Did You Know...
...that while attempting to develop a super strong glue, 3M employee Spencer Silver accidentally developed a glue that was so weak it would barely hold two pieces of paper together? However, his colleague Art Fry needed the glue. Fry sang with his church choir and marked the pages of his hymnal with small scraps of paper that often fell out. He used Silver's glue to hold the papers in place. Today we call this invention Post-it Notes.
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| Number | Title | Issue Date |
| 8088490 | Varnish, prepreg, and substrate thereof A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol nov... | 01/03/2012 |
| 8084130 | Epoxy resin molding material for sealing and electronic component device The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. T... | 12/27/2011 |
| 8084131 | Transparent hybrid sheet There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid compositi... | 12/27/2011 |
| 8067093 | Curing agents for epoxy-functional compounds The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an α-β unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relat... | 11/29/2011 |
| 8062750 | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule;... | 11/22/2011 |
| 8057902 | Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material ... | 11/15/2011 |
| 8053077 | Composite-forming method, composites formed thereby, and printed circuit boards incorporating them A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing pro... | 11/08/2011 |
| 8043705 | Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordin... | 10/25/2011 |
| 8039109 | Epoxy resins with improved burn properties Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes... | 10/18/2011 |
| 8034453 | Composite materials with improved burn properties Epoxy resins and composite materials that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition a... | 10/11/2011 |
| 8021752 | Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obta... | 09/20/2011 |
| 8007911 | Material for room temperature curable solvent-borne overcoating material,coating material using same and coating film To provide a coating material for a room temperature curable solvent-borne overcoating material having chipping resistance and not allowing occurrence of cracks, and a room temperature curable solvent-borne overcoating material using the same, the room temperature c... | 08/30/2011 |
| 7993751 | Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed. ... | 08/09/2011 |
| 7989070 | Coating composition for achieving excellent MVSS adhesion A coating composition comprises a crosslinkable carbamate-functional resin and an aminoplast. The aminoplast comprises the reaction product of an aldehyde and a melamine. The aminoplast has a content of imino groups of less than or equal to about 10%, a content of a... | 08/02/2011 |
| 7985477 | Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming A cationically polymerizable composite coating composition comprising: a) a condensation product of at least one hydrolyzable silane having a fluorine-containing group, b) at least one cationically polymerizable organic resin, and c) a cationic initiator, provides, ... | 07/26/2011 |
| 7981514 | Coating composition yielding abrasion-resistant tintable coatings A coating composition based upon at least partially hydrolyzed epoxy-functional alkoxy silanes and having particular utility in forming tintable, abrasion resistant coatings on lenses. Incorporation in the composition of a non-hydrolyzed epoxy-functional alkoxy sila... | 07/19/2011 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ... | 06/28/2011 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ... | 06/28/2011 |
| 7897258 | Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-cross... | 03/01/2011 |
| 7892647 | Interlayers comprising stabilized infrared absorbing agents The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared abso... | 02/22/2011 |
| 7879445 | Adhesive for bonding circuit members, circuit board and process for its production An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 ... | 02/01/2011 |
| 7838114 | Thermosetting resin composition and use thereof A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D)... | 11/23/2010 |
| 7811668 | Epoxy resin with increased flexural impact strength and breaking extension Epoxy resins comprising deagglomerated barium sulphate with an average particle size of less than 0.5 μM feature increased flexural impact strength and breaking extension. Epoxy resins of this kind can be used as, for example, composite material or binders in water... | 10/12/2010 |
| 7781063 | High thermal conductivity materials with grafted surface functional groups The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials 30 and a host resin matrix 32. The HTC materials 30 form a continuous organic-inorganic composite with the host resin matri... | 08/24/2010 |
| 7771826 | Antireflection film, producing method of antireflection film, polarizing plate and display device Disclosed is an antireflection film having an antireflection layer excellent in chemical resistance, surface hardness and wet-heat-resistant adhesion. Also disclosed are a method for producing such an antireflection film, a polarizing plate using such an antireflect... | 08/10/2010 |
| 7749604 | Laminating adhesives containing polyurethane and epoxide resin Aqueous composition comprising a polyurethane (A) an epoxy resin (B) obtainable by reacting compounds having epoxide groups with diols or polyols, and a crosslinker (C) for the epoxy resin. ... | 07/06/2010 |
| 7736743 | Heat curable, thermally expandable composition with high degree of expansion Compositions containing at least one liquid epoxy resin, at least one solid epoxy resin, at least one propellant, at least one curing agent and at least one mica-containing filler produce expandable, thermally curable binder systems which may be used without the add... | 06/15/2010 |
| 7682699 | Coatings having low volatile organic compound content The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no ... | 03/23/2010 |
| 7678455 | Layered film and process for producing layered film A laminated film is provided, in which a laminated layer including at least 50 percent by weight of composition (A) and cross-linking agent (B) is laminated on at least one surface of a thermoplastic resin film, wherein the composition (A) is a composition comprisin... | 03/16/2010 |
| 7674528 | Paint for silver film protection A paint and method are divulged for protecting the silver film of mirrors. The paint in its preferred embodiment includes a metal carboxylate which will contribute metal ions, namely stannous octoate for the contribution of stannous(II) ions in an amount of 0.5% or ... | 03/09/2010 |
| 7638196 | Conductive rubber member A conductive rubber member having at least one conductive elastic layer, wherein the conductive elastic layer, which is at least an outermost layer, in contact with an opposing member during use is a curing product of a rubber composition having a conductivity impar... | 12/29/2009 |
| 7592067 | Epoxy resin compositions, processes utilizing same and articles made therefrom Disclosed are epoxy resin compositions which include an alkali metal containing cure accelerator. The alkali metal containing cure accelerators are preferably alkali metal hydroxides, alkoxides, carboxylates, or alkali metal salts. Articles prepared from the resin c... | 09/22/2009 |
| 7560162 | Electrodeposition coating composition, coating method and coated article A coated article is obtained by electrodeposition coating using an electrodeposition coating composition, which comprises: (A) a resin component obtained by reacting an epoxy resin, an amino compound and/or a phenolic compound; (B) a resin component having a specifi... | 07/14/2009 |
| 7544420 | Backing layers and substrates for articles formed from ionomer laminates The present invention relates to new backing layers and/or new substrates for making (1) new multilayer structures formed from one or more ionomers and one or more tie-layers, and optionally a new backing layer to form laminates, (2) new composite articles made from... | 06/09/2009 |
| 7514148 | Hybrid composite of silicone and organic resins A fiber reinforced composite including layers of fibers, each layer being impregnated with a resin. The layers include in combination a layer of an addition cured silicone resin and a layer of an organic resin. The layers form a hybrid composite having a higher modu... | 04/07/2009 |
| 7449241 | Organic coating compositions for aluminizing metal substrates, and related methods and articles An organic coating composition is described, which can be used to enrich the surface region of a metal-based substrate with aluminum. The composition comprises an aluminum-based powder and at least one organic resin, e.g., alkyds, epoxies, or silicone materials. At ... | 11/11/2008 |
| 7442434 | Epoxy resin composition A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing te... | 10/28/2008 |
| 7439278 | Curable adhesive composition and its use in the optical field The invention concerns a photocurable adhesive composition comprising, based on total weight of photopolymerizable monomers and/or oligomers of the composition: (A1) 20 to 80 wt % of at least one diacrylate monomer or oligomer ther... | 10/21/2008 |
| 7435449 | Waterborne epoxy coating composition and method A waterborne coating composition comprising a waterborne epoxy coating with hydraulic cement, which is capable of a thin initial application. The coating composition may be made, stored and transported as a two-part composition, where each part is a pourable liquid.... | 10/14/2008 |
| 7432603 | Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Tab... | 10/07/2008 |
