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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 8187722 | Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring boar... | 05/29/2012 |
| 8101285 | Metallic material for a connecting part and a method of producing the same A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy ... | 01/24/2012 |
| 7985485 | Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the gr... | 07/26/2011 |
| 7842397 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no ... | 11/30/2010 |
| 7816015 | Composite copper foil and method for production thereof A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molybdenum and the other surface t... | 10/19/2010 |
| 7749610 | Copper foil and method of manufacturing the same The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized i... | 07/06/2010 |
| 7691487 | Electrodeposited copper foil with carrier foil The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to... | 04/06/2010 |
| 7601433 | Highly corrosion-resistant/highly workable plated steel wire, plating bath composition, method for producing the plated steel wire and wire netting product A plated steel wire having a plated layer and an intermediate layer is characterized in that a content of manganese contained in both the plated layer and the intermediate layer is 0.02-0.30% in terms of average mass percentage, a content of aluminum is 8-25% in ter... | 10/13/2009 |
| 7588835 | Method of treating the surface of copper and copper A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A ... | 09/15/2009 |
| 7491449 | Copper-silver alloy wire and method for manufacturing the same An exemplary copper-silver alloy wire includes a conductive core containing copper, and a copper-silver cladding layer surrounding the conductive core. A ratio of silver to copper by weight in the copper-silver cladding layer is in a range from 1% to 30%. An exempla... | 02/17/2009 |
| 7381475 | Treated copper foil and circuit board An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility w... | 06/03/2008 |
| 7361391 | Metalized film laminates with anticorrosion agents Multilayered laminate films for food packaging applications which comprise at least: (a) a layer of oriented or nonoriented polyester terephthalate or oriented or nonoriented polypropylene, (b) a layer comprising at least one metal, and (c) a layer comprising at lea... | 04/22/2008 |
| 7361412 | Nanostructured soldered or brazed joints made with reactive multilayer foils Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localiz... | 04/22/2008 |
| 7358189 | Copper clad laminate To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thi... | 04/15/2008 |
| 7341796 | Copper foil having blackened surface or layer A copper foil with a blackened surface or layer wherein one or both surfaces of a copper foil is subject to black treatment, and having a color difference ΔL*≦−70 and chroma C*≦15 of a black-treated surface when measured by a color difference meter represente... | 03/11/2008 |
| 7329446 | Drill stack formation The present invention provides a structure. The structure includes a stack of sheets. Successive sheets in each pair of successive sheets of the stack are coupled to each other by a removable adhesive. The removable adhesive is also disposed on top and bottom surfac... | 02/12/2008 |
| 7319196 | Bonding wire and bonded connection A bonding wire (1) includes a matrix material (2) and a filler (3) embedded in this matrix material (2), the coefficient of thermal expansion of the filler (3) being lower than the coefficient of thermal expansion of the matrix mat... | 01/15/2008 |
| 7312350 | Process for preparing arylalkynes The invention relates to a process for preparing arylvinyl halides and sulphonates and arylalkynes by reacting haloaromatics or aryl sulphonates with vinyl halides or sulphonates in the presence of a palladium catalyst and a base and, if appropriate, subsequent elim... | 12/25/2007 |
| 7300706 | High-carbon steel wire with nickel sub coating A wire for external exposure, i.e. without chemical binding with a polymer or rubber matrix. The wire has a steel core, a nickel sub-coating and a zinc or zinc alloy top coating above the nickel sub-coating. The steel core has a carbon content exceeding 0.20%. The w... | 11/27/2007 |
| 7285338 | Anisotropic thin-film rare-earth permanent magnet An anisotropic thin-film rare-earth permanent magnet endowed with high magnetic characteristics by rendering a vapor-phase-grown thin film anisotropic in the layering direction. The atomic laminate units are formed by laminating a monoatomic layer of a rare earth el... | 10/23/2007 |
| 7285336 | Robust multilayer magnetic pigments and foils Multilayered magnetic pigment flakes and foils are provided. The pigment flakes can have a stacked layer structure on opposing sides of a magnetic core, or can be formed as an encapsulant structure with encapsulating layers around the magnetic core. The magnetic cor... | 10/23/2007 |
| 7283375 | Automatic switch An automatic switch includes a main body having a circuit board provided therein, and at least two sets of connectors connected to the main body via signal cables. The main body has an integral enclosure formed through multiple times of injection molding to include ... | 10/16/2007 |
| 7281325 | Method of manufacturing circuit board A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a ... | 10/16/2007 |
| 7278354 | Shock initiation devices including reactive multilayer structures The invention provides shock initiation devices comprising multilayer structures with constituent layers that undergo an exothermic self-propagating reaction once initiated by shock. The multilayer structures may be used as components in shaped charges, EFP devices,... | 10/09/2007 |
| 7265298 | Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device A stretchable electronic apparatus and method of producing the apparatus. The apparatus has a central longitudinal axis and the apparatus is stretchable in a longitudinal direction generally aligned with the central longitudinal axis. The apparatus comprises a stret... | 09/04/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7250865 | Object tracking system with non-contact object detection and identification An object tracking system is provided for tracking the removal of objects from a location and the replacement of the objects at the location. The system includes a radio frequency identification (RFID) tag attached to each of the objects to be tracked and each tag h... | 07/31/2007 |
| 7223481 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a ... | 05/29/2007 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose ... | 05/15/2007 |
| 7192628 | Magnetically interactive substrates A substrate is printed with areas of magnetizable ink. The magnetizable ink is compressed into the surface of the substrate, and overprinted to hide it. Suitable inks for the purpose are disclosed. The ink may be permanently magnetized in any of a variety of pattern... | 03/20/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7175919 | Multilayered metal laminate and process for producing the same An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The proce... | 02/13/2007 |
| 7172123 | Combined data reader and electronic article surveillance (EAS) system An integrated data reader and electronic article surveillance (EAS) system, and methods of operation. In one configuration, a data reader such as a bar code scanner is equipped with an EAS deactivation module disposed behind the scanner surface preferably downstream... | 02/06/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7170414 | Systems and methods for optical reading and EAS tag sensing and deactivating at retail checkout Methods of operation of a data reader and security tag deactivation system whereby a data reader such as a barcode scanner is equipped with EAS deactivation coils or modules disposed in the vicinity of the read volume or generally proximate thereto and the system is... | 01/30/2007 |
| 7169692 | Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits The present invention is an electronic interconnect comprising a bond pad consisting essentially of aluminum and copper and configured for use in semiconductor electronic devices to couple a bond wire to an integrated circuit package. The bond pad has an oxide coati... | 01/30/2007 |
| 7166174 | Bundle drawn stainless steel fibers The invention relates to stainless steel fibers obtained by bundled drawing of stainless steel wires embedded in a matrix material. The composition of the stainless steel fibers comprises iron and the following components expressed in percent by weight: C £ 0.05%, ... | 01/23/2007 |
| 7159313 | Solderless electronics packaging and methods of manufacture To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is moun... | 01/09/2007 |
| 7153590 | Composite copper foil and manufacturing method thereof A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( | 12/26/2006 |
| 7138068 | Printed circuit patterned embedded capacitance layer A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), p... | 11/21/2006 |
