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| Number | Title | Issue Date |
| 7425347 | Composition for forming anti-reflective coating for use in lithography The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) havi... | 09/16/2008 |
| 7337535 | Hole plugging method for printed circuit boards, and hole plugging device A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 03/04/2008 |
| 7255782 | Selective catalytic activation of non-conductive substrates A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst... | 08/14/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7045198 | Prepreg and circuit board and method for manufacturing the same The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of ... | 05/16/2006 |
| 6849294 | Method for fabricating circuit pattern of printed circuit board A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface... | 02/01/2005 |
| 6245148 | SOG dispensing system and its controlling sequences The present invention relates to a SOG (Spin-On-Glass) dispensing system and its controlling sequences and, more particularly, to a SOG dispensing system allowing for continuous production and its controlling sequences According to the present invention, ... | 06/12/2001 |
| 6205658 | Method for formation of metal wiring A metal wiring forming process in which an insulating film is formed on the principal surface of a substrate. Grooves or via holes are formed in the insulating layer and then a barrier film and a metal film in this order are formed on the substrate. There... | 03/27/2001 |
| 6079100 | Method of making a printed circuit board having filled holes and fill member for use therewith A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer... | 06/27/2000 |
| 6057027 | Method of making peripheral low inductance interconnects with reduced contamination A method for making a circuit device having at least one peripheral interconnect for electrically connecting the device to another circuit device on a motherboard, includes forming at least one opening in a substrate, the opening having an inner surface e... | 05/02/2000 |
| 5761803 | Method of forming plugs in vias of a circuit board by utilizing a porous membrane A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a... | 06/09/1998 |
| 5759669 | Apparatus and method for screening green sheet with via hole using porous backing material The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the s... | 06/02/1998 |
| 5736191 | Microridge abrasion for selective metalization A process for selective metalization for electrically isolating areas of a substrate is disclosed. The process employs placing microridges onto a surface, the microridge protruding from the plane formed by the surface. The surface, including the microridg... | 04/07/1998 |
| 5630272 | Method of forming contacts through bores in multi-layer circuit boards A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is... | 05/20/1997 |
| 5622752 | Methods and system for applying a uniform coating to a moving workpiece using an ultrasonic spray head A printed circuit board ("PCB") is moved on a conveyor towards an ultrasonic spray head ("head") that is mounted below the PCB on a guide rail. The guide rail and the direction of motion of the PCB define an acute angle. When the PCB reaches a predetermin... | 04/22/1997 |
| 5607718 | Polishing method and polishing apparatus This invention provides a polishing method including the steps of forming a film to be polished on a substrate having a recessed portion in its surface so as to fill at least the recessed portion, and selectively leaving the film to be polished behind in ... | 03/04/1997 |
| 5407557 | Wiring boards and manufacturing methods thereof A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least... | 04/18/1995 |
| 5314711 | Method and apparatus for printing green-tape foil circuits A method and apparatus for processing green-tape type circuits, whereby through contacts and electrical circuits are obtained on a thin foil of alumina in the raw state or another analogous or like material containing reference holes or marks (29) and con... | 05/24/1994 |
| 5268194 | Method of packing filler into through-holes in a printed circuit board A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower o... | 12/07/1993 |
| 5254362 | Method and apparatus for deposition of solder paste on a printed wiring board A method and apparatus for uniformly depositing solder paste on a printed wiring board. A squeegee arrangement applies solder paste through a stencil to a surface of a printed wiring board. As the squeegee assembly is moved in one planar direction over th... | 10/19/1993 |
| 5246731 | Method of and apparatus for depositing solder on the terminal pads of printed circuit boards A method and apparatus for depositing solder on the terminal pads of printed circuit boards in which a solder resist layer or layers having a thickness corresponding to the desired solder height border the pads. Molten solder from a reservoir is directed ... | 09/21/1993 |
| 5061216 | Ionization chamber dosimeter A method for fabricating an ion chamber dosimeter collecting array of the type utilizing plural discrete elements formed on a uniform collecting surface which includes forming a thin insulating layer over an aperture in a frame having surfaces, forming a ... | 10/29/1991 |
| 4961955 | Solder paste applicator for circuit boards A solder paste applicator for applying solder to a selected area of a printed circuit board on which electronic components are mounted. The applicator includes a housing with a plate mounted in one end. The plate has a pattern of holes through it correspo... | 10/09/1990 |
| 4959246 | Screen printing process and apparatus and electrical printed circuits obtained therewith A process for providing through plated holes in a substrate by screen printing provides uniformly thick plating of the holes. One side of the substrate is screen plated while being subjected to an underpressure between 10 and 200 gr/cm2 from a ... | 09/25/1990 |
| 4750976 | Electrically conductive copper layers and process for preparing same Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process o... | 06/14/1988 |
| 4597989 | Method of depositing silicon films with reduced structural defects Silicon films in integrated circuits are mass produced with reduced structural defects by passing a reactant gas which contains silicon over a batch of wafers in a quartz chamber to deposit a silicon substance on both the wafers in a quartz chamber and th... | 07/01/1986 |
| 4518465 | Method of manufacturing printed wiring boards A base substrate of a printed wiring board is coated, by wet plating, with metal films over two major surfaces thereof and the inner walls of through-holes formed therein wherein the metal films formed over the inner walls of the through-holes form via-ho... | 05/21/1985 |
| 4501770 | Method for removing solder from the drill holes of empty printed circuit boards coated with solder During the pre-soldering of printed circuit boards, as a rule, also the drill holes or bores and, in particular, the through-metallized drill holes are filled in an undesirable manner with solder. This solder must be removed before mounting the electrical... | 02/26/1985 |
| 4459320 | Maskless process for applying a patterned solder mask coating A maskless process is disclosed for applying a patterned solder mask coating to a circuit board (31). In accordance with the process, there is applied to the surface (30) of the circuit board an uncured material (32) having a cure reaction which is suscep... | 07/10/1984 |
| 4301192 | Method for coating thru holes in a printed circuit substrate The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a... | 11/17/1981 |
| 3934336 | Electronic package assembly with capillary bridging connection An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends from the recess bottom to the location of a screen-printed ... | 01/27/1976 |
