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| Number | Title | Issue Date |
| 8163331 | Multilayer ceramic capacitor with terminal formed by electroless plating A terminal to, most commonly, a ceramic capacitor, most commonly a multilayer ceramic capacitor (MLCC), is formed by electroless plating, also known as electroless deposition or simply as electrodeposition. In the MLCC having a multiple parallel interior plates brou... | 04/24/2012 |
| 7351353 | Method for roughening copper surfaces for bonding to substrates The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened... | 04/01/2008 |
| 7305761 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the gr... | 12/11/2007 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
| 7011862 | Method for producing wiring substrate An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of th... | 03/14/2006 |
| 6623803 | Copper interconnect stamping A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to th... | 09/23/2003 |
| 6616967 | Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturat... | 09/09/2003 |
| 6123984 | Method and apparatus for plating a substrate A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the fine cavities with plating solution. The method comprises ... | 09/26/2000 |
| 6086946 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and sub... | 07/11/2000 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5843517 | Composition and method for selective plating This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printe... | 12/01/1998 |
| 5830533 | Selective patterning of metallization on a dielectric substrate A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the p... | 11/03/1998 |
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.... | 12/09/1997 |
| 5576053 | Method for forming an electrode on an electronic part Electrodes are formed on an electronic part by an initial step of forming electrodes on a ceramic substrate, dipping the ceramic substrate in a noble metal solution for activating the surface of the electrodes by the use of a noble metal, and forming a so... | 11/19/1996 |
| 5565235 | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated co... | 10/15/1996 |
| 5527566 | Conditioning of a polymeric substrate A polymeric substrate is exposed to an oxygen containing plasma; and then exposed to a reducing atmosphere at an elevated temperature. The reducing treatment reverses the effects on the polymer surface chemistry imparted by action of the oxidizing plasma.... | 06/18/1996 |
| 5518760 | Composition and method for selective plating This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed ci... | 05/21/1996 |
| 5503877 | Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N o... | 04/02/1996 |
| 5500315 | Processes and compositions for electroless metallization Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound ... | 03/19/1996 |
| 5425873 | Electroplating process A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating ... | 06/20/1995 |
| 5403650 | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated co... | 04/04/1995 |
| 5389496 | Processes and compositions for electroless metallization Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound ... | 02/14/1995 |
| 5385787 | Organosilane adhesion promotion in manufacture of additive printed wiring board The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the base material with a solution containing a ureidosilane, preferably also comprising a disilyl crosslinking agent, followed by dryin... | 01/31/1995 |
| 5372294 | Method of preparing a component for automated placement A method of preparing a component for automated placement is provided. The method includes disposing tacking medium on a substantially transparent member (210); engaging the tacking medium with the component (230); and imaging the component through the su... | 12/13/1994 |
| 5342501 | Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions... | 08/30/1994 |
| 5338567 | Printed circuits and base materials precatalyzed for metal deposition This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precata... | 08/16/1994 |
| 5334240 | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base Immersion tin-lead baths are provided, preferably free of hypophosphite ion, comprising a strongly acidic aqueous solution comprised of thiourea, water-soluble sources of divalent tin and lead, a weak acid, and a weak base.... | 08/02/1994 |
| 5296268 | Pretreatment process of tin lead plating A process for plating a tin-lead alloy on a substrate by displacement plating from an immersion plating solution containing dissolved tin and lead. The process includes the steps of pretreatment of a substrate by contact with a solution containing a pH ad... | 03/22/1994 |
| 5260170 | Dielectric layered sequentially processed circuit board A dielectric layered sequentially processed circuit board is disclosed. A first photodefinable resin containing an electroless plating catalyst is disposed on a substrate and portions of the substrate are exposed through the first resin. A second photodef... | 11/09/1993 |
| 5246732 | Method of providing a copper pattern on a dielectric substrate The adhesion of electroless copper to a substrate (1) for a conductor pattern can be improved by applying a SiO2 layer (3) on which a thin metal pattern of, for example, TiW (51) is provided. Anchors are formed on the surface by subjecting the ... | 09/21/1993 |
| 5227332 | Methods of plating into holes and products produced thereby In the plating of articles, particularly the filling of via-holes (16) in the manufacture of semiconductor devices, a catalyst, for example palladium, is incorporated throughout the body of material (12) to which plating is to be effected, as compared wit... | 07/13/1993 |
| 5213841 | Metal accelerator A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.... | 05/25/1993 |
| 5192581 | Protective layer for preventing electroless deposition on a dielectric A dielectric substrate is coated with a protective layer and a catalyst film is formed in a laser irradiated predetermined pattern on the protective layer so that during electroless deposition a metal is plated on the catalyst film in the predetermined pa... | 03/09/1993 |
| 5182135 | Process for improving the adherency of metallic coatings deposited without current on plastic surfaces Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization. The metal coatings produced are distinguished by good adhesion.... | 01/26/1993 |
| 5169680 | Electroless deposition for IC fabrication Electroless deposition of a conducting material on an underlying conductive region is used in a fabrication of a semiconductor device. Electroless deposition provides a selective and an additive process for forming conductive layers, filling window and pr... | 12/08/1992 |
| 5162144 | Process for metallizing substrates using starved-reaction metal-oxide reduction A unique process metallizes a substrate surface using a reducing agent including a borohydride to reduce, in a starved reaction, metal oxide particles (300) substantially uniformly distributed and at a controlled concentration in a particle-filled resin (... | 11/10/1992 |
| 5153023 | Process for catalysis of electroless metal plating on plastic A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325° C., coating said substrate with a precursor of a catalyst for the electroless deposition... | 10/06/1992 |
| 5139818 | Method for applying metal catalyst patterns onto ceramic for electroless copper deposition Photochemical and electroless metallization techniques have been combined to create high resolution circuits with line widths and spaces of about one mil on alumina substrates. In this process, small amounts of a xylene-soluble platinum metallo-organic co... | 08/18/1992 |
| 5108823 | Process for the metallization of moldings of polyarylene sulfides Circuit boards having excellent electrical and mechanical properties are obtained when special mixtures of polyarylene sulfides and polycarbonates, polyaryl ethers, polyamides, polyesters or rubber elastomers are used as base plates for the wet-chemical d... | 04/28/1992 |
| 5104688 | Pretreatment composition and process for tin-lead immersion plating Metallic surfaces to be provided with a tin-lead coating from an immersion tin-lead bath, and particularly copper surfaces (e.g., through-holes, pads) of a printed circuit board having other metallic surfaces thereon covered by a hydrophobic solder mask, ... | 04/14/1992 |
