magnetic substrate 1, a non-magnetic underlayer 2, a magnetic layer 3 and a protective layer 4... | 07/18/2000 |
| 5981091 | Article including thermal barrier coated superalloy substrate A ceramic thermal barrier coating layer for a superalloy article is caused to adhere to the superalloy article by applying platinum to the superalloy article and heat treating at a temperature of 1100° C. to 1200° C. for one hour. This causes aluminum t... | 11/09/1999 |
