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| Number | Title | Issue Date |
| 7951414 | Methods of forming electrically conductive structures Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a first conductive material while the low aspect ratio openings are only par... | 05/31/2011 |
| 7429401 | Superconformal metal deposition using derivatized substrates The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal proce... | 09/30/2008 |
| 7410666 | Metal nitride carbide deposition by ALD The present methods provide tools for growing conformal metal thin films, including metal nitride, metal carbide and metal nitride carbide thin films. In particular, methods are provided for growing such films from aggressive chemicals. The amount of corrosive chemi... | 08/12/2008 |
| 7328506 | Method for forming a plated microvia interconnect A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element included in the surface. An opening formed in the EDL exposes the conductiv... | 02/12/2008 |
| 7270845 | Dielectric composition for forming dielectric layer for use in circuitized substrates A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including... | 09/18/2007 |
| 7262135 | Methods of forming layers The invention includes methods of forming layers conformally over undulating surface topographies associated with semiconductor substrates. The undulating surface topographies can first be exposed to one or more of titanium oxide, neodymium oxide, yttrium oxide, zir... | 08/28/2007 |
| 7255782 | Selective catalytic activation of non-conductive substrates A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles and for creating circuitry for smart cards, such as phone cards is provided. The method comprises the steps of catalyzing the non-conductive subst... | 08/14/2007 |
| 7205228 | Selective metal encapsulation schemes A method and system of processing a semiconductor substrate includes, in one or more embodiments, depositing a protective layer on the substrate surface comprising a conductive element disposed in a dielectric material; processing the protective layer to expose the ... | 04/17/2007 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components... | 01/23/2007 |
| 7128844 | Metal/ceramic circuit board and method for producing same A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mix... | 10/31/2006 |
| 7011862 | Method for producing wiring substrate An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of th... | 03/14/2006 |
| 6136693 | Method for planarized interconnect vias using electroless plating and CMP An improved and new method for fabricating conducting vias between successive layers of conductive interconnection patterns in a semiconductor integrated circuit has been developed. The method utilizes a first CMP step to form a barrier lined contact hole... | 10/24/2000 |
| 6123984 | Method and apparatus for plating a substrate A method and apparatus can produce a sound metal deposit inside fine cavities fabricated on a substrate such as a semiconductor wafer through pre-plating treatment process for smoothly filling the fine cavities with plating solution. The method comprises ... | 09/26/2000 |
| 6046107 | Electroless copper employing hypophosphite as a reducing agent Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths. All four preferred electroless baths use hypophosphite as a reducing agent. The 4 baths use the following mediators (1) Nickel sulfate, (2) P... | 04/04/2000 |
| 6044550 | Process for the manufacture of printed circuit boards The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety... | 04/04/2000 |
| 5869126 | Process for the manufacture of printed circuit boards The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety... | 02/09/1999 |
| 5799393 | Method for producing a plated-through hole on a printed-circuit board A method for producing a plated-through hole on a printed-circuit board, whereby the printed-circuit board is initially bored, catalyzed, and patterned. The plated-through hole is then fashioned in an electrochemical deposition process so as to make it fu... | 09/01/1998 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical condu... | 09/01/1998 |
| 5758412 | Method of making a printed circuit board A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material;... | 06/02/1998 |
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.... | 12/09/1997 |
| 5693364 | Method for the manufacture of printed circuit boards The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety... | 12/02/1997 |
| 5680701 | Fabrication process for circuit boards A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the holes. To this end, the surface structure of the circuit bo... | 10/28/1997 |
| 5591488 | Process for treating plastic surfaces and swelling solution The invention is directed to a process for treating polymer-containing workpiece surfaces and to an aqueous non-aging solution. In addition to the swelling agents used for swelling, alkalizing agents and basic salts, the solution applied in the process co... | 01/07/1997 |
| 5578341 | Method of manufacturing printed circuit board by a build-up technique A method of manufacturing a printed wiring board by a build-up technique improves the bonding force between a conductor circuit and a resin. After the surface of the first conductor pattern is roughened by oxidation, an insulating layer is formed to expos... | 11/26/1996 |
| 5576052 | Method of metallizing high aspect ratio apertures A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures tha... | 11/19/1996 |
| 5545430 | Method and reduction solution for metallizing a surface A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu2 O particles (300) mixe... | 08/13/1996 |
| 5510139 | Process for assembly and bonding of electronic components on an insulating support In a process for assembly and bonding of electric and/or electronic components (3), provided with metal connections (11), on an insulating support (1) to be provided with strip conductors, it is provided, to increase the economic efficiency, that a cataly... | 04/23/1996 |
| 5504992 | Fabrication process of wiring board The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals.... | 04/09/1996 |
| 5503877 | Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N o... | 04/02/1996 |
| 5474798 | Method for the manufacture of printed circuit boards The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resis... | 12/12/1995 |
| 5464653 | Method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board A method for interconnecting a multilayer metal network of an electronic circuit board is provided. In the method, the electronic circuit board is made up of a plurality of superimposed metal layers having an insulating layer disposed therebetween, wherei... | 11/07/1995 |
| 5373629 | Through-hole plate printed circuit board with resist and process for manufacturing same A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporar... | 12/20/1994 |
| 5334240 | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base Immersion tin-lead baths are provided, preferably free of hypophosphite ion, comprising a strongly acidic aqueous solution comprised of thiourea, water-soluble sources of divalent tin and lead, a weak acid, and a weak base.... | 08/02/1994 |
| 5213840 | Method for improving adhesion to polymide surfaces The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline... | 05/25/1993 |
| 5214000 | Thermal transfer posts for high density multichip substrates and formation method Thermal post vias are formed within a formed multi-layer, high density interconnect including a base and plural layers of metal conductors separated by dielectric material by the steps of: removing in a single step dielectric material at predetermined sites of... | 05/25/1993 |
| 5211803 | Producing metal patterns on a plastic surface Poly(arylene sulfide) articles having plated metal paths thereon are disclosed. A pattern of areas of lesser crystallinity and areas of higher crystallinity is created in the polymer morphology of a surface of the article. The surface is then exposed to a... | 05/18/1993 |
| 5206052 | Electroless plating process An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive str... | 04/27/1993 |
| 5169680 | Electroless deposition for IC fabrication Electroless deposition of a conducting material on an underlying conductive region is used in a fabrication of a semiconductor device. Electroless deposition provides a selective and an additive process for forming conductive layers, filling window and pr... | 12/08/1992 |
| 5153024 | Process for manufacturing a printed circuit board by coating a polymeric substrate with a modified polyamine layer and further contacting the coated substrate with noble metal ions A process for the manufacture of a multilayer printed circuit board including the step of depositing a noble metal onto an electrically non-conducting substrate. The substrate is first coated with a layer of polyamine polymer modified by being contacted w... | 10/06/1992 |
| 5108786 | Method of making printed circuit boards A method for making printed circuit boards wherein the resistance of catalyzed nonconductive surfaces to solutions used in the processing stages, e.g., KOH used to remove an etch resist covering through-holes and the desired circuit lines, is enhanced by ... | 04/28/1992 |
