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| Number | Title | Issue Date |
| 7968141 | Method for producing contact terminal with textured surface and use thereof The invention relates to a method for producing a contact terminal for electrical matters made of copper or a copper-base alloy in order to increase the reliability and lifetime of the contact terminal. According to the invention a textured structure is formed on th... | 06/28/2011 |
| 7344847 | Nanoscale patterning and immobilization of bio-molecules A support for immobilizing target molecules comprises a substrate having a plurality of binding regions for binding select target molecules, with target-molecule-capturing agent immobilized at the binding regions. The binding regions are intersperse among other non-... | 03/18/2008 |
| 7329366 | Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability The present invention relates to a method of polishing an implantable medical device. The method may include positioning an implantable medical device on a support. At least a portion of a surface of the implantable medical device may include a polymer. A fluid may ... | 02/12/2008 |
| 7297360 | Insulation film An insulation film comprising an organosilicon polymer and an organic polymer such as polyarylene, polyarylene ether, polyimide, and fluororesin is disclosed, wherein the organosilicon polymer has a relative dielectric constant of 4 or less and has a dry etching sel... | 11/20/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed It is an object of the present invention to provide a semiconductor wafer on which a thin, smooth, uniform and good adhesive electroless plating layer that can be suitable for a seed layer is formed, and to provide an electroless plating method which is suitable for... | 02/20/2007 |
| 7147795 | Method for surface treatment A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface treatment apparatus 1 are conveyed to the ... | 12/12/2006 |
| 7118665 | Surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode and a related sacrificial electrode The present invention discloses a surface treatment process for enhancing both the release rate of metal ions from a sacrificial electrode, and the working life of the electrode. A high density of micro pores are formed on the surface of the sacrificial electrode. C... | 10/10/2006 |
| 7108795 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under con... | 09/19/2006 |
| 7045198 | Prepreg and circuit board and method for manufacturing the same The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of ... | 05/16/2006 |
| 6974775 | Method and apparatus for making an imprinted conductive circuit using semi-additive plating A method and apparatus for making an imprinted conductive circuit using semi-additive plating. A plurality of indented channels is formed on the substrate. The surface is coated with a conductive layer. Portions of the surface other than the indented channels are co... | 12/13/2005 |
| 6141870 | Method for making electrical device A multilayer electrical device such as a printed circuit board, and method for making the electrical device, having a tooth structure for joining at least one of the layers. The method includes the following steps: providing a base; preparing the base and... | 11/07/2000 |
| 6045866 | Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, ad... | 04/04/2000 |
| 5861076 | Method for making multi-layer circuit boards The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention... | 01/19/1999 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical condu... | 09/01/1998 |
| 5800859 | Copper coating of printed circuit boards A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hyd... | 09/01/1998 |
| 5795618 | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as w... | 08/18/1998 |
| 5773132 | Protecting copper dielectric interface from delamination A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane uti... | 06/30/1998 |
| 5750212 | Process for the deposition of structured metallic coatings on glass substrates This invention relates to a process for the application of conducting metallic, structured coatings on glass substrates, for example, for the manufacture of integrated circuits. The invention relies on placing a negative mask of the structure to be applie... | 05/12/1998 |
| 5472563 | Printed circuit board and method and apparatus for making same The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. T... | 12/05/1995 |
| 5472735 | Method for forming electrical connection to the inner layers of a multilayer circuit board The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potent... | 12/05/1995 |
| 5462897 | Method for forming a thin film layer A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the under... | 10/31/1995 |
| 5420073 | Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between ... | 05/30/1995 |
| 5358604 | Method for producing conductive patterns The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mi... | 10/25/1994 |
| 5314709 | Unzippable polymer mask for screening operations The present invention relates to a dry process for forming patterns on a substrate. More particularly, the process contemplates coating an unzippable polymer film with a small amount of desirable UV if required on a substrate; laser ablating said film int... | 05/24/1994 |
| 5310580 | Electroless metal adhesion to organic dielectric material with phase separated morphology Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a ... | 05/10/1994 |
| 5290733 | Method of manufacturing semiconductor devices including depositing aluminum on aluminum leads A method of manufacturing semiconductor devices comprises steps of selectively forming metal leads on the surface a semiconductor substrate, and immersing the semiconductor substrate in a solution containing dissolved metal for depositing the dissolved me... | 03/01/1994 |
| 5211803 | Producing metal patterns on a plastic surface Poly(arylene sulfide) articles having plated metal paths thereon are disclosed. A pattern of areas of lesser crystallinity and areas of higher crystallinity is created in the polymer morphology of a surface of the article. The surface is then exposed to a... | 05/18/1993 |
| 5208067 | Surface modification of organic materials to improve adhesion A silicon modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surfac... | 05/04/1993 |
| 5173109 | Process for forming reflowable immersion tin lead deposit An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500° F. over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plu... | 12/22/1992 |
| 5169680 | Electroless deposition for IC fabrication Electroless deposition of a conducting material on an underlying conductive region is used in a fabrication of a semiconductor device. Electroless deposition provides a selective and an additive process for forming conductive layers, filling window and pr... | 12/08/1992 |
| 5167992 | Selective electroless plating process for metal conductors A method for electrolessly plating an overcoat metal on a metal conductor disposed on a dielectric surface of a substrate. The method includes removing carbonized film from the dielectric surface by applying a plasma discharge, acid treating the metal con... | 12/01/1992 |
| 5104687 | Reduced cycle process for the manufacture of printed circuits, and a composition for carrying out said process A process for manufacturing printed circuits provided with through holes, which comprises a cleaning pretreatment including a possible treatment by an organic solvent, a treatment in an alcaline solution of permanganate and a treatment for permanganate re... | 04/14/1992 |
| 5055321 | Adhesive for electroless plating, printed circuit boards and method of producing the same An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circu... | 10/08/1991 |
| 5019425 | Process for the pre-treatment of synthetic materials The invention concerns a process disclosed for the pre-treatment of synthetic materials (plastics), particularly polyetherimide, polycarbonate and poly(ester-co-carbonate), for the adhesive chemical metallization, involving treating the synthetic material... | 05/28/1991 |
| 5015519 | Molded article with partial metal plating and a process for producing such article This invention relates to a partially plated molded article and to a process for the production of a molded article which is partially plated with metal such as circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gol... | 05/14/1991 |
| 4990363 | Method of producing very adhesive metallic structures on fluorine polymers and thermoplastic synthetic materials A method of producing metallic structures on non-conductors includes the steps of metallizing the nonconductors by decomposing of metallo-organic compounds in a glow discharge with formation of a metallic film, and utilization as the non-conductors synthe... | 02/05/1991 |
| 4948630 | Three step process for treating plastics with alkaline permanganate solutions Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited me... | 08/14/1990 |
| 4917761 | Method of rendering polymeric materials hydrophilic for etching Disclosed is a method of rendering polymeric materials hydrophilic by treating the material sequentially with different solvents. The method is especially useful in the preparation of polymeric substrates for etching.... | 04/17/1990 |
| 4888208 | Ceramic substrate for printed circuits and production thereof There is provided a method of producing a ceramic substrate for printed circuits wherein at least the surface of the side to be circuit-printed is subjected to a roughening treatment with one of the following compounds: (1) substances containing sulfur trioxid... | 12/19/1989 |
