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| Number | Title | Issue Date |
| 8003216 | Heat-conductive dielectric polymer material and heat dissipation substrate containing the same A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic ... | 08/23/2011 |
| 7906213 | Epoxy resin curable composition for prepreg An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A) a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl grou... | 03/15/2011 |
| 7833627 | Composite armor having a layered metallic matrix and dually embedded ceramic elements According to typical inventive practice, a first metallic material is poured into a mold including a bottom inside surface having regularly arrayed rises (truncated spherical convexities). The molten first metallic material cools and solidifies to include a surface ... | 11/16/2010 |
| 7790288 | Interpenetrating polymer network as coating for metal substrate and method therefor A coated article and method therefor comprises a metal substrate comprising a layered coating composition on at least one surface thereof, the coating composition comprising a layer of epoxy on one or more of the surfaces of the substrate. The coating composition fu... | 09/07/2010 |
| 7749605 | Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring b... | 07/06/2010 |
| 7666509 | Resin composition, prepreg and metal-foil-clad laminate A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a b... | 02/23/2010 |
| 7645514 | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing a... | 01/12/2010 |
| 7541093 | Coating composition A coating composition containing an epoxy resin and a curing agent comprising a trimer fatty triamine and/or higher oligomeric amine. The coating composition is particularly suitable for use as a primer coating layer on concrete and steel. ... | 06/02/2009 |
| 7527863 | Functionalized polyphenylene ether An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an avera... | 05/05/2009 |
| 7524563 | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a l... | 04/28/2009 |
| 7521120 | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal ... | 04/21/2009 |
| 7494715 | Steel plate reinforcing sheet A steel plate reinforcing sheet that can reduce distortions of the steel plate without reducing its reinforcing property and can also prevent abrupt deformations at end portions thereof with respect to a direction extending along a curving direction of a curved stee... | 02/24/2009 |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
| 7413815 | Thin laminate as embedded capacitance material in printed circuit boards The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a ... | 08/19/2008 |
| 7390571 | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to... | 06/24/2008 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 04/29/2008 |
| 7364829 | Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device The present invention provides a resist pattern thickening material which can thicken a resist pattern to be thickened regardless of a material or a size thereof so as to form a fine space pattern, exceeding an exposure limit of exposure light. The resist pattern th... | 04/29/2008 |
| 7348061 | Slip-resistant coatings and substrates coated therewith A slip-resistant coating composition comprising (i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof... | 03/25/2008 |
| 7348058 | Electrically conductive roll An inexpensive electrically conductive roll which is easily produced compared with conventional rolls, offers stable adhesion at the interface with time lapse after mixing adhesive components, which is not affected by environment during storage of the core after bei... | 03/25/2008 |
| 7348057 | Acrylic adhesive sheet An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing... | 03/25/2008 |
| 7341783 | Functionalized polyphenylene ether An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an avera... | 03/11/2008 |
| 7338989 | Aqueous coating material, method of producing the same and use thereof An aqueous coating material comprising at least one epoxy resin as binder and at least one polyamine as curing agent, wherein said epoxy resin or at least one of the epoxy resins (i) is solid per se at room temperature and/or is present in a powder coat... | 03/04/2008 |
| 7337973 | Identity card A card with a paper core and at least one chip incorporated into the paper core, characterised in that an image is arranged on at least one main surface of the paper core, at least 5% of at least one main surface are covered by a seal and the chip is covered on both... | 03/04/2008 |
| 7335807 | Solventless liquid isoprene compounds In one embodiment, this invention relates to a solventless liquid isoprene compound. The compound includes a liquid isoprene rubber. The compound also includes a curing agent selected from sulfur and/or sulfur donors. The curing agent is present in an amount of at l... | 02/26/2008 |
| 7323234 | Curable alkanolamine containing epoxy powder coating composition The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compou... | 01/29/2008 |
| 7314902 | Hot-melt adhesive The present invention provides a hot-melt adhesive composition comprising a blend of: a reactive filler comprising an aluminum compound, a magnesium compound, a calcium compound, a barium compound or a mixture thereof; and, a grafted polyolefin having a functional g... | 01/01/2008 |
| 7312104 | Resin composition for encapsulating semiconductor device A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide s... | 12/25/2007 |
| 7311973 | Adhesive with multistage curing and the utilization thereof during the production of composite materials The invention relates to an adhesive containing two components A and B, whereby component A comprises both a functional group which can be polymerized by means of irradiation with UV beams as well as at least one functional group which is able to react with a compou... | 12/25/2007 |
| 7297406 | Lead-free electrodeposition coating composition and coated article The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid appearance, and an article coated with the composition. The invention pr... | 11/20/2007 |
| 7288607 | High solids primer composition based on epoxy ring opening curing reaction This invention relates to a primer composition having a low VOC content useful in the manufacture of automobiles and trucks in which the film forming binder contains: a) a cycloaliphatic or polycycloaliphatic epoxy compound; ... | 10/30/2007 |
| 7288290 | Process for applying multi-component composite coatings to substrates to provide sound damping and print-through resistance A process is provided for applying multi-component composite coating compositions to substrates to provide sound damping and print-through resistance. The process includes applying at least one first coating composition to a surface of the substrate; applying at lea... | 10/30/2007 |
| 7282266 | Corrosion and alkali-resistant compositions and methods for using the same A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially mela... | 10/16/2007 |
| 7279642 | Component with ultra-high frequency connections in a substrate The present invention relates to contacting technology for signal connections in the substrate of an extremely high frequency module, in particular a microwave or millimeter wave module. The extremely high frequency module contains a) a multilayer substrate having a... | 10/09/2007 |
| 7271224 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/18/2007 |
| 7267877 | Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional ... | 09/11/2007 |
| 7255925 | Thermosetting resin composition for high speed transmission circuit board The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and ... | 08/14/2007 |
| 7247358 | Laminate controlling curl of hardcoat layer Disclosed is a laminate with a reduced tendency for curling in a hard coat layer. The laminate comprises a transparent substrate and a hard coat layer provided on the transparent substrate. The hard coat layer is formed of a cured product of a composition comprising... | 07/24/2007 |
| 7238407 | Multi-layer reinforcing laminate Multi-layer laminates are provided which contain at least two binder layers and at least two textile-containing layers. One binder layer faces a substrate to be reinforced, with a second binder layer between two textile-containing layers wherein one of the textile-c... | 07/03/2007 |
| 7238731 | Environmentally friendly coating compositions for coating metal objects, coated objects therefrom, and methods, processes and assemblages for coating thereof Disclosed are environmentally friendly, substantially all solids coating compositions which are curable using ultraviolet and visible radiation. In addition, the disclosed coating compositions are suitable for coating flexible objects and/or objects having angular f... | 07/03/2007 |
| 7227447 | Switch device A switch device is provided that ensures formation of a communicable area by a coil antenna. The switch device includes an ignition switch operated by an operator for driving an engine starter, a decorative cap arranged to surround the ignition switch and having an ... | 06/05/2007 |
