Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 7404981 | Printing electronic and opto-electronic circuits A method is provided for printing electronic and opto-electronic circuits. The method comprises: (a) providing a substrate; (b) providing a film-forming precursor species; (c) forming a substantially uniform and continuous film of the film-forming precursor species ... | 07/29/2008 |
| 7368491 | Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a po... | 05/06/2008 |
| 7297370 | Curable encapsulant composition, device including same, and associated method An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionali... | 11/20/2007 |
| 7279195 | Method of forming metal fine particle pattern and method of forming electroconductive pattern A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by... | 10/09/2007 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 05/01/2007 |
| 7211180 | Contamination-resistant gas sensor element A contamination-resistant sensor element and methods for making the same are provided. A sensor element may include a contamination-resistant coating on at least a portion thereof. The coating may comprise gamma-delta alumina and lithium oxide and may have a thickne... | 05/01/2007 |
| 7144526 | Conductive primer composition for ambient cure The present invention provides electrically conductive and flexible primer compositions that harden to form conductive materials under room temperature or low bake temperature curing conditions. The primer composition contains solvents and 40–75% by weight of film... | 12/05/2006 |
| 7108795 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/19/2006 |
| 6998148 | Porous materials Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containi... | 02/14/2006 |
| 6849294 | Method for fabricating circuit pattern of printed circuit board A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface... | 02/01/2005 |
| 6133092 | Low temperature process for fabricating layered superlattice materials and making electronic devices including same A liquid precursor containing thallium is applied to a first electrode, RTP baked at a temperature lower than 725° C., and annealed at the same temperature for a time period from one to five hours to yield a ferroelectric layered superlattice material. A... | 10/17/2000 |
| 6056994 | Liquid deposition methods of fabricating layered superlattice materials A precursor liquid comprising several metal 2-ethylhexanoates, such as strontium, tantalum, and bismuth 2-ethylhexanoates, in a xylenes/methyl ethyl ketone solvent is prepared, and deposited on a substrate. In one embodiement the substrate is placed withi... | 05/02/2000 |
| 5882722 | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds The present invention relates to a thick film formed of a mixture of metal powders and metallo-organic decomposition (MOD) compounds in an organic liquid vehicle and a process for advantageously applying them to a substrate by silk screening or other prin... | 03/16/1999 |
| 5845838 | Process for remelting a contact surface metallization Process for remelting a contact surface metallization (13) applied to a strate (10) in an inert or reducing medium, wherein the medium (18) is formed as alcoholic medium whose boiling point is the same as or above the melting point of the contact surface... | 12/08/1998 |
| 5843520 | Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers A clamp for fixturing a substrate when forming and thermally processing upon the substrate a thermally flowable layer. The clamp comprises a backing member having a top member connected through a first mechanical means to the backing member. The backing m... | 12/01/1998 |
| 5843516 | Liquid source formation of thin films using hexamethyl-disilazane A precursor liquid comprising several metal 2-ethylhexanoates, such as strontium, tantalum and bismuth 2-ethylhexanoates, in a xylenes/methyl ethyl ketone solvent is prepared, a substrate is placed within a vacuum deposition chamber, a small amount of hex... | 12/01/1998 |
| 5800856 | Mask stencil wear indicator A mask stencil (112) is made with at least one indicator line (204, 205) of material pre-removed from a wear surface (212) of the mask stencil, the depth of the line is approximately the amount of stencil mask material that can be worn from the wear surfa... | 09/01/1998 |
| 5747102 | Method and apparatus for dispensing small amounts of liquid material Apparatus and methods for dispensing droplets of liquid or viscous material are disclosed. A valve is opened to dispense a stream of the heated liquid or viscous material through an elongated orifice of a nozzle. The stream of material being dispensed fro... | 05/05/1998 |
| 5730792 | Opaque ceramic coatings Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing tungsten car... | 03/24/1998 |
| 5725143 | Method and machine for wave soldering or tinning Wave soldering or tinning machine comprising: a solder reservoir; a means that forms at least one solder wave having a laminar form and including a flat surface; a means for bringing a piece to be soldered or tinned into contact with the laminar wave; and mean... | 03/10/1998 |
| 5709905 | Apparatus and method for automatic monitoring and control of stencil printing A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (... | 01/20/1998 |
| 5706999 | Preparation of a coated metal-matrix composite material A composite material of silicon carbide particles in an aluminum matrix is base coated with a layer of a nickel-boron alloy by an electroless process. The base-coated composite material is heat treated at a temperature of about 450° C. to interdiffuse th... | 01/13/1998 |
| 5695815 | Metal carboxylate complexes for formation of metal-containing films on semiconductor devices A method of forming a metal-containing film on a substrate, such as a semiconductor wafer. The method involves depositing a Group VIII metal carboxylate complex on the substrate, wherein the Group VIII metal is selected from the group consisting of Ru, Os... | 12/09/1997 |
| 5695828 | Method for inducing electrical conductivity in zirconia ceramic surfaces A method for making a dielectric member with an integral, electrically conductive surface is made by molding a substrate from a zirconia alloy powder using a tape casting process. The resulting green substrate is sintered and after sintering may be cut to... | 12/09/1997 |
| 5693559 | Method for printing solder paste A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be sep... | 12/02/1997 |
| 5612082 | Process for making metal oxides Metals are reacted in a first solvent, such as 2-methoxyethanol, to form an initial precursor comprising metal-oxide compounds dissolved in the first solvent. A second solvent, such as xylene, that does not react with the metal is added to the solution an... | 03/18/1997 |
| 5456945 | Method and apparatus for material deposition A method and apparatus are disclosed for forming thin films of chemical compounds utilized in integrated circuits. The method includes steps of forming a precursor liquid comprising a chemical compound in a solvent, providing a substrate within a vacuum d... | 10/10/1995 |
| 5431955 | High frequency conductive material and resonator and method for making Glass, an oxide aggregate with a positive ͌&3xb5; and an oxide aggregate with a negative ͌&3xb5; are mixed in a prescribed ratio by volume so as to bring the ͌&3xb5; of a high-frequency dielectric material close to -12 ppm/°C. and bring the resonant f... | 07/11/1995 |
| 5389408 | Method for curing metal particles into continuous conductors A method and apparatus is disclosed for curing metal particles into continuous metal conductors on a nonconducting substrate. The apparatus includes a generator for supplying radio frequency energy through an impedance matching circuit to a coil positione... | 02/14/1995 |
| 5385787 | Organosilane adhesion promotion in manufacture of additive printed wiring board The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the base material with a solution containing a ureidosilane, preferably also comprising a disilyl crosslinking agent, followed by dryin... | 01/31/1995 |
| 5378508 | Laser direct writing A method for providing a conductive metal deposit on the surface of a dielectric substrate by applying a composition comprising a mixture of a salt and amine or amide compound to the substrate and subjecting the composition to a continuous wavelength lase... | 01/03/1995 |
| 5368899 | Automatic vertical dip coater with simultaneous ultraviolet cure Disclosed is an automatic vertical dip coater with simultaneous UV curing. The invention includes a method of automatically dip-coating and simultaneously UV curing a conformal coating on both sides of a circuit board including the steps of positioning a ... | 11/29/1994 |
| 5323947 | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement A method and apparatus for use in forming pre-positioned solder bumps (104) on a pad arrangement (100) of a substrate (101) include placing a predetermined pattern (306) of solder preforms (304) in contact with a meltable adhesive fluxing agent (302) on a... | 06/28/1994 |
| 5300307 | Microstructure control of Al-Cu films for improved electromigration resistance A process for the forming of Al-Cu conductive thin films with reduced electromigration failures is useful, for example, in the metallization of integrated circuits. An improved formation process includes the heat treatment or annealing of the thin film co... | 04/05/1994 |
| 5266520 | Electronic packaging with varying height connectors In joining conductors at different levels on a carrier to contact locations on a planar substrate, mound shaped connections are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bon... | 11/30/1993 |
| 5256442 | Screen printing method for forming a multiplicity of printed wiring boards Method to form a photosensitive ink film having an even thickness over the entire surface of a broad plate material capable of obtaining a multiplicity of printed wiring boards. An emulsion pattern 4 is provided on a screen 3 on which a squeegee travels. ... | 10/26/1993 |
| 5211328 | Method of applying solder A method of precisely depositing accurately defined quantities of solder onto high density circuit patterns on a substrate without use of a solder mask or the like wherein solder paste is originally deposited within a precisely defined transfer member (e.... | 05/18/1993 |
| 5197655 | Fine pitch solder application Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of ... | 03/30/1993 |
| 5151300 | Method for forming a carbon resistance in a printed wiring board The method for forming a carbon resistance in a printed wiring board is characterized in that, in a method for forming a carbon resistance in the circuit of a printed wiring board, a carbon resistance to be disposed in the circuit which is formed in a lam... | 09/29/1992 |
| 5110384 | Process for making electrically conductive patterns A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supp... | 05/05/1992 |
