"The Americans have need of the telephone, but we do not. We have plenty of messenger boys."
Sir William Preece, chief engineer, British Post Office ; 1878
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| Number | Title | Issue Date |
| 8114468 | Methods of forming a non-volatile resistive oxide memory array A method of forming a non-volatile resistive oxide memory array includes forming a plurality of one of conductive word lines or conductive bit lines over a substrate. Metal oxide-comprising material is formed over the plurality of said one of the word lines or bit l... | 02/14/2012 |
| 8105644 | Manufacturing method of printed circuit board A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the... | 01/31/2012 |
| 8088435 | Mask, method for producing mask, and method for producing wired board A mask, through which a plurality of slender through-holes are formed, has a reinforcing section which is formed to span the through-holes, wherein recesses are provided at portions of the reinforcing section to cover the through-holes. Accordingly, a metal, which i... | 01/03/2012 |
| 8003160 | Wiring substrate A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal... | 08/23/2011 |
| 7964237 | Fully automated paste dispense process for dispensing small dots and lines A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surfa... | 06/21/2011 |
| 7897199 | Method for plating flexible printed circuit board A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating la... | 03/01/2011 |
| 7858147 | Interconnect structure and method of fabricating the same A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and t... | 12/28/2010 |
| 7851013 | Underlay substrate, screen printing method and manufacturing method of printed circuit substrate A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end ... | 12/14/2010 |
| 7833572 | Method and apparatus for dispensing a viscous material on a substrate A dispensing apparatus includes a frame, a support coupled to the frame to receive electronic substrates, a first dispensing unit to dispense viscous material, a second dispensing unit to dispense viscous material, and a gantry coupled to the frame. The gantry inclu... | 11/16/2010 |
| 7790331 | Fuel cell with film having nanowires therein A fuel cell has a substrate with a film deposited thereon. The film has nanowires dispersed therein. Catalytic activity and conductivity is substantially enhanced throughout the film. ... | 09/07/2010 |
| 7632537 | Circuits including a titanium substrate A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titan... | 12/15/2009 |
| 7537799 | Methods of forming electrically conductive pathways using palladium aliphatic amine complexes An ink-jettable composition including a palladium aliphatic amine complex solvated in a liquid vehicle can be used in formation of electronic devices. The ink-jettable composition containing a palladium aliphatic amine complex can be jetted onto a substrate in a pre... | 05/26/2009 |
| 7445809 | Method of forming gate wiring pattern by droplet discharge A pattern forming method for forming a functional film with a prescribed pattern on a substrate using a droplet discharge method, the pattern forming method includes: a sub region configuration process for: configuring, in a design pattern of the functional films a ... | 11/04/2008 |
| 7425347 | Composition for forming anti-reflective coating for use in lithography The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) havi... | 09/16/2008 |
| 7404981 | Printing electronic and opto-electronic circuits A method is provided for printing electronic and opto-electronic circuits. The method comprises: (a) providing a substrate; (b) providing a film-forming precursor species; (c) forming a substantially uniform and continuous film of the film-forming precursor species ... | 07/29/2008 |
| 7374813 | Constructive nanolithography A patterned organic monolayer or multiplayer film self-assembled on a solid substrate, the pattern consisting in a site-defined surface chemical modification non-destructively inscribed in the organic monolayer or multilayer by means of an electrically biased conduc... | 05/20/2008 |
| 7344847 | Nanoscale patterning and immobilization of bio-molecules A support for immobilizing target molecules comprises a substrate having a plurality of binding regions for binding select target molecules, with target-molecule-capturing agent immobilized at the binding regions. The binding regions are intersperse among other non-... | 03/18/2008 |
| 7338689 | Composition for forming low dielectric thin film including siloxane monomer or siloxane polymer having only one type of stereoisomer and method of producing low dielectric thin film using same Disclosed herein is a composition for forming a low dielectric thin film, which includes silane monomers having only any one of stereoisomer, or a siloxane polymer produced by polymerizing the monomers, and a method of producing the low dielectric thin film using th... | 03/04/2008 |
| 7311937 | Method for forming a line pattern, line pattern, and electro-optic device The invention provides a method for forming a uniform conductive-film interconnecting pattern via simplified processes. In particular, the invention provides: a method for forming an interconnecting pattern having at least one corner and which does not cause irregul... | 12/25/2007 |
| 7300607 | Conductive sintered compact for fixing electrodes in electronic device envelope A conductive sintered compact for fixing electrodes inside an electronic device envelope is provided. The sintered compact is made of a conductive composition calcined. The conductive composition includes at least 10 vol % to 60 vol % of Ag particles, a low melting-... | 11/27/2007 |
| 7297361 | In-line deposition processes for circuit fabrication A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by ... | 11/20/2007 |
| 7291226 | Progressive stencil printing A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the... | 11/06/2007 |
| 7285305 | Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for con... | 10/23/2007 |
| 7276185 | Conductor composition, a mounting substrate and a mounting structure utilizing the composition A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a ... | 10/02/2007 |
| 7270844 | Direct write™ system Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, paralle... | 09/18/2007 |
| 7267839 | Method of and apparatus for applying liquid material Disclosed is a method, in which when a liquid material is applied to the application surface of an object of application by using a liquid material supply device having a syringe containing the liquid material and equipped with a needle having at its distal end an e... | 09/11/2007 |
| 7267755 | Method of making a microstructure using a circuit board A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through th... | 09/11/2007 |
| 7258721 | Carbon-containing nickel-particle powder and method for manufacturing the same Carbon-containing nickel-particle powder is provided. The carbon-containing nickel-particle powder has improved shrinkage property when fired due to the presence of carbon. Also, the carbon-containing nickel-particle powder has a very restricted degree of forming ag... | 08/21/2007 |
| 7255782 | Selective catalytic activation of non-conductive substrates A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst... | 08/14/2007 |
| 7243599 | Method of fabricating color filter in display device A method of fabricating a color filter in a liquid crystal display device includes providing a plurality of clichés in which grooves are formed, filling color inks and a black resin in the grooves of the clichés, applying the color inks in the clichés onto a subs... | 07/17/2007 |
| 7237578 | Rechargeable dispensing head An adhesive liquid dispensing apparatus includes a gun manifold, a dispensing module, and a dispensing orifice. The inlet port of the gun manifold is directly coupled with a reservoir of adhesive hot melt liquid that is fixedly attached to the manifold. The contents... | 07/03/2007 |
| 7208193 | Direct writing of metallic conductor patterns on insulating surfaces A method for direct writing an electrically conductive metallic feature on an insulating substrate comprises creating a gas jet comprising metallic particles (301), ejecting the gas jet comprising metallic particles through a straight bore tube (302), ... | 04/24/2007 |
| 7204015 | Electric heating cloth method A method for producing a uniformly heated electric heating cloth comprising the steps of forming heating threads by dissolving a thermoplastic polymer in an organic solvent, adding an industrial carbon which is produced from acetylene to form a first mixture, grindi... | 04/17/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7198821 | Method of manufacturing a device, device, and electronic apparatus In this method of manufacturing a device, when discharging the liquid drops upon the substrate, a bit map made up from a plurality of pixels against which liquid drops are discharged is established upon the substrate. When establishing the pixels, when the interval ... | 04/03/2007 |
| 7198816 | Droplet ejection method of forming a film A droplet ejection patterning method of ejecting a dispersion formed by dispersing a convectable dispersoid in a dispersion medium onto a substrate including a lyophilic region and a lyophobic region. Due to a concentration difference of the dispersion, the disperso... | 04/03/2007 |
| 7189435 | Nanofabrication Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is accomplished by patterning block copolymer templates with selective expos... | 03/13/2007 |
| 7182977 | Composite substance containing metal particles, conductive paste and manufacturing method thereof A composite substance for forming a conductive paste, comprises a solvent and metal or metal compound particles. The solvent is compatible with an organic component included in the conductive paste, and the metal or metal compound particles are dried metal or metal ... | 02/27/2007 |
| 7172789 | Methods and apparatus for fluidic self assembly Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a r... | 02/06/2007 |
| 7135204 | Method of manufacturing a wiring board A method of manufacturing a wiring board is provided. The method includes performing a plating process to a land, in a condition that a resist film having an opening for exposing at least the center of the land is formed on a substrate with wires having the land for... | 11/14/2006 |