Bizarre Patents
Mouthguard made at least partially from an edible candy
A mouthguard includes a U-shaped upper bite plate which removably fits over upper teeth of a person, with the entire upper bite plate being made from a soft, deformable and edible gummi candy.
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| Number | Title | Issue Date |
| 8101266 | Multilayer printed circuit board A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The funct... | 01/24/2012 |
| 8092900 | Solution, component for plating, insulating sheet, laminate, and printed circuit board It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to a... | 01/10/2012 |
| 8057886 | Optical article having anti-theft feature and a system and method for inhibiting theft of same A system for altering a functionality of an optical article from a pre-activated state to an activated state, comprising an optical article comprising an optical data layer for storing data, an external radiation source for generating an external stimulus adapted to... | 11/15/2011 |
| 8025953 | Method for preparing conductive pattern and conductive pattern prepared by the method The present invention provides a method for preparing a conductive pattern, comprising a pattern forming step of forming a conductive pattern on a substrate; and a blackening processing step of blackening the surface of the conductive pattern by immersing the conduc... | 09/27/2011 |
| 7955689 | Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring b... | 06/07/2011 |
| 7906200 | Composite circuit substrate structure A composite circuit substrate structure includes a first dielectric layer, a second dielectric layer, a glass fiber structure, and a patterned circuit. The first dielectric layer has a first surface and a second surface opposite to each other. The second dielectric ... | 03/15/2011 |
| 7883764 | Fine resinous structure, fabrication thereof, and polymerizable resin-precursor composition Disclosed is a resinous molded article which has a fine structure of a nanometer level and includes a material containing a polymer of a polymerizable organic fluorocompound. The polymer is formed from, for example, a monomeric precursor composition containing a met... | 02/08/2011 |
| 7875340 | Heat radiation substrate having metal core and method of manufacturing the same Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with a... | 01/25/2011 |
| 7824761 | Metal structure and production method therefor A metal structure capable of significantly increasing wavelength selectivity and polarization electivity for an incident light, and a production method thereof. First, a solid transparent substrate (glass substrate) (10) is cleaned and dried (S100). Th... | 11/02/2010 |
| 7820274 | Prepreg and conductive layer-laminated substrate for printed wiring board A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like... | 10/26/2010 |
| 7794820 | Printed circuit board and fabricating method of the same Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board inc... | 09/14/2010 |
| 7790269 | Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 mum or less, an... | 09/07/2010 |
| 7790267 | Workpiece boring/cutting operation aiding plate material and molding making use of the same A workpiece boring/cutting operation aiding plate material comprising a rubber-containing styrene resin composition and an inorganic filler, wherein these are compounded in a weight ratio of 80:20 to 40:60; and a molding making use of the same. ... | 09/07/2010 |
| 7790268 | Circuit materials, multilayer circuits, and methods of manufacture thereof A circuit assembly comprises two or more circuit laminates, each comprising a conductive metal layer disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply la... | 09/07/2010 |
| 7658987 | X-ray device component with emissive inorganic coating A metal x-ray device component is provided that includes a high emissivity inorganically bonded ceramic coating that can be applied with minimal surface preparation and that provides good resistance to corrosion and oxidation of substrates in high temperature, vacuu... | 02/09/2010 |
| 7658988 | Printed circuits prepared from filled epoxy compositions Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compos... | 02/09/2010 |
| 7655292 | Electrically conductive substrate with high heat conductivity An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A c... | 02/02/2010 |
| 7622183 | Multilayer printed wiring board with filled viahole structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 11/24/2009 |
| 7615277 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the prese... | 11/10/2009 |
| RE40947 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being ... | 10/27/2009 |
| 7601419 | Printed circuit board and method of manufacturing the same Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition ins... | 10/13/2009 |
| 7579066 | Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth) acrylate polymer and its use There are provided a novel ethylenically unsaturated group-containing isocyanate compound, a process for producing the same, and a reactive monomer produced from the isocyanate compound, a reactive polymer and its use. The ethylenically unsaturated group-containing ... | 08/25/2009 |
| 7572500 | Method of manufacturing circuit-forming board and material of circuit-forming board A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a press... | 08/11/2009 |
| 7510759 | Electronic part and manufacturing method thereof An electronic component includes conductive pattern (2) on insulating substrate (1), a metal film formed by a plating method on a surface of conductive pattern (2), and metal oxide layer (3) formed by oxidizing the metal film on the surfa... | 03/31/2009 |
| 7504148 | Printed circuit board structure and manufacturing method thereof This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board struct... | 03/17/2009 |
| 7485361 | Multilayered printed wiring board and manufacturing method thereof An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered pri... | 02/03/2009 |
| 7482052 | Method for processing by laser, apparatus for processing by laser, and three-dimensional structure A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorpt... | 01/27/2009 |
| 7473459 | Method of manufacturing a film printed circuit board A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the a... | 01/06/2009 |
| 7473458 | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring b... | 01/06/2009 |
| 7470461 | Printed circuit board and method of manufacturing the same Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predet... | 12/30/2008 |
| 7470460 | Layered composite materials Layered composite materials which comprises a substrate made from a thermoplastic polymer, and comprise an intermediate layer arranged thereupon and a decorative layer applied to the intermediate layer, where the decorative layer is composed of a chromed metal. A he... | 12/30/2008 |
| 7465488 | Bow control in an electronic package A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a moldin... | 12/16/2008 |
| 7459200 | Circuit board design A circuit board is described where the fiberglass fiber pattern as been modified than what is found in conventional FR4 circuit boards. In one embodiment, the sets of fiberglass fibers are disposed in a zig-zag or herringbone manner. In one use, when a pair of condu... | 12/02/2008 |
| 7459202 | Printed circuit board A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the flanges are embedded into the surface of the prepreg, creating via hol... | 12/02/2008 |
| 7459201 | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by steps of drawing wiring precursor patterns containing a paste of comp... | 12/02/2008 |
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a... | 10/21/2008 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7429778 | Methods for forming wiring and electrode There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) met... | 09/30/2008 |
| 7427435 | Coating composition for adhering metallized layers to polymeric films A metallized film and a process for making the film are disclosed. In general, the metallized film includes a polymeric film layer that is coated with a polyester coating composition. A metal layer is then formed on top of the polyester coating. The polyester coatin... | 09/23/2008 |
| 7410551 | Method of hot marking, and a multilayer structure for implementing such a method The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect... | 08/12/2008 |
