Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Number | Title | Issue Date |
| 8128987 | Apparatus and method for electroless deposition of materials on semiconductor substrates A method for electroless deposition from a deposition solution in a working chamber, where the process can include heating the deposition solution to its boiling point and subsequently reducing the temperature of the deposition solution to a working temperature rang... | 03/06/2012 |
| 7416763 | Process for forming metal layers A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coat... | 08/26/2008 |
| 7365005 | Method for filling of a recessed structure of a semiconductor device This invention relates to process sequence by high-speed atomic layer chemical vapor processing that includes deposition for diffusion barriers in the etched features on substrate followed by gap fill and subsequent in-situ removal of the blanket films on the top by... | 04/29/2008 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing... | 02/19/2008 |
| 7276267 | Method for the manufacture of an injection molded conductor carrying means A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate comprises a basically metallizeable plastic material and the second sup... | 10/02/2007 |
| 7267755 | Method of making a microstructure using a circuit board A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through th... | 09/11/2007 |
| 7241372 | Plating apparatus and plating liquid removing method A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with... | 07/10/2007 |
| 7231707 | Method of manufacturing planar inductors Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and ... | 06/19/2007 |
| 7198662 | Electroless plating pre-treatment solution and electroles plating method It is an object of the present invention to provide an electroless plating pre-treatment solution and an electroless plating method capable of shortening the incubation time and achieving cost reduction. As the pre-treatment solution 7 to be supplied o... | 04/03/2007 |
| 7141269 | Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The... | 11/28/2006 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
| 7022464 | Integral plated resistor and method for the manufacture of printed circuit boards comprising the same An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel ... | 04/04/2006 |
| 7011862 | Method for producing wiring substrate An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of th... | 03/14/2006 |
| 6998148 | Porous materials Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containi... | 02/14/2006 |
| 6996883 | Method of manufacturing a multi-piezoelectric layer ultrasonic transducer for medical imaging A transducer is tuned to a desired impedance by building piezoelectric assemblies of multiple layers, each layer acting as a parallel capacitor. Piezoelectric layers are preferably constructed by plating or otherwise placing a conducting perimeter around a piezoelec... | 02/14/2006 |
| 6627118 | Ni alloy particles and method for producing same, and anisotropic conductive film A crystalline Ni alloy particle for an anisotropic conductive film comprising Ni and a metalloid element such as P, B, etc. and having a structure in which a Ni intermetallic compound phase is precipitated can be produced by preparing substantially amorph... | 09/30/2003 |
| 6623803 | Copper interconnect stamping A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to th... | 09/23/2003 |
| 6616967 | Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturat... | 09/09/2003 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, ... | 10/24/2000 |
| 6136513 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of... | 10/24/2000 |
| 6123984 | Method and apparatus for plating a substrate A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the fine cavities with plating solution. The method comprises ... | 09/26/2000 |
| 6117784 | Process for integrated circuit wiring Metal wiring is provided in an integrated circuit by sputter coating onto a semiconductor substrate a copper seed layer; depositing and patterning a photoresist; electroplating or electrolessly plating a metal within the openings of the photoresist; strip... | 09/12/2000 |
| 6090261 | Method and apparatus for controlling plating over a face of a substrate According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one ... | 07/18/2000 |
| 6086946 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and sub... | 07/11/2000 |
| 6063172 | Aqueous immersion plating bath and method for plating It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating bath which comprises (A) at least one bath... | 05/16/2000 |
| 6048585 | Removal of orthophosphite ions from electroless nickel plating baths Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium. In order to avoid the precipitation of calcium sulfate an... | 04/11/2000 |
| 6045866 | Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, ad... | 04/04/2000 |
| 6022596 | Method for photoselective seeding and metallization of three-dimensional materials A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this... | 02/08/2000 |
| 5882435 | Process for the metal coating of solar cells made of crystalline silicon Solar cells made of crystalline are metal coated. Combined front side and rear side metal coating based on a thick-film process is proposed, in which even very fine thick-film conductor track structures are sufficiently reinforced by photo-induced current... | 03/16/1999 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5843517 | Composition and method for selective plating This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printe... | 12/01/1998 |
| 5830533 | Selective patterning of metallization on a dielectric substrate A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the p... | 11/03/1998 |
| 5800859 | Copper coating of printed circuit boards A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hyd... | 09/01/1998 |
| 5798138 | Method of selectively metallising an inner, electrically insulating surface of an open body A method of selectively metallising an inner, electrically insulating surface Si of an open body (3), comprising the following steps: (a) providing a roller (2) having a resilient outer surface So ; (b) providing a layer of a suitable wet ink ... | 08/25/1998 |
| 5795618 | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as w... | 08/18/1998 |
| 5772765 | Device for processing flat workpieces, in particular printed circuit boards The flat workpieces (W) are conveyed in the vertical position on a horizontal transport path through at least one processing cell (BZ) that contains a processing bath, vertical slots (S) for the passage of the workpieces (W) being provided in the end wall... | 06/30/1998 |
| 5773132 | Protecting copper dielectric interface from delamination A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane uti... | 06/30/1998 |
| 5736065 | Chemical reducing solution for copper oxide A chemical reducing solution obtained by using an alkali boron hydride as a reductant and adding thereto a water-soluble, polyoxyethylene chain-containing organic compound having a molecular weight of 200 or above molecule as an additive has merits in tha... | 04/07/1998 |
| 5733598 | Flexible wiring board and its fabrication method A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring b... | 03/31/1998 |
| 5733599 | Method for enhancing the solderability of a surface A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.... | 03/31/1998 |
