Bizarre Patents
A sealed crustless sandwich for providing a convenient sandwich without an outer crust which can be stored for long periods of time without a central filling from leaking outwardly.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8147904 | Metal clad laminate and method for manufacturing metal clad laminate A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; for... | 04/03/2012 |
| 8003159 | Methods and systems for processing a microelectronic topography Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an ... | 08/23/2011 |
| 7972652 | Electroless plating system An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers. ... | 07/05/2011 |
| 7858146 | Method of electrolessly depositing metal on the walls of through-holes Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the t... | 12/28/2010 |
| 7098132 | Method of manufacturing flexible wiring board In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. Aft... | 08/29/2006 |
| 7084060 | Forming capping layer over metal wire structure using selective atomic layer deposition Methods of forming a capping layer over a metal wire structure of a semiconductor device are disclosed. In one embodiment, the method includes providing a partially fabricated semiconductor device having exposed surfaces of the metal (e.g., copper) wire structure an... | 08/01/2006 |
| 7070709 | Dust suppressant and soil stabilization composition Disclosed are dust suppressant and aggregate stabilization compositions. In accordance with the subject disclosure, hemicellulose is used as a dust suppressant and/or as a stabilization composition for aggregates such as a road bed or soil field. Other ingredients m... | 07/04/2006 |
| 7049234 | Multiple stage electroless deposition of a metal layer A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv... | 05/23/2006 |
| 6954985 | Method for plugging holes in a printed circuit board A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 10/18/2005 |
| 6926922 | PWB manufacture A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and co... | 08/09/2005 |
| 6911229 | Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interl... | 06/28/2005 |
| 6245380 | Method of forming bonding pad A method of forming bonding pad commences by forming a conformal barrier layer on a provided inter-metal dielectric layer. A first metal layer is formed on the barrier layer to partially fill the trench. A thin glue layer is formed on the first metal laye... | 06/12/2001 |
| 5840363 | Process for throughplating printed circuit boards using conductive plastics The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circu... | 11/24/1998 |
| 5837427 | Method for manufacturing build-up multi-layer printed circuit board A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip size package) or portable phones. In the build-up multi-la... | 11/17/1998 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical condu... | 09/01/1998 |
| 5746903 | Wet chemical processing techniques for plating high aspect ratio features Methods of forming high-aspect ratio blind apertures and thereafter filling the apertures with a plating solution are disclosed. A layer of photosensitive material is pattern exposed to actinic radiation to define the apertures, and thereafter exposed to ... | 05/05/1998 |
| 5721007 | Process for low density additive flexible circuits and harnesses An additive electrical circuit (5) on a flexible substrate (1) fabricated by; metallization of the substrate, applying a mask pattern comprising a plating resistant material, applying a conductive circuit material in a circuit pattern that is uncovered by... | 02/24/1998 |
| 5716760 | Method for plating a substrate to eliminate the use of a solder mask A novel process for plating a substrate without solder mask wherein the substrate is coated with a polymer catalyst to assist adhesion of conductive metal to the substrate. Next, a first plating mask photopolymer, or plating resist, is coated over the pol... | 02/10/1998 |
| 5683743 | Manufacturing circuit boards dipped in molten solder Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with t... | 11/04/1997 |
| 5593720 | Process for making a multileveled electronic package A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in prepari... | 01/14/1997 |
| 5549808 | Method for forming capped copper electrical interconnects The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semicondu... | 08/27/1996 |
| 5545429 | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a p... | 08/13/1996 |
| 5472735 | Method for forming electrical connection to the inner layers of a multilayer circuit board The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potent... | 12/05/1995 |
| 5458763 | Method for forming wiring pattern A wiring pattern forming method in which side etch of a wiring pattern at the time of etching the substrate copper foil of a copper plating pattern is reduced to hold down an increase in line resistance, the wiring pattern forming method including the ste... | 10/17/1995 |
| 5358604 | Method for producing conductive patterns The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mi... | 10/25/1994 |
| 5308796 | Fabrication of electronic devices by electroless plating of copper onto a metal silicide It has been found that selective metallization in integrated circuits is expeditiously achieved through a copper plating procedure. In this process, palladium silicide is used as a catalytic surface and an electroless plating bath is employed to introduce... | 05/03/1994 |
| 5264065 | Printed circuits and base materials having low Z-axis thermal expansion A base material for printed wiring boards is formed by laminating together layers of prepregs of woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which is present in an amount sufficient to provide ... | 11/23/1993 |
| 5153987 | Process for producing printed wiring boards By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and ef... | 10/13/1992 |
| 5116463 | Detecting completion of electroless via fill A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive met... | 05/26/1992 |
| 4948630 | Three step process for treating plastics with alkaline permanganate solutions Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited me... | 08/14/1990 |
| 4913931 | Method and solution for the prevention of smear in the manufacture of printed circuit boards A solution and a method of using it for preventing smear in the manufacture of printed circuit boards includes monoethanolamine combined with a fatty acid for neutralizing the active amine except in the presence of relatively high heat, and a surface tens... | 04/03/1990 |
| 4873122 | Treating laminates with a wetting/reducing solution after desmearing with permanganate An aqueous composition is provided for treating a laminate in the manufacture of a printed circuit board, the composition comprising a wetting agent, which has a positively charged quaternary nitrogen atom, and a reducing agent which is compatible with th... | 10/10/1989 |
| 4867839 | Process for forming a circuit substrate A process for forming a circuit substrate comprising placing an electrodeposited metal foil having a rough surface provided with a large number of fine projections in a cavity of a mold in such a manner that the rough surface faces an inside of the mold c... | 09/19/1989 |
| 4820548 | Three step process for treating plastics with alkaline permanganate solutions Process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited met... | 04/11/1989 |
| 4770900 | Process and laminate for the manufacture of through-hole plated electric printed-circuit boards A process for the manufacture of through-hole plated electric printed-circuit boards is described, in which a board of an insulating material is provided with plated-through holes which are arranged in a grid pattern and the walls of which are coated with... | 09/13/1988 |
| 4756930 | Process for preparing printed circuit board thru-holes The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear fr... | 07/12/1988 |
| 4693907 | Process or non-electrolytic copper plating for printed circuit board A printed circuit board having a multi-layered copper plating film with excellent mechanical characteristics is obtained by a process of non-electrolytic copper plating comprising at least one sequence of the following steps (a)-(d): (a) immersing the pri... | 09/15/1987 |
| 4661375 | Method for increasing the height of solder bumps The height of solder bumps (10) on a bonding pad (24) of a semiconductor chip (12) is increased by successively immersing the chip in molten solder alloys having progressively lower melting points.... | 04/28/1987 |
| 4605471 | Method of manufacturing printed circuit boards A method of producing a printed circuit board comprising the steps of applying a layer of electrically conductive material on at least one side of a printed circuit board, cleaning the surface of the electrical conductive layer, printing a plating resist ... | 08/12/1986 |
| 4597988 | Process for preparing printed circuit board thru-holes The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear fr... | 07/01/1986 |
