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Class 428/616 - Deflectable by temperature change (e.g., thermostat element)


Subclass of Class 428 - Stock material or miscellaneous articles
Definition: Subject matter having the property of bending or lengthening
No. of patents: 45
Last issue date: 04/22/2008


1    
NumberTitleIssue Date
7360416Non-contact condensation detecting apparatus
A disclosed detector element includes a substrate including a void, a heating unit including a heat generating electrode bridged across the void, and a temperature sensor including a temperature sensor electrode provided above the void. The heat generating electrode...
04/22/2008
7335426High strength vacuum deposited nitinol alloy films and method of making same
A vacuum deposition method for fabricating high-strength nitinol films by sputter depositing nickel and titanium from a heated sputtering target, and controlling the sputter deposition process parameters in order to create high-strength nitinol films that exhibit sh...
02/26/2008
7303815Functional bimorph composite nanotapes and methods of fabrication
A two-layer nanotape that includes a nanoribbon substrate and an oxide that is epitaxially deposited on a flat surface of the nanoribbon substrate is described. The oxide is deposited on the substrate using a pulsed laser ablation deposition process. The nanoribbons...
12/04/2007
7217580Method for processing an integrated circuit
Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is deposited into the carrier which holds the singulated die. The singulated ...
05/15/2007
7160121Stressed metal contact with enhanced lateral compliance
An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region o...
01/09/2007
7161232Apparatus and method for miniature semiconductor packages
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th...
01/09/2007
7151057Flexible MEMS transducer manufacturing method
A method for manufacturing a flexible MEMS transducer includes forming a sacrificial layer on a flexible substrate, sequentially depositing a membrane layer, a lower electrode layer, an active layer, and an upper electrode layer on the sacrificial layer by PECVD, se...
12/19/2006
7119362Method of manufacturing semiconductor apparatus
In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by...
10/10/2006
7100447Super Invar magnetic return path for high performance accelerometers
A force rebalance accelerometer (20) includes a silicon dioxide-based proof mass (28) having capacitive elements (40) engaged with excitation rings (61) made from alloys of Super Invar. The magnet assembly includes an excitation ring, a m...
09/05/2006
7052473Body insert configuring device having tip portion with expandable joints
A device for configuring a body insert, such as an electrode lead for a stimulation device, has a wire arrangement adapted to be inserted into the interior of the body insert for stiffening and bending the body insert. The wire arrangement has a tip section which, w...
05/30/2006
7005195Metallic-based adhesion materials
A material and method for adhering at least two materials that includes the step of interposing at least one intermediate layer between the two materials and associated adhesion material. The materials to be adhered exhibit at least one characteristic dissimilarity ...
02/28/2006
7000315Method of making photolithographically-patterned out-of-plane coil structures
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coi...
02/21/2006
6947291Photolithographically-patterned out-of-plane coil structures and method of making
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coi...
09/20/2005
6881904Heat-Shrinkable EMI/RFI shielding material
The present invention relates to a material for shielding electromagnetic interference (EMI) and radio frequency interference (RFI) between a, electrical conductor or bundle of conductors and the environment. The material comprises a heat-shrinkable woven fabric coa...
04/19/2005
6835397Controlled release encapsulated bioactive substances
The present invention is an encapsulated yeast composite comprising a core comprising yeast and a coating containing an emulsifiable lipid. The yeast includes Saccharomyces cerevisiae. The invention also relates to other encapsulated bioactive substance compo...
12/28/2004
6813153Polymer solder hybrid
A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy havi...
11/02/2004
6532805Micro-material testing apparatus
An atomic force microscope including a cantilever, a transferring device and a displacement detecting device is used for conducting a material test of a test member based on a load amount and a displacement amount. The test member may be fixed to the cant...
03/18/2003
6528179Reduction of chip carrier flexing during thermal cycling
A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ri...
03/04/2003
6511759Means and method for producing multi-element laminar structures
The instant invention provides a means and method for producing multi-laminar elements, said elements being suitable for operation in high temperature, atmospheric or vacuum environments such as those which may be required when processing materials such a...
01/28/2003
6326685Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix
A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite s...
12/04/2001
6245444Micromachined element and method of fabrication thereof
A micromachined element mounted to a substrate, the element including a cantilever having a proximal portion attached to the substrate and a coilable distal portion terminating in a free distal end. The coilable distal portion, upon being heated, is capab...
06/12/2001
6003778Automotive oil level control apparatus
An oil level control valve (10) has a molded base (12) having an oil receiving aperture (12d) formed through a bottom wall (12e) with a circumscribing generally rectangular cover plate seat in which a cover plate (14) is removably received. A thermostatic...
12/21/1999
5573860Bimetal
It is an object of the present invention to provide a bimetal having a same or wider proportional temperature range than a bimetal using a 42 wt % Ni--Fe alloy as a low thermal expansion alloy, and a higher bending characteristic of a large bending coeffi...
11/12/1996
5538795Ignitable heterogeneous stratified structure for the propagation of an internal exothermic chemical reaction along an expanding wavefront and method of making same
A multilayer structure has a selectable, (i) propagating reaction front velocity V, (ii) reaction initiation temperature attained by application of external energy and (iii) amount of energy delivered by a reaction of alternating unreacted layers of the m...
07/23/1996
5151308High density thermal spray coating
A high density, substantially oxide-free metal layer is deposited by spray deposition on a substrate in an atmosphere containing ambient air having an oxygen content above about 0.1% by weight. This is accomplished by directing a supersonic-velocity jet s...
09/29/1992
4850715Dual material test specimen
A test specimen is provided, that is constructed of dual materials, which are preferably metallic materials and which are more preferably an austenitic iron alloy and a ferritic iron alloy. The specimen is generally constructed as a rectangular configurat...
07/25/1989
4808246Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production
A composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has...
02/28/1989
4694558Bimetal thermostats and method of manufacture
Ferrous bimetals bearing easily read indicia and methods of making them. The bimetals of the present invention have a transparent oxide coating of a controlled thickness in the interference range and are prepared by immersing them in a acid bath, then was...
09/22/1987
4645120Thermostatic metal
A thermostatic metal comprises a layer of a low expansion metal bonded to a layer of a high expansion metal, the outer surface of one of the layers comprising a layer of similar composition but containing, in addition, a grain growth limiting additive....
02/24/1987
4637962Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production
An article in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties is produced by joining of at least two parts consisting of a total of at least one shape memory alloy having a two-way effect, whereby each part has a memory ...
01/20/1987
4569692Low thermal expansivity and high thermal conductivity substrate
A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20×10-7 to about 50×10-7 ...
02/11/1986
4518444Material which is at least partially made from a constituent having a one-way shape memory effect and process to produce said material
Material, in the form of bars, tubes, profiles, wires, sheets, or bands, which is, at least partially, composed of a constituent showing a one-way shape memory effect, and a further inactive constituent hindering the one-way effect of the first, and which...
05/21/1985
4480013Substrate for use in semiconductor apparatus
The invention relates to semiconductor chip mounting substrate for use in semiconductor apparatus, wherein metal material or multi-laminated metal material is coated on its surface and/or lateral faces with thin film of insulated inorganic matter in order...
10/30/1984
4414286Composite thermostat metal
A composite thermostat metal having layers of metal of relatively high and relatively low coefficients of thermal expansion metallurgically bonded together has a relatively thin, corrosion-resistant layer of an austenitic stainless steel metallurgically b...
11/08/1983
4357694Thermally responsive bimetallic jewelry
Thermally expansive jewelry as bracelets, rings, wristwatch bands and the like are characterized by formation of the entirety or a component part thereof of an arcuate length of bimetallic strip, thereby to increase and decrease the effective diameter or ...
11/02/1982
4291105Bimetallic strip for low temperature use
There is provided a class of mechanically pre-stressed structures, suitably bi-layer strips comprising a layer of group 5 transition metals in intimate contact with a layer of an intermetallic compound of said transition metals with certain group 3A, 4A o...
09/22/1981
4239264Thermal expansion joint for pipes
The thermal expansion joint for relieving stresses in a pipe line due to thermal expansion consists of a pair of pipe sections wherein each section has one-half of its wall made of a metal having a higher thermal coefficient of expansion than the thermal ...
12/16/1980
4217398Thermostat metal
A thermostat metal characterized by low cost has a substantially linear temperature response over a wide temperature range from 0° to 800° F. and is adapted for wide use for temperature control purposes in a whole variety of electrical cooking appliance...
08/12/1980
4207381Bimetal and method for manufacturing the same
A bimetal is disclosed having a high, rapid deflection over a specified temperature range, including a high expansion metal alloy component having a high thermal expansion coefficient that changes rapidly at 50×10-6 /° C. or greater at a temp...
06/10/1980
4207380Aluminum thermostat metal
A composite thermostat metal (bimetal) is disclosed in which a layer of strain hardenable aluminum is bonded to a layer of metal of relatively low coefficient of thermal expansion....
06/10/1980
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