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Class 427/98.7 - Swelling


Subclass of Class 427 - Coating processes
Definition: Process in which a substrate is increased in volume or
No. of patents: 17
Last issue date: 11/07/2000


NumberTitleIssue Date
6141870Method for making electrical device
A multilayer electrical device such as a printed circuit board, and method for making the electrical device, having a tooth structure for joining at least one of the layers. The method includes the following steps: providing a base; preparing the base and...
11/07/2000
5591488Process for treating plastic surfaces and swelling solution
The invention is directed to a process for treating polymer-containing workpiece surfaces and to an aqueous non-aging solution. In addition to the swelling agents used for swelling, alkalizing agents and basic salts, the solution applied in the process co...
01/07/1997
5019425Process for the pre-treatment of synthetic materials
The invention concerns a process disclosed for the pre-treatment of synthetic materials (plastics), particularly polyetherimide, polycarbonate and poly(ester-co-carbonate), for the adhesive chemical metallization, involving treating the synthetic material...
05/28/1991
4978569Process for preparing selectively metallized articles
Disclosed is a process for preparing a selectively metallized article, and to the article prepared by this process. The process comprises: 1. swelling a polymeric article with dimethylformamide for a length of time of 1 to 5 minutes; 2. treating the polymeric ...
12/18/1990
4948630Three step process for treating plastics with alkaline permanganate solutions
Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited me...
08/14/1990
4917761Method of rendering polymeric materials hydrophilic for etching
Disclosed is a method of rendering polymeric materials hydrophilic by treating the material sequentially with different solvents. The method is especially useful in the preparation of polymeric substrates for etching....
04/17/1990
4871585Method of plating treatment
A method of plating treatment for forming a plated coating on the surface of a workpiece except on a region thereof comprises the steps of placing a masking member made of water swelling rubber in abutment against or in close proximity to the region of th...
10/03/1989
4820548Three step process for treating plastics with alkaline permanganate solutions
Process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited met...
04/11/1989
4756930Process for preparing printed circuit board thru-holes
The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear fr...
07/12/1988
4751106Metal plating process
A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows: 1. condition with an oxidant solution; 2(A). contact with a copper etchant that etches copper and neutralizes oxidant resid...
06/14/1988
4597828Method of manufacturing printed circuit boards
In order to enable fine traces to be obtained on printed circuit boards without excessive undercutting, while maintaining a high degree of adhesion, an unclad FRA board is provided with a surface butter coat which is etched to form a microporous surface l...
07/01/1986
4592852Composition and process for treating plastics with alkaline permanganate solutions
An improved alkaline permanganate composition for etching printed circuit boards is provided by incorporating a secondary oxidant in the solution capable of oxidizing manganate ion to permanganate ion....
06/03/1986
4574031Additive processing electroless metal plating using aqueous photoresist
In a method for making a printed circuit board employing an aqueous type photoresist and including etching of the substrate surface with chromic acid after application of the photoresist mask, chromium is washed from the surface with a reducing agent at a...
03/04/1986
4546010Process for producing an electrically conductive layer on the surface of a solid-body electrolyte, and electrically conductive layer
An electrically conductive layer on a solid-body electrolyte (1) is produced by swelling and impregnating an organic ion exchange material (2) with a metal salt solution, drying, converting the metal ions in a gas stream to finely distributed particles (3...
10/08/1985
4537799Selective metallization process
A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting ...
08/27/1985
4515829Through-hole plating
Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequen...
05/07/1985
4457951Etch solution and method
In manufacturing a circuit which includes the step of etching a polymeric material in the presence of exposed metallic conductors, the polymer is etched with an aqueous solution comprising chromic acid [which may be added in the form of chromic oxide (CrO...
07/03/1984
 
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