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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 7658987 | X-ray device component with emissive inorganic coating A metal x-ray device component is provided that includes a high emissivity inorganically bonded ceramic coating that can be applied with minimal surface preparation and that provides good resistance to corrosion and oxidation of substrates in high temperature, vacuu... | 02/09/2010 |
| 7658988 | Printed circuits prepared from filled epoxy compositions Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compos... | 02/09/2010 |
| 7655292 | Electrically conductive substrate with high heat conductivity An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A c... | 02/02/2010 |
| 7622183 | Multilayer printed wiring board with filled viahole structure The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The m... | 11/24/2009 |
| 7615277 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the prese... | 11/10/2009 |
| RE40947 | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being ... | 10/27/2009 |
| 7601419 | Printed circuit board and method of manufacturing the same Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition ins... | 10/13/2009 |
| 7579066 | Ethylenically unsaturated group-containing isocyanate compound and process for producing the same, and reactive monomer, reactive (meth) acrylate polymer and its use There are provided a novel ethylenically unsaturated group-containing isocyanate compound, a process for producing the same, and a reactive monomer produced from the isocyanate compound, a reactive polymer and its use. The ethylenically unsaturated group-containing ... | 08/25/2009 |
| 7572500 | Method of manufacturing circuit-forming board and material of circuit-forming board A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a press... | 08/11/2009 |
| 7510759 | Electronic part and manufacturing method thereof An electronic component includes conductive pattern (2) on insulating substrate (1), a metal film formed by a plating method on a surface of conductive pattern (2), and metal oxide layer (3) formed by oxidizing the metal film on the surfa... | 03/31/2009 |
| 7504148 | Printed circuit board structure and manufacturing method thereof This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board struct... | 03/17/2009 |
| 7485361 | Multilayered printed wiring board and manufacturing method thereof An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered pri... | 02/03/2009 |
| 7482052 | Method for processing by laser, apparatus for processing by laser, and three-dimensional structure A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorpt... | 01/27/2009 |
| 7473459 | Method of manufacturing a film printed circuit board A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the a... | 01/06/2009 |
| 7473458 | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring b... | 01/06/2009 |
| 7470461 | Printed circuit board and method of manufacturing the same Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predet... | 12/30/2008 |
| 7470460 | Layered composite materials Layered composite materials which comprises a substrate made from a thermoplastic polymer, and comprise an intermediate layer arranged thereupon and a decorative layer applied to the intermediate layer, where the decorative layer is composed of a chromed metal. A he... | 12/30/2008 |
| 7465488 | Bow control in an electronic package A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a moldin... | 12/16/2008 |
| 7459200 | Circuit board design A circuit board is described where the fiberglass fiber pattern as been modified than what is found in conventional FR4 circuit boards. In one embodiment, the sets of fiberglass fibers are disposed in a zig-zag or herringbone manner. In one use, when a pair of condu... | 12/02/2008 |
| 7459202 | Printed circuit board A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the flanges are embedded into the surface of the prepreg, creating via hol... | 12/02/2008 |
| 7459201 | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by steps of drawing wiring precursor patterns containing a paste of comp... | 12/02/2008 |
| 7438969 | Filling material, multilayer wiring board, and process of producing multilayer wiring board A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a... | 10/21/2008 |
| 7438795 | Electrochemical-mechanical polishing system Provided is a polishing apparatus and polishing pad, intended for polishing a substrate, and designed for improved flow and distribution of a polishing composition to the area of interaction between the pad and substrate. In one aspect, a polishing pad is provided h... | 10/21/2008 |
| 7429778 | Methods for forming wiring and electrode There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) met... | 09/30/2008 |
| 7427435 | Coating composition for adhering metallized layers to polymeric films A metallized film and a process for making the film are disclosed. In general, the metallized film includes a polymeric film layer that is coated with a polyester coating composition. A metal layer is then formed on top of the polyester coating. The polyester coatin... | 09/23/2008 |
| 7410551 | Method of hot marking, and a multilayer structure for implementing such a method The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect... | 08/12/2008 |
| 7405244 | Solvent-free polyimide silicone resin composition and a resin film composed of the same A solvent-free resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following general formulas (1-1) and (1-2), wherein X is a tetravalent organic gr... | 07/29/2008 |
| 7404915 | Electromagnetic wave shielding material, method of manufacturing the same and electromagnetic wave shielding material for plasma display panel An objective is to provide an electromagnetic wave shielding material exhibiting an excellent electromagnetic wave shielding property, and also to provide a manufacturing method with quick and simple processing, in which a thin-line-state picture image can easily be... | 07/29/2008 |
| 7405180 | Wireless information recording medium A wireless information recording medium including a reversible thermal recording medium, a cushioning material layer provided on the reversible thermal recording medium, an information recording section including an information recording element and an antenna circu... | 07/29/2008 |
| 7396591 | Wiring substrate In a wiring substrate having a metal wiring pattern that is formed on a substrate and includes a contact portion for providing connection to an external element, an organic thin film containing silane is formed to cover the metal wiring pattern and the contact porti... | 07/08/2008 |
| 7393580 | Layered board and electronic apparatus having the layered board A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a buildup layer. The layered board includes a core layer which serves a... | 07/01/2008 |
| 7390556 | Security element, such as a thread, strip and the like, for security documents A security element, such as a thread, strip and the like, for security documents in general, which comprises a flexible backing layer that has, on at least one face, a layer of metallic material provided with regions in which the thickness of the metal is less than ... | 06/24/2008 |
| 7387812 | Heat-curable resin composition The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns whic... | 06/17/2008 |
| 7384683 | Substrate for flexible printed wiring board and method for manufacturing the same The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a ... | 06/10/2008 |
| 7381468 | Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 μm dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste en... | 06/03/2008 |
| 7374811 | Probe pad structure in a ceramic space transformer A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the cer... | 05/20/2008 |
| 7375286 | Printed circuit board and manufacturing method thereof A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the ... | 05/20/2008 |
| 7372673 | Magnetoresistive effect transducer having longitudinal bias layer and control layer directly connected to free layer In a magnetoresistive effect transducer including a pinning layer, a pinned layer, a free layer and a non-magnetic layer inserted between the pinned layer and the free layer, a longitudinal bias layer is connected directly to a part of the free layer to apply a bias... | 05/13/2008 |
| 7371506 | Positive photosensitive resin composition A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II): wherein R2 is a monovalent organic group; each of R3 | 05/13/2008 |
| 7371682 | Production method for electronic component and electronic component A method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper... | 05/13/2008 |