Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 7404251 | Manufacture of printed circuit boards with stubless plated through-holes A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertica... | 07/29/2008 |
| 7240419 | Method of manufacturing a magnetoresistance effect element A method of manufacturing a magnetoresistance effect element includes forming an insulating layer on a first ferromagnetic layer, forming an aperture reaching the first ferromagnetic layer by thrusting a needle from the top surface of the insulating layer, and depos... | 07/10/2007 |
| 7005236 | Maintaining photoresist planarity at hole edges Maintaining photoresist thickness and uniformity over a substrate that includes various cavities presents problems, such as preventing distortion of features in the resist image close to cavity edges. These problems have been overcome by laying down the photoresist ... | 02/28/2006 |
| 6926922 | PWB manufacture A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and co... | 08/09/2005 |
| 6114098 | Method of filling an aperture in a substrate An aperture in an electronic substrate is filled with a filling material without need for a specially built fill mask. A layer of tape or tentable photosensitive dielectric film is applied to one surface of the substrate covering the aperture. An opening ... | 09/05/2000 |
| 5804248 | Solder paste deposition A multi-layer stencil is disclosed for applying solder paste to a printed circuit board. The stencil is formed from first and second layers of stencil material, e.g., stainless steel sheet, the second layer overlying the first layer in selected areas ther... | 09/08/1998 |
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or ... | 05/05/1998 |
| 5729897 | Method of manufacturing multilayer foil printed circuit boards Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in insulator layers, with resist openings of surface structu... | 03/24/1998 |
| 5723367 | Wiring forming method A wiring forming method includes a step of forming an oxide film on a silicon substrate, a step of forming a connection hole whose aspect ratio is larger than 1 in the insulation film, a step of forming an Al wiring film on the entire surface by the bias ... | 03/03/1998 |
| 5666722 | Method of manufacturing printed circuit boards A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substanti... | 09/16/1997 |
| 5584956 | Method for producing conductive or insulating feedthroughs in a substrate A method for producing feedthroughs in a substrate having a front and back surface, wherein the substrate either has a hole or absorbs radiation at a given wavelength. The method includes selecting and intimately bonding a sheet to the back surface of the... | 12/17/1996 |
| 5490325 | Guarded printed circuit board islands Low dielectric absorption component connection points are created on a printed circuit board by cutting apertures in the board surrounding the points, leaving only narrow stems still connecting the resulting island to the board.... | 02/13/1996 |
| 5456942 | Method for fabricating a circuit element through a substrate An improved method for fabricating a circuit element through a substrate permits fabrication of large geometry vias between substrate sides. The improved method includes disposing a substrate (327) between two compressible layers (317, 339). Each of the l... | 10/10/1995 |
| 5376232 | Method of manufacturing a printed circuit board A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, dep... | 12/27/1994 |
| 5314710 | Insulation layer forming method An insulation layer forming method for processing a substrate having a first surface area covered with a photo resist mask pattern and a second surface area uncovered with the photo resist mask pattern to form an SiO2 insulation layer on the second surfac... | 05/24/1994 |
| 5304392 | Method of manufacturing printed wiring board According to the present invention, inequality in the film thickness of the solder resist and the occurrence of the blur can be eliminated, and it is possible to perform a screen printing for the solder resist with a minute pattern which leads to the form... | 04/19/1994 |
| 5277929 | Method for masking through holes in manufacturing process of printed circuit board A method for masking through-holes during the manufacture of a printed circuit board comprises providing a substrate having a plurality of through-holes. A removable masking seal comprised of a soluble material, a light-setting material or a thermo-settin... | 01/11/1994 |
| 5208068 | Lamination method for coating the sidewall or filling a cavity in a substrate Method for pressing a material into a through-hole or blind-hole in a substrate. The material is disposed on the surface of the substrate. An environment is provided permitting the material to flow for example by heating the material to the glass transiti... | 05/04/1993 |
| 5194313 | Through-hole plated printed circuit board and process for manufacturing same A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by... | 03/16/1993 |
| 5140745 | Method for forming traces on side edges of printed circuit boards and devices formed thereby During the manufacture of a printed circuit board, holes are drilled not only in accordance with a particular circuit board pattern, but also along the lines which will define edges of the board at the positions where traces are to appear. All of the hole... | 08/25/1992 |
| 5132038 | Composition for preparing printed circuit through-holes for metallization Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solut... | 07/21/1992 |
| 5124175 | Method of patterned metal reflow on interconnect substrates Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the mel... | 06/23/1992 |
| 5108785 | Via formation method for multilayer interconnect board A method of boring holes in a circuit board assembly of the type having a first layer of material which is primarily reflective of light of a first light wavelength and having a second layer of material, overlying the first layer of material, which is pri... | 04/28/1992 |
| 5094811 | Method of making a printed circuit board The invention is a method for making an electrically conductive path on the wall of a passage through a substrate. It is especially useful for connecting electrically conductive paths (25) on opposite sides of a circuit board (20). The method is character... | 03/10/1992 |
| 5091218 | Method for producing a metallized pattern on a substrate A method of producing a metallized pattern on a substrate includes the steps of providing a substrate having a high aspect ratio groove defining a desired metallization pattern and applying metallization to the substrate. The high aspect ratio groove is u... | 02/25/1992 |
| 5079065 | Printed-circuit substrate and method of making thereof The present invention is directed toward a printed-circuit substrate comprisng a first layer having through holes formed through a sheet impregnated with resin which shows a half-hardened property at the time of impregnation, a first electrically conducti... | 01/07/1992 |
| 4952420 | Vapor deposition patterning method An etchless patterning method for depositing material patterns upon substrates. The method involves providing substrate to be patterned, immobilizing a patterned physical mask upon a mask carrier, transferring the mask from the carrier to contact the subs... | 08/28/1990 |
| 4938996 | Via filling by selective laser chemical vapor deposition Light from a Q-switched laser passes through a metal-containing gas and through a field oxide of an integrated circuit structure. The laser light is preferentially absorbed by an underlying substrate. The substrate, but not the oxide, is heated above a th... | 07/03/1990 |
| 4919970 | Solder deposition control A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the h... | 04/24/1990 |
| 4908346 | Crystalline rare earth alkaline earth copper oxide thick film circuit element with superconducting onset transition temperature in excess of 77% Thick film circuit elements are disclosed comprised of an insulative substrate selected from the group consisting of strontium titanate, magnesia, alumina, and aluminum nitride, and providing a conductive path between at least two locations on the substra... | 03/13/1990 |
| 4808435 | Screen printing method for producing lines of uniform width and height An improved method for screen printing fine lines of conductive paste on a substrate wherein a mask having a desired pattern of line shaped openings is placed on the substrate, and conductive paste screened in the openings in the mask in contact with the ... | 02/28/1989 |
| 4781495 | Dry lubricant drilling of thru-holes in printed circuit boards Thru-holes are drilled in a printed circuit board panel having alternating dielectric layers and electrically conductive layers. A water soluble dry film lubricant sheet is placed adjacent an electrically conductive outer layer of the panel prior to drill... | 11/01/1988 |
| 4756929 | High density printing wiring Densely packed high resolution printed wiring boards may be achieved by providing channels below grade in a substrate planar surface, thereby providing greater conductor width for closely spaced conductors. By mechanically removing the substrate surface b... | 07/12/1988 |
| 4728568 | Masking tape for use in manufacturing a printed board Disclosed is a masking tape suitable for use in manufacturing a printed circuit board. The masking tape comprises a water soluble paper as a tape base material, and a water soluble adhesive agent applied to one side of the paper. A method of filling throu... | 03/01/1988 |
| 4610758 | Manufacture of printed circuit boards A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be ... | 09/09/1986 |
| 4581098 | MLC green sheet process Disclosed is a method of forming a trench pattern in a ceramic green sheet for subsequently filling with a conductive paste resulting in a fully inlaid conductor pattern therefrom. Starting with a green sheet, a high contrast ink drawing of the desired co... | 04/08/1986 |
| 4532152 | Fabrication of a printed circuit board with metal-filled channels A plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths. Both the surfaces of the channels and the non-channel surfaces therebetween are metalling through one ... | 07/30/1985 |
| 4301192 | Method for coating thru holes in a printed circuit substrate The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a... | 11/17/1981 |
| 4290195 | Methods and articles for making electrical circuit connections employing composition material Composition material, preferably comprising solder-coated copper particles, is loaded into a defined space which preferably comprises a hole drilled into a circuit board to expose a surface of at least one internal conductor. The loaded composition materi... | 09/22/1981 |
| 4263341 | Processes of making two-sided printed circuit boards, with through-hole connections Printed circuits, and techniques and materials for making printed circuits by prior-known metal-spraying techniques, particularly for making two-sided boards with metal through-hole connects. Preferably, a primer coating (40) of a metal such as zinc is sp... | 04/21/1981 |
