Did You Know...
...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7910157 | Substrate processing method and program In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is th... | 03/22/2011 |
| 7771779 | Planarized microelectronic substrates The instant invention is a process for planarizing a microelectronic substrate with a cross-linked polymer dielectric layer, comprising the steps of: (a) heating such a substrate coated with a layer comprising an uncured cross-linkable polymer and a glass transition... | 08/10/2010 |
| 7354623 | Surface modification of a porous organic material through the use of a supercritical fluid An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the ope... | 04/08/2008 |
| 6998148 | Porous materials Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containi... | 02/14/2006 |
| 6849294 | Method for fabricating circuit pattern of printed circuit board A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface... | 02/01/2005 |
| 6245148 | SOG dispensing system and its controlling sequences The present invention relates to a SOG (Spin-On-Glass) dispensing system and its controlling sequences and, more particularly, to a SOG dispensing system allowing for continuous production and its controlling sequences According to the present invention, ... | 06/12/2001 |
| 6205658 | Method for formation of metal wiring A metal wiring forming process in which an insulating film is formed on the principal surface of a substrate. Grooves or via holes are formed in the insulating layer and then a barrier film and a metal film in this order are formed on the substrate. There... | 03/27/2001 |
| 6139904 | Method of making a printed board A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plur... | 10/31/2000 |
| 5883219 | Integrated circuit device and process for its manufacture The invention relates to an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a porous dielectric material positioned on the circuit lines. The dielectric material comprises the reacti... | 03/16/1999 |
| 5871808 | Method for preserving solder paste in the manufacturing of printed circuit board assemblies A method for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the method utilizes a preserving device which has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine an... | 02/16/1999 |
| 5761803 | Method of forming plugs in vias of a circuit board by utilizing a porous membrane A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a... | 06/09/1998 |
| 5736191 | Microridge abrasion for selective metalization A process for selective metalization for electrically isolating areas of a substrate is disclosed. The process employs placing microridges onto a surface, the microridge protruding from the plane formed by the surface. The surface, including the microridg... | 04/07/1998 |
| 5725903 | Sedimentary deposition of photoresist on semiconductor wafer A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of... | 03/10/1998 |
| 5614250 | Coated filler and use thereof Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.... | 03/25/1997 |
| 5451655 | Process for making thermostable coating materials Thermostable compounds are prepared by mixing perylene dianhydride with one or more aminosilanes in a molar ratio of 1:4 in an inert solvent, and the aminosilanes may comprise aminoalkylakoxysilanes. Upon heating the mixture a thermostable coating is form... | 09/19/1995 |
| 5416047 | Method for applying process solution to substrates A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozz... | 05/16/1995 |
| 5363550 | Method of Fabricating a micro-coaxial wiring structure A method of fabricating a micro-coaxial wiring structure comprises forming a first insulation layer and patterning a trench therein. A first conductive layer is formed on the first insulation layer and having a shape conforming to the insulation layer and... | 11/15/1994 |
| 5317081 | Microwave processing A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. ... | 05/31/1994 |
| 5276126 | Selected novolak resin planarization layer for lithographic applications A method of planarizing topographical features on a substrate for subsequent coating of a radiation sensitive composition thereon comprising: (1) applying thereover a coating of a planarizing coating layer comprising a planarization layer of novolak resin... | 01/04/1994 |
| 5268194 | Method of packing filler into through-holes in a printed circuit board A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower o... | 12/07/1993 |
| 5256442 | Screen printing method for forming a multiplicity of printed wiring boards Method to form a photosensitive ink film having an even thickness over the entire surface of a broad plate material capable of obtaining a multiplicity of printed wiring boards. An emulsion pattern 4 is provided on a screen 3 on which a squeegee travels. ... | 10/26/1993 |
| 5254362 | Method and apparatus for deposition of solder paste on a printed wiring board A method and apparatus for uniformly depositing solder paste on a printed wiring board. A squeegee arrangement applies solder paste through a stencil to a surface of a printed wiring board. As the squeegee assembly is moved in one planar direction over th... | 10/19/1993 |
| 5248520 | Solder finishing planar leaded flat package integrated circuit leads Apparatus (10) and method for solder finishing the leads of an integrated circuit package are applicable to "flat packs" or flat packages having coplanar rows of leads (84) along sides of the flat package (75). First and second tracks (22,26) are formed w... | 09/28/1993 |
| 5240738 | Method of applying solder to a flexible circuit A flexible circuit 10 panel is coated with solder by lowering into a bath of molten solder 4. On removal from the bath excess solder is blown from the panel by air jets from one or more nozzles 22. The panel is pulled towards the nozzle by a region 60 of ... | 08/31/1993 |
| 5232736 | Method for controlling solder printer A method for controlling the mass of solder applied to a printed circuit substrate (202) by a solder printer (200), whereby the mass of solder paste (114) applied to a printed circuit substrate (202) is controlled by measuring the mass of the solder paste... | 08/03/1993 |
| 5149615 | Method for producing a planar surface on which a conductive layer can be applied A method for producing a planar surface on which conductive traces can be formed to fabricate a multi-layer integrated circuit. In this method, a substrate (20) serves as a base for the formation of conductive traces including copper conductors (30). Thes... | 09/22/1992 |
| 5116643 | Method for preparing PLZT, PZT and PLT sol-gels and fabricating ferroelectric thin films A method to produce thin films suitable for fabricating ferroelectric thin films. The method provides for selection of the predetermined amounts of lead, lanthanum, zirconium, and titanium precursors which are soluble in different solvents. Dissolving pre... | 05/26/1992 |
| 5039552 | Method of making thick film gold conductor An improved method for producing a gold conductor on a substrate in the manufacture of a thick film hybrid circuit, such that the gold conductor is suitable for wire bonding. The method comprises screen printing a fluxless gold paste on the substrate, and... | 08/13/1991 |
| 5028455 | Method for preparing plzt, pzt and plt sol-gels and fabricating ferroelectric thin films A method to produce thin films suitable for fabricating ferroelectric thin films. The method provides for selection of the predetermined amounts of lead, lanthanum, zirconium, and titanium precursors which are soluble in different solvents. Dissolving pre... | 07/02/1991 |
| 4950623 | Method of building solder bumps The invention is a method of forming a solder bump on an under bump metallurgy in which a contact pad on a substrate material is partially covered by a passivation layer upon the substrate material which is non-wettable by solder and in which the under bu... | 08/21/1990 |
| 4946710 | Method for preparing PLZT, PZT and PLT sol-gels and fabricating ferroelectric thin films A method to produce thin films suitable for fabricating ferroelectric thin films. The method provides for selection of the predetermined amounts of lead, lanthanum, zirconium, and titanium precursors which are soluble in different solvents. Dissolving pre... | 08/07/1990 |
| 4880684 | Sealing and stress relief layers and use thereof Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad ... | 11/14/1989 |
| 4851263 | Method and apparatus for application of wax on wafers A method and an apparatus for applying molten wax to one face of a wafer is disclosed. A container having an upwardly facing opening contains the molten wax. The wafer is held substantially horizontally above the opening of the container, with one face of... | 07/25/1989 |
| 4734300 | Methods for removing parylene coatings from predetermined, desired areas of a substrate Predetermined desired areas of solvent-insoluble parylene coatings are removed from substrates made of materials such as plastics, metals, composites, or ceramics by contacting the areas to be removed with a substance that causes the parylene coating to l... | 03/29/1988 |
| 4670299 | Preparation of lower alkyl polysilsesquioxane and formation of insulating layer of silylated polymer on electronic circuit board A lower alkyl polysilsesquioxane having a general formula ##STR1## wherein R is CH3 or C2 H5, and n is an integer equal to about 50 to about 10,000, prepared by (a) dissolving a lower alkyl trifunctional silane in an ... | 06/02/1987 |
| 4619837 | Polymerizable planarization layer for integrated circuit structures The invention comprises an improvement in the process of manufacturing an integrated circuit structure having stepped topography which comprises coating the integrated circuit structure with a polymerizable material in the substantial absence of a solvent... | 10/28/1986 |
| 4510173 | Method for forming flattened film A flat film can be formed on a functional structure having uneven surface formed on a semiconductor substrate firstly by applying a film-forming organic material capable of being cured by energy beams and exhibiting fluidity by heat on the uneven surface ... | 04/09/1985 |
| 4427713 | Planarization technique A method of planarizing a light sensitive coating on a substrate having topographical features is provided. The coating which comprises a novolak resin and a diazoquinone sensitizer is exposed to actinic radiation to react substantially all of the sensiti... | 01/24/1984 |
| 4416914 | Electrical conductors arranged in multiple layers and preparation thereof A low-cost electrical conductor is prepared by applying a mixture of a metallic powder and a polymer on a substrate, curing the polymer, effecting an augmentation replacement reaction to replace some of the metallic powder with a more noble metal in such ... | 11/22/1983 |
| 4352839 | Method of forming a layer of polymethyl methacrylate on a surface of silicon dioxide A method of enhancing the adhesion of polymethyl methacrylate to a surface of silicon dioxide utilizing a solution of carboxylic acid is described.... | 10/05/1982 |
