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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 8445108 | Composite materials, composite film manufactured by using the same and method for manufacturing composite film The present invention provides a composite material comprising a glass cloth; and an organic-inorganic hybrid composition comprising diphenylsilanediol and alkoxy si lane, a composite film manufactured by using the same, and a method for manufacturing the composite ... | 05/21/2013 |
| 8431223 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl,... | 04/30/2013 |
| 8431222 | Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene o... | 04/30/2013 |
| 8409715 | Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent The present invention provides a cation-polymerizable resin composition comprising (A) a multi-branched polyether polyol obtained from a ring-opening reaction of (a1) a hydroxyalkyloxetane and (a2) an epoxy compound having one epoxy group, (B) an alicyclic epoxy com... | 04/02/2013 |
| 8323798 | Systems and methods for drilling holes in printed circuit boards An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, ... | 12/04/2012 |
| 8318309 | Benzylated aminopropylated alkylenediamines and uses thereof The present invention provides epoxy curing agent compositions comprising benzylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed. ... | 11/27/2012 |
| 8313836 | Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent Laminates for printed wiring boards for the making of laminates for printed wiring boards having an impregnant including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent. ... | 11/20/2012 |
| 8298673 | Vibration-damping reinforcement composition, vibration-damping reinforcement material, and method for vibration damping and reinforcement of thin sheet A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent. ... | 10/30/2012 |
| 8288003 | Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor sealing material Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a ph... | 10/16/2012 |
| 8283039 | Vulcanized rubber laminate The invention provides a vulcanized rubber laminate obtained by firmly bonding an unvulcanized epichlorohydrin rubber layer and an organic peroxide-containing fluororubber layer. The laminate is obtained by thermal adhesion a layer of an unvulcanized epichlorohydrin... | 10/09/2012 |
| 8273458 | Adhesive for bonding circuit members, circuit board and process for its production An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 ... | 09/25/2012 |
| 8273457 | Adhesive for bonding circuit members, circuit board and process for its production An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 ... | 09/25/2012 |
| 8252419 | Adhesive for bonding circuit members, circuit board and process for its production An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 ... | 08/28/2012 |
| 8227084 | Thermosetting resin composition for high performance laminates This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition. ... | 07/24/2012 |
| 8153260 | Composite material A composite material obtained by laminating (A) a layer formed from an epoxy resin curing composition and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a... | 04/10/2012 |
| 8088490 | Varnish, prepreg, and substrate thereof A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol nov... | 01/03/2012 |
| 8084131 | Transparent hybrid sheet There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid compositi... | 12/27/2011 |
| 8084130 | Epoxy resin molding material for sealing and electronic component device The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. T... | 12/27/2011 |
| 8067093 | Curing agents for epoxy-functional compounds The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an α-β unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relat... | 11/29/2011 |
| 8062750 | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule;... | 11/22/2011 |
| 8057902 | Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material ... | 11/15/2011 |
| 8053077 | Composite-forming method, composites formed thereby, and printed circuit boards incorporating them A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing pro... | 11/08/2011 |
| 8043705 | Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordin... | 10/25/2011 |
| 8039109 | Epoxy resins with improved burn properties Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes... | 10/18/2011 |
| 8034453 | Composite materials with improved burn properties Epoxy resins and composite materials that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition a... | 10/11/2011 |
| 8021752 | Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obta... | 09/20/2011 |
| 8007911 | Material for room temperature curable solvent-borne overcoating material,coating material using same and coating film To provide a coating material for a room temperature curable solvent-borne overcoating material having chipping resistance and not allowing occurrence of cracks, and a room temperature curable solvent-borne overcoating material using the same, the room temperature c... | 08/30/2011 |
| 7993751 | Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed. ... | 08/09/2011 |
| 7989070 | Coating composition for achieving excellent MVSS adhesion A coating composition comprises a crosslinkable carbamate-functional resin and an aminoplast. The aminoplast comprises the reaction product of an aldehyde and a melamine. The aminoplast has a content of imino groups of less than or equal to about 10%, a content of a... | 08/02/2011 |
| 7985477 | Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming A cationically polymerizable composite coating composition comprising: a) a condensation product of at least one hydrolyzable silane having a fluorine-containing group, b) at least one cationically polymerizable organic resin, and c) a cationic initiator, provides, ... | 07/26/2011 |
| 7981514 | Coating composition yielding abrasion-resistant tintable coatings A coating composition based upon at least partially hydrolyzed epoxy-functional alkoxy silanes and having particular utility in forming tintable, abrasion resistant coatings on lenses. Incorporation in the composition of a non-hydrolyzed epoxy-functional alkoxy sila... | 07/19/2011 |
| 7968194 | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ... | 06/28/2011 |
| 7968195 | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ... | 06/28/2011 |
| 7897258 | Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-cross... | 03/01/2011 |
| 7892647 | Interlayers comprising stabilized infrared absorbing agents The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared abso... | 02/22/2011 |
| 7879445 | Adhesive for bonding circuit members, circuit board and process for its production An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 ... | 02/01/2011 |
| 7838114 | Thermosetting resin composition and use thereof A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D)... | 11/23/2010 |
| 7811668 | Epoxy resin with increased flexural impact strength and breaking extension Epoxy resins comprising deagglomerated barium sulphate with an average particle size of less than 0.5 μM feature increased flexural impact strength and breaking extension. Epoxy resins of this kind can be used as, for example, composite material or binders in water... | 10/12/2010 |
| 7781063 | High thermal conductivity materials with grafted surface functional groups The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials 30 and a host resin matrix 32. The HTC materials 30 form a continuous organic-inorganic composite with the host resin matri... | 08/24/2010 |
| 7771826 | Antireflection film, producing method of antireflection film, polarizing plate and display device Disclosed is an antireflection film having an antireflection layer excellent in chemical resistance, surface hardness and wet-heat-resistant adhesion. Also disclosed are a method for producing such an antireflection film, a polarizing plate using such an antireflect... | 08/10/2010 |
