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| Number | Title | Issue Date |
| 8075945 | Manufacturing method of wiring and storage element In a coating method, such as a droplet discharge method which requires baking, it is an object of the present invention to reduce the baking temperature at the time of forming a wiring and a conductive film. As a feature of the present invention, a composition, in w... | 12/13/2011 |
| 7976894 | Materials with thermally reversible curing mechanism Novel materials with thermally reversible curing mechanisms are provided. These inventive compositions are useful in forming microelectronic structures, such as dual damascene structures. The compositions comprise a crosslinkable polymer dispersed or dissolved in a ... | 07/12/2011 |
| 7662430 | Ceramic electronic component and method for manufacturing the same The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that ... | 02/16/2010 |
| 7575776 | Reflowing of a phase changeable memory element to close voids therein A phase changeable memory element is formed by conformally forming a phase changeable material film in a contact hole on a substrate so as to create a void in the phase changeable material film in the contact hole. A capping film is formed on the phase changeable ma... | 08/18/2009 |
| 7384862 | Method for fabricating semiconductor device and display device It is an object of the present invention to alleviate unevenness due to an opening for making a contact with the lower layer even when the opening has a large diameter (1 μm or more). Thus, it is a further object of the invention to reduce defects caused by the une... | 06/10/2008 |
| 7332034 | Coating apparatus and coating method using the same To provide a coating apparatus, which can surely prevent a coating solution from spreading, to simplify a manufacturing process and reduce the manufacturing cost and provide a coating method using the same. The coating apparatus includes a holding table holding a pl... | 02/19/2008 |
| 7244286 | Copper alloy powder for electrically conductive paste A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an ave... | 07/17/2007 |
| 7238405 | Insulating material containing cycloolefin polymer An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 μm in diameter, comprising a cycloolefin polymer containing at least 50 mol... | 07/03/2007 |
| 7036712 | Methods to couple integrated circuit packages to bonding pads having vias The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an electronic assembly utilizes a mask having at least one aperture that ove... | 05/02/2006 |
| 6139904 | Method of making a printed board A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plur... | 10/31/2000 |
| 6106677 | Method of creating low resistance contacts in high aspect ratio openings by resputtering A method of producing a low resistance contact in an opening carried in a substrate is comprised of the steps of forming a first layer of conductive material along a portion of the walls of the opening. A portion of the conductive material is resputtered ... | 08/22/2000 |
| 6106890 | Method for forming a thin film of ultra-fine particles and an apparatus for the same A method and apparatus for forming a thin film of ultra-fine particles on a base body having a fine hole or groove with a large aspect ratio (larger than one). The ultra-fine particles are smaller than 0.1 μm in diameter and are made from evaporated mate... | 08/22/2000 |
| 6106891 | Via fill compositions for direct attach of devices and method for applying same The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, ... | 08/22/2000 |
| 6086793 | Method of producing electrically conductive pastes and materials using same An electrically conductive paste for use as a conductive material in multi-layered ceramic substrate is formed with an organic vehicle and electrically conductive Cu particles mixed with particles of a refractory metal such as Ni, Pd, W and Mo having a hi... | 07/11/2000 |
| 5887345 | Method for applying curable fill compositon to apertures in a substrate The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, ... | 03/30/1999 |
| 5879739 | Batch process for forming metal plugs in a dielectric layer of a semiconductor wafer A batch process for the high-pressure forming of metal plugs in the dielectric layers of semiconductor wafers. After holes are etched in the dielectric layer of each wafer, and a layer of a metal such as aluminum deposited over the dielectric, both the et... | 03/09/1999 |
| 5832595 | Method of modifying conductive lines of an electronic circuit board and its apparatus A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of com... | 11/10/1998 |
| 5802713 | Circuit board manufacturing method A circuit board manufacturing method for manufacturing a printed circuit board with improved characteristics for machine soldering. The circuit board manufacturing method includes the addition of a polyimide "B" semicured material to a printed circuit boa... | 09/08/1998 |
| 5784782 | Method for fabricating printed circuit boards with cavities A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized ... | 07/28/1998 |
| 5784781 | Manufacturing process for organic chip carrier A manufacturing process for an organic chip carrier is disclosed which permits one to form a substantially bowl-shaped via hole in the substrate of the chip carrier, which makes it easy to deposit a conductive layer having a substantially uniform thicknes... | 07/28/1998 |
| 5729893 | Process for producing a multilayer ceramic circuit substrate A method for producing a multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a main component formed onto a surface layer of the multila... | 03/24/1998 |
| 5724727 | Method of forming electronic component An electronic component (15) such as a printed circuit board (PCB) is formed using a sintering process. A layer of dielectric powder (11) is partially converted to a solid layer of dielectric material (14) by exposing selective portions of the powder (11)... | 03/10/1998 |
| 5716663 | Multilayer printed circuit Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a rea... | 02/10/1998 |
| 5702653 | Thick-film circuit element A thick-film switch element includes a high-temperature glass frit fused to a non-conductive substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thick... | 12/30/1997 |
| 5697149 | Method of coating an electronic component A technique of coating an electronic component with a resin. A semiconductor chip is placed on an insulating film carrying electric contacts to which the semiconductor chip is connected by connection wires passing through holes formed in the insulating fi... | 12/16/1997 |
| 5688565 | Misted deposition method of fabricating layered superlattice materials A precursor liquid comprising several metal 2-ethylhexanoates, such as stroritium tantalum and bismuth 2-ethylhexanoates, in a xylenes/methyl ethyl ketone solvent is prepared, a substrate is placed within a vacuum deposition chamber, the precursor liquid ... | 11/18/1997 |
| 5681444 | Electrical feedthroughs for ceramic circuit board support substrates Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass... | 10/28/1997 |
| 5607566 | Batch deposition of polymeric ion sensor membranes Screen printing technology is employed in the batch fabrication of the contacts and polymeric membranes of solid-state ion-selective sensors. The process achieves high yield with very reproducible results. Moreover, membrane thickness can easily be predet... | 03/04/1997 |
| 5599744 | Method of forming a microcircuit via interconnect A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction there... | 02/04/1997 |
| 5443672 | Process for coating circuit boards A process is disclosed for coating a circuit board with a photopolymerizable material which is applied by extension at temperatures of 100° to 180° C. followed by distributing the material under pressure by a roller.... | 08/22/1995 |
| 5376586 | Method of curing thin films of organic dielectric material A method of curing an organic dielectric layer, such as polyimide, used in a multichip module is disclosed. The method comprises heating the uncured polyimide layer to a temperature above its glass transition temperature, and irradiating the layer with a ... | 12/27/1994 |
| 5374331 | Preflux coating method Method for pretreatment of the metallic surfaces such as conductive patterns on printed wiring boards to protect against oxidation and/or other contamination. Boards are passed through successive stations to perform the following operations at least upon ... | 12/20/1994 |
| 5371029 | Process for making a leadless chip resistor capacitor carrier using thick and thin film printing A process for forming a leadless chip resistor capacitor carrier by forming a first capacitor plate using a first thick film printing sequence and forming the second capacitor plate using a second thin film printing sequence.... | 12/06/1994 |
| 5370766 | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices The fabrication of thin film inductors on a substrate, which may include thin film resistors, thin film capacitors, and semiconductor devices. In one embodiment an inductor is fabricated initially on a substrate and then integrated with other devices subs... | 12/06/1994 |
| 5359767 | Method of making multilayered circuit board A method of making a multilayered circuit board wherein at least two layered subassemblies, each comprising a dielectric layer and at least one conductive layer therein, are bonded together. Each subassembly includes a through-hole extending therethrough ... | 11/01/1994 |
| 5358604 | Method for producing conductive patterns The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mi... | 10/25/1994 |
| 5356659 | Metallization for semiconductor devices A low temperature chemical vapor deposition process is used to encapsulate aluminum conductors on the surface of a silicon substrate to form bimetallic conductors. The refractory material is desirably tungsten.... | 10/18/1994 |
| 5346719 | Tungsten metallization of CVD diamond A process for significantly improving the adhesion of a refractory metal deposited on diamond is disclosed. The process involves depositing an initial thin metal coating by low pressure chemical vapor deposition on diamond, heat treating in a non-oxidizin... | 09/13/1994 |
| 5286713 | Method for manufacturing an oxide superconducting circuit board by printing A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection patter... | 02/15/1994 |
| 5277725 | Process for fabricating a low dielectric composite substrate The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable crack... | 01/11/1994 |
