"The abolishment of pain in surgery is a chimera. It is absurd to go on seeking it...knife and pain are two words in surgery that must forever be associated in the consciousness of the patient."
Dr. Alfred Velpeau, French surgeon ; 1839
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| Number | Title | Issue Date |
| 7166242 | Composition, organic conductive layer including composition, method for manufacturing organic conductive layers, organic EL element including organic conductive layer, method for manufacturing organic EL elements semiconductor element including organic conductive layer, method for manufacturing semiconductor elements, electronic device, and electronic apparatus To provide a composition in which the viscosity is hardly changed with the passage of time and an organic conductive layer including the composition in order to planarize the surface of a layer formed by an inkjet process and in order to stabilize the properties, a ... | 01/23/2007 |
| 6892441 | Method for forming electrically conductive pathways The present invention provides for a system and two methods for forming electrically conductive pathways. These pathways can be connected with a microchip in order to form a radio frequency identification tag. A first method uses a thermal transfer ribbon, coated wi... | 05/17/2005 |
| 6852393 | Transparent substrate coated with a polymer layer The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process... | 02/08/2005 |
| 5721007 | Process for low density additive flexible circuits and harnesses An additive electrical circuit (5) on a flexible substrate (1) fabricated by; metallization of the substrate, applying a mask pattern comprising a plating resistant material, applying a conductive circuit material in a circuit pattern that is uncovered by... | 02/24/1998 |
| 5716481 | Manufacturing method and manufacturing apparatus for ceramic electronic components According to the present invention, ceramic electronic components are produced by a process which includes the steps of forming an unbaked ceramic layer on a surface of an organic flexible supporting body by applying a ceramic paste, the surface having an... | 02/10/1998 |
| 5324535 | Process of coating printed wiring board with solid solder resist pattern formed from liquid and dry solder resist films A printed wiring board is selectively covered with solid solder resist pattern implemented by a first solder resist sub-pattern formed from liquid photo-sensitive solder resist and a second solder resist sub-pattern formed from photo-sensitive fry films, ... | 06/28/1994 |
| 5298288 | Coating a heat curable liquid dielectric on a substrate A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove mo... | 03/29/1994 |
| 5279850 | Gas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding ink A process for removing unwanted contaminant metallic oxide from the surface of a nickel branding layer of an electronic circuit package, in order to enhance the affinity of a layer of phenolic branding ink to the surface of the metallic branding layer inv... | 01/18/1994 |
| 5194295 | Ceramic articles having heat-sealable metallic coatings and method of preparation Nickel or cobalt diffusion is suppressed in ceramic articles having a nickel or cobalt underlayer followed by a gold overlayer, by heat-treating the article in a reducing atmosphere at a temperature of at least about 650° C. and subsequently depositing a... | 03/16/1993 |
| 5153023 | Process for catalysis of electroless metal plating on plastic A method of forming at least one electrically conductive path in a plastic substrate comprising providing a thermoplastic substrate having a melting point below 325° C., coating said substrate with a precursor of a catalyst for the electroless deposition... | 10/06/1992 |
| 5145741 | Converting ceramic materials to electrical conductors and semiconductors In a preferred embodiment room temperature electrically conductive or semiconductive ceramic paths or areas are produced on carbide and nitride ceramic substrates by a process of controlled oxidation using localized thermal heating (e.g., laser heating) b... | 09/08/1992 |
| 5082734 | Catalytic, water-soluble polymeric films for metal coatings Metal coated articles where the metal is electrolessly deposited onto catalytic films prepared by thermally activating catalytically inert films formed from an aqueous solution comprising polymer, e.g. cellulosic, vinyl alcohol or oxyolefin polymers, and ... | 01/21/1992 |
| 5051339 | Method and apparatus for applying solder to printed wiring boards by immersion A method for the immersion application of solder to printed wiring boards, including the steps of producing a printed wiring board with electrically conductive regions, which are to be provided with a solder deposit, surrounding the regions with a limitin... | 09/24/1991 |
| 4938996 | Via filling by selective laser chemical vapor deposition Light from a Q-switched laser passes through a metal-containing gas and through a field oxide of an integrated circuit structure. The laser light is preferentially absorbed by an underlying substrate. The substrate, but not the oxide, is heated above a th... | 07/03/1990 |
| 4891242 | Substrate of a hybrid ic, method of forming a circuit pattern and apparatus of forming the same A hybrid IC substrate has a substrate body and a retaining film which is formed on a surface of the substrate body. The retaining film enables a solution containing a circuit-element-forming material to permeate therethrough and retains the solution on th... | 01/02/1990 |
| 4464420 | Ceramic multilayer circuit board and a process for manufacturing the same A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conduc... | 08/07/1984 |
| 4391846 | Method of preparing high-temperature-stable thin-film resistors A chemical vapor deposition method for manufacturing tungsten-silicide thin-film resistors of predetermined bulk resistivity and temperature coefficient of resistance (TCR). Gaseous compounds of tungsten and silicon are decomposed on a hot substrate to de... | 07/05/1983 |
| 4303698 | Use of prolonged tack toners for the preparation of electric circuits Preparation of an electrically conductive pattern by adhering a prolonged tack toner which is activated by heating to the toner-receptive image areas of an inert substrate, the temperature is reduced and to the activated toner is applied a prolonged tack ... | 12/01/1981 |
| 4277518 | Solder-coating method A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are m... | 07/07/1981 |
| 3993808 | Method for electroless plating gold directly on tungsten or molybdenum Gold is directly plated onto tungsten or molybdenum by an electroless plating process using a plating solution including a gold compound and having pH not less than 8, and desirably not less than 9.... | 11/23/1976 |