Bizarre Patents
A hand wearable body squeegee comprising a glove portion, a concave squeegee band, and a linear squeegee band.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7368491 | Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a po... | 05/06/2008 |
| 7297370 | Curable encapsulant composition, device including same, and associated method An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionali... | 11/20/2007 |
| 7270845 | Dielectric composition for forming dielectric layer for use in circuitized substrates A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including... | 09/18/2007 |
| 7238405 | Insulating material containing cycloolefin polymer An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 μm in diameter, comprising a cycloolefin polymer containing at least 50 mol... | 07/03/2007 |
| 7198829 | Conductive organic thin film, process for producing the same, electronic device employing the same, electrical cable, electrode, pyrrolyl compound, and theienyl compound It is an object to provide a conductive organic thin film having organic molecules that include at one end a terminal bonding group that is covalently bonded to a substrate surface, a conjugate bonding group that is located at any portion of the organic molecules an... | 04/03/2007 |
| 7020959 | Method of making conductive stud for magnetic recording devices Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head el... | 04/04/2006 |
| 6998148 | Porous materials Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containi... | 02/14/2006 |
| 6852393 | Transparent substrate coated with a polymer layer The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process... | 02/08/2005 |
| 6627118 | Ni alloy particles and method for producing same, and anisotropic conductive film A crystalline Ni alloy particle for an anisotropic conductive film comprising Ni and a metalloid element such as P, B, etc. and having a structure in which a Ni intermetallic compound phase is precipitated can be produced by preparing substantially amorph... | 09/30/2003 |
| 6143356 | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards PARMOD™ materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temper... | 11/07/2000 |
| 6139904 | Method of making a printed board A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plur... | 10/31/2000 |
| 6090436 | Gold paste for a ceramic circuit board An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle... | 07/18/2000 |
| 6083557 | System and method for making a conductive polymer coating This is a system and method of forming a conductive polymer optical coating on an infrared detection system. The apparatus may include an upper vacuum chamber, a shutter assembly mounted inside the upper vacuum chamber, a substrate holder disposed inside ... | 07/04/2000 |
| 6045857 | Curable, water-borne one-component coating system using thermally labile hydrophillic groups Unsaturated hydrophobic resins modified with labile hydrophillic groups exhibit reversible solubility in water. Beta-dialkyl amino carboxylate derivatives of novolak resins are useful to make baking enamels and resists.... | 04/04/2000 |
| 5866197 | Method for producing thick crack-free coating from hydrogen silsequioxane resin This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 μm thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane res... | 02/02/1999 |
| 5801092 | Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor devices This invention provides a process for making an insulation layer for use in microelectronic devices, whereby capacitive coupling and propagation delay in the microelectronic devices are reduced. This invention can include the formation of a stable solutio... | 09/01/1998 |
| 5740606 | Method of manufacturing a set of electronic modules for electronic memory cards A method of manufacturing a set of electronic modules for memory cards, using flip chips. A plurality of through holes are formed through an insulating sheet substrate to be filled with a conductive material for the purpose of establishing electrical cont... | 04/21/1998 |
| 5725903 | Sedimentary deposition of photoresist on semiconductor wafer A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of... | 03/10/1998 |
| 5723573 | Thermosetting polyquinolines Thermosetting polyquinoline polymers, methods for preparing the polymers, and methods for curing the polymers are provided. The polymers incorporate quinoline repeat units and end groups which include a reactive acetylene functionality. On heat treatment,... | 03/03/1998 |
| 5686172 | Metal-foil-clad composite ceramic board and process for the production thereof A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetti... | 11/11/1997 |
| 5540948 | Method of coating a substrate with ceramic coating Disclosed is a method of forming a coating on a substrate. The method involves coating the substrate with a resinous co-hydrolysate having units of the formula HSi(OH)x (OR)y Oz/2 and Si(OH)a (OR)b O | 07/30/1996 |
| 5460858 | Method for forming a smooth-surfaced insulating layer A method for forming a wrinkle-free insulating layer from a resin having both photo-curing and thermosetting properties by reducing the magnitude of a concentration gradient of residual solvent in the thickness direction of the resin layer after drying th... | 10/24/1995 |
| 5451655 | Process for making thermostable coating materials Thermostable compounds are prepared by mixing perylene dianhydride with one or more aminosilanes in a molar ratio of 1:4 in an inert solvent, and the aminosilanes may comprise aminoalkylakoxysilanes. Upon heating the mixture a thermostable coating is form... | 09/19/1995 |
| 5376586 | Method of curing thin films of organic dielectric material A method of curing an organic dielectric layer, such as polyimide, used in a multichip module is disclosed. The method comprises heating the uncured polyimide layer to a temperature above its glass transition temperature, and irradiating the layer with a ... | 12/27/1994 |
| 5376414 | Expansion compensated precision extrusion method Extrusion apparatus and method includes a chamber of alterable volume having an outlet and a vent in a movable wall of the chamber to facilitate sealing the chamber upon application of force to the movable wall to displace viscous, fluid composition from ... | 12/27/1994 |
| 5376403 | Electrically conductive compositions and methods for the preparation and use thereof Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Dep... | 12/27/1994 |
| 5376209 | Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having... | 12/27/1994 |
| 5366760 | Conductive ink composition and method of forming a conductive thick film pattern A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferrin... | 11/22/1994 |
| 5336529 | Method for coating circuitboards Bubble-free solder stop lacquer coatings of circuitboards are obtained for high conductor runs and close spacing, in that one proceeds from a photopolymerizable low-solvent lacquer, which is heated to pouring viscosity through a heatable roll and doctor b... | 08/09/1994 |
| 5306741 | Method of laminating polyimide to thin sheet metal An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. There... | 04/26/1994 |
| 5298288 | Coating a heat curable liquid dielectric on a substrate A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove mo... | 03/29/1994 |
| 5290608 | Method for forming a patterned mask A patterned mask is provided on a surface by formulating a liquid, 100% solids-type thermally curable mask composition, applying the composition as a film to the surface, selectively thermally exposing the film in the desired mask pattern using a focused ... | 03/01/1994 |
| 5270117 | Preflux coating composition for copper A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene, process for protecting the solderability of co... | 12/14/1993 |
| 5268193 | Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are us... | 12/07/1993 |
| 5266349 | Method of discrete conformal coating Spray coating, particularly flat spray coating of circuit boards. Applicant's method of discrete conformal coating eliminates "railroading" at the edges of the flat spray web and assures precise control of the amount of coating material placed on the circ... | 11/30/1993 |
| 5254361 | Method for producing printed circuit boards A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partia... | 10/19/1993 |
| 5248519 | Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of therm... | 09/28/1993 |
| 5242715 | Process for coating or bonding electronic components and subassemblies In a process for coating or bonding electronic components and subassemblies with reaction resin mixtures that are stable in storage at room temperature as a one-component system for several months, reaction resin mixtures are used, which contain the follo... | 09/07/1993 |
| 5240746 | System for performing related operations on workpieces Related operations are performed on workpieces, e.g., coating and curing circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successi... | 08/31/1993 |
| 5241040 | Microwave processing A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. ... | 08/31/1993 |
