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| Number | Title | Issue Date |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7329458 | Wiring member and method of manufacturing the same Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well as to a second major surface of the porous substrate, and a conductive... | 02/12/2008 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7262507 | Semiconductor-mounted device and method for producing same Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first se... | 08/28/2007 |
| 7259968 | Tailoring impedances of conductive traces in a circuit board A multi-layer circuit board includes a first layer having at least first and second conductive traces of different widths and the same impedance. One of a first power plane and first ground plane has a void region such that the first conductive trace is spaced apart... | 08/21/2007 |
| 7223356 | Method for preparing a thin ceramic material with controlled surface porosity gradient, and resulting ceramic material The invention concerns a method for preparing a thin ceramic material with controlled surface porosity gradient, including (A) infiltrating a porous pore-forming substrate of controlled thickness, with a ceramic material suspension; (B) evaporating the solvent; (C) ... | 05/29/2007 |
| 7202570 | Circuit tape having adhesive film semiconductor device and a method for manufacturing the same A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an org... | 04/10/2007 |
| 7185426 | Method of manufacturing a semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 03/06/2007 |
| 7172719 | High purity sealing material Elastomeric sealing elements such as gaskets, O-rings and diaphragms suitable for use as seals in ultra-pure water systems are fabricated from foamed PVDF by compressing foam blanks up to a 5:1 to 7:1 ratio in a heat environment of about 300° F. to about 350° F. T... | 02/06/2007 |
| 7164197 | Dielectric composite material A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The diel... | 01/16/2007 |
| 7155866 | Cementitious exterior sheathing product having improved interlaminar bond strength The present invention provides exterior building products, such as roofing and siding, shake, shingles, siding, sheathing, panels, planks, vertical siding, soffit panels, fencing, decking, fascia, corner posts, column corners and trim boards in which a plurality of ... | 01/02/2007 |
| 7145238 | Semiconductor package and substrate having multi-level vias A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 12/05/2006 |
| 7101606 | Mechanical embossing texture differentiation between chemically restricted areas and non-restricted areas Disclosed is a method of manufacturing a mechanically and chemically embossed surface covering having selectively textured surfaces. The method includes forming a web coated with a wear layer. The coated web is heated to a temperature at which the wear layer is cure... | 09/05/2006 |
| 7090910 | Selectively embossed surface coverings and processes of manufacture Selectivity embossed surface coverings are prepared by mechanically embossing a wear layer which overlays at least one printing ink containing a photoinitiator which has been printed in a pattern or design. The embossed wear layer is subjected to ultraviolet radiati... | 08/15/2006 |
| 7081291 | Selectively embossed surface coverings and processes of manufacture Selectivity embossed surface coverings are prepared by mechanically embossing a wear layer which overlays at least one printing ink containing a photoinitiator which has been printed in a pattern or design. The embossed wear layer is subjected to ultraviolet light w... | 07/25/2006 |
| 7062795 | Lightweight impact resistant helmet system A strong, lightweight, impact resistant helmet system protects the wearer from impact injury and minimizes bodily injury to other players brought into contact therewith during blocking and tackling events. Weight reduction is achieved by reinforcing inner and outer ... | 06/20/2006 |
| 7045828 | Card-type LED illumination source An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surfa... | 05/16/2006 |
| 7023084 | Plastic packaging with high heat dissipation and method for the same The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resi... | 04/04/2006 |
| 6930256 | Integrated circuit substrate having laser-embedded conductive patterns and method therefor An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel... | 08/16/2005 |
| 6887914 | Structural hot melt material and methods The present invention relates to a material, method, and application for reinforcement of structural members, especially joints such as a hem flange joint of an automobile. The method and material of the present invention comprises of combining, in parts by weight: ... | 05/03/2005 |
| 6821530 | Polymer composite compositions The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. The polymer... | 11/23/2004 |
| 6740607 | Substrate with stretch and heat sealing properties to make a multidirectional restraint module design The invention is directed to coating a plurality of polyurethane films onto a stretchable knit fabric substrate and heat sealing such substrates together to yield an air curtain or air bag having improved air-holding properties. ... | 05/25/2004 |
| 6737158 | Porous polymeric membrane toughened composites Composites comprising porous polymeric membrane films meeting the following equation: 75 MPa | 05/18/2004 |
| 6632511 | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin comprising multicellular polymeric microspheres as a filler. Pre-... | 10/14/2003 |
| 6586847 | Method and structure for temperature stabilization in semiconductor devices Method and structure for temperature stabilization in semiconductor devices are disclosed. In one embodiment, a carbon-based polymer is deposited on top of an interconnect metal line in the semiconductor die where relatively large power dissipation is kno... | 07/01/2003 |
| 6565960 | Polymer composite compositions The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. ... | 05/20/2003 |
| 6555216 | Contrasting gloss surface coverings optionally containing dispersed wear-resistant particles and methods of making the same A surface covering containing at least one layer containing wear-resistant particles, such as aluminum oxide, is disclosed. Preferably, the wear-resistant particles are present in the outermost layer of the surface covering which is exposed to the environ... | 04/29/2003 |
| 6544638 | Electronic chip package An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temp... | 04/08/2003 |
| 6537653 | Ligneous fibrous filler/olefinic plastic composite sheet for bonding A bondable wood cellulosic filler/olefinic plastic composite sheet material made by extruding in a sheet shape a mixture consisting of: (1) 40-60 parts by weight of an olefinic plastic; (2) 60-40 parts by weight of a wood cellulosic filler, the size there... | 03/25/2003 |
| 6528154 | Makeup sponge puff To provide a makeup sponge puff of less frictional resistance and stiffness and no surface slipperiness, particles are adhered to a surface of a substrate sponge of closed-cell foam to form the makeup sponge puff. For example, the substrate sponge compris... | 03/04/2003 |
| 6503113 | Non-mold method of forming objects and articles formed thereby This invention relates to a non-mold method of forming articles and to the articles themselves wherein various configured articles may be fashioned with conformable material which may be easily fabricated as by sewing, or heat, or sonic welding to form th... | 01/07/2003 |
| 6482497 | Pressure-cycled, packet-transfer infusion of resin-stitched preforms A method and apparatus for manufacturing fiber-reinforced, composite materials relies on one or more processes improving over conventional forming, filling, and processing techniques. A homogeneous resin-stitching process provides for resin stitching for ... | 11/19/2002 |
| 6428083 | Lightweight suspension panel for vehicle seats Resilient, contoured members for use in suspension seats and automobile interior door panels include first and second fabric panels joined together along respective perimeters thereof and along spaced-apart intermediate portions thereof to form one or mor... | 08/06/2002 |
| 6312776 | High barrier closure liner for carbonated beverage containers and the like A multi-layer closure liner for carbonated beverage containers and the like, including a gas barrier layer, a first tie layer on an upper surface of the gas barrier layer, a second tie layer on a lower surface of the gas barrier layer, a first polyolefini... | 11/06/2001 |
| 6306491 | Respiratory aids The present invention is directed to materials that assist respiration of living cells contained in cell-containing systems. The materials form air-filled conduits or channels through which gases, such as oxygen and carbon dioxide, can readily exchange by... | 10/23/2001 |
| 6283810 | Non-mold method of forming objects and articles formed thereby This invention relates to a non-mold method of forming articles and to the articles themselves wherein various configured articles may be fashioned with conformable material which may be easily fabricated as by sewing, or heat, or sonic welding to form th... | 09/04/2001 |
| 6265067 | Paper like sheet of plastic material A multilayer sheet made of an outer layer comprising polyethylene, a finely granulated material and a pigment, a middle layer comprising polyethylene, which may contain a finely granulated material and a pigment, and an inner layer which contains a polyet... | 07/24/2001 |
