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| Number | Title | Issue Date |
| 8187670 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device A method for manufacturing an electro-optical device in which thin film layers are formed by drying droplets containing a thin film layer formation material, and these thin film layers are laminated to form a light emitting element, includes mixing lyophilic micropa... | 05/29/2012 |
| 8182864 | Modification method of microchannels of PDMS microchip using sol-gel solution The present invention provides a method for modification of microchannels of a polydimethylsiloxane (PDMS) microchip, which includes the steps of: a) mixing an alkoxysilane precursor, an alkyl alkoxysilane precursor, and a solvent to prepare a sol-gel solution; b) o... | 05/22/2012 |
| 7910156 | Method of making circuitized substrate with selected conductors having solder thereon A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder cov... | 03/22/2011 |
| 7807215 | Method of manufacturing copper-clad laminate for VOP application Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing tw... | 10/05/2010 |
| 7651725 | Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond A method and apparatus for depositing a low dielectric constant film by reaction of an organo silane compound and an oxidizing gas. The oxidized organo silane film has excellent barrier properties for use as a liner or cap layer adjacent other dielectric layers. The... | 01/26/2010 |
| 7438945 | Method of producing multilayer interconnection board A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hol... | 10/21/2008 |
| 7425347 | Composition for forming anti-reflective coating for use in lithography The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) havi... | 09/16/2008 |
| 7410666 | Metal nitride carbide deposition by ALD The present methods provide tools for growing conformal metal thin films, including metal nitride, metal carbide and metal nitride carbide thin films. In particular, methods are provided for growing such films from aggressive chemicals. The amount of corrosive chemi... | 08/12/2008 |
| 7328506 | Method for forming a plated microvia interconnect A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element included in the surface. An opening formed in the EDL exposes the conductiv... | 02/12/2008 |
| 7320173 | Method for interconnecting multi-layer printed circuit board A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer expos... | 01/22/2008 |
| 7313858 | Method for manufacturing a magnetic head coil structure and/or pole tip structure A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the pho... | 01/01/2008 |
| 7281328 | Method of fabricating rigid-flexible printed circuit board The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an ext... | 10/16/2007 |
| 7273811 | Method for chemical vapor deposition in high aspect ratio spaces A method of depositing conformal film into high aspect ratio spaces includes the step of forming a gradient of precursor gas inside the space(s) prior to deposition. The gradient may be formed, for example, by reducing the pressure within the deposition chamber or b... | 09/25/2007 |
| 7240431 | Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is formed along the wall surface of the through-hole | 07/10/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 05/01/2007 |
| 7178234 | Method of manufacturing multi-layer printed circuit board Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the... | 02/20/2007 |
| 7141269 | Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The... | 11/28/2006 |
| 7132134 | Staggered in-situ deposition and etching of a dielectric layer for HDP CVD A method and apparatus for depositing a conformal dielectric layer employing a dep-etch technique features selectively reducing the flow of deposition gases into a process chamber where a substrate having a stepped surface to be covered by the conformal dielectric l... | 11/07/2006 |
| 7100267 | Magnetic head, method for producing same, and magnetic recording and/or reproducing system A method for producing a magnetic head, including the steps of forming a magnetic body on a substrate, the magnetic body including a principal plane facing the substrate and a rear plane opposite to the principal plane; applying a beam to the rear plane of the magne... | 09/05/2006 |
| 7093356 | Method for producing wiring substrate A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, elec... | 08/22/2006 |
| 7062850 | Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length A method of forming an electrical conductor, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and electromigraation-inhibiting material is deposited over the planar su... | 06/20/2006 |
| 7036222 | Method for forming a multi-layer circuit assembly A method of making a multi-layer circuit assembly includes providing a core structure including an inner dielectric element having first and second metal layers on opposite surfaces thereof, forming one or more through vias extending through the metal layers and the... | 05/02/2006 |
| 7018672 | Circuit board producing method and circuit board producing device A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole for... | 03/28/2006 |
| 6959471 | Method of manufacturing a droplet deposition apparatus A method of manufacturing an ink jet print head includes the steps of bonding a body of piezoelectric material to a base plate and cutting channels into the piezoelectric material to form ink chambers which are actuated by applying voltages to electrodes provided on... | 11/01/2005 |
| 6935023 | Method of forming electrical connection for fluid ejection device A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection de... | 08/30/2005 |
| 6926922 | PWB manufacture A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and co... | 08/09/2005 |
| 6921505 | Hole filling using an etched hole-fill stand-off An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the st... | 07/26/2005 |
| 6911229 | Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interl... | 06/28/2005 |
| 6886248 | Conductive material and method for filling via-hole The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive materi... | 05/03/2005 |
| 6849294 | Method for fabricating circuit pattern of printed circuit board A circuit pattern fabrication method of a printed circuit board includes: a first step of forming a resin layer at a surface of an insulation material; a second step of selectively removing the resin layer; a third step of forming a metal plated layer at the surface... | 02/01/2005 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, ... | 10/24/2000 |
| 6068879 | Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing A process of inhibiting a corrosion of metal plugs formed in integrated circuits is described. The corrosion inhibiting process includes providing a partially fabricated integrated circuit surface including the metal plugs on a polishing pad to carry out ... | 05/30/2000 |
| 5882720 | Monitoring deposited pads Automatically monitoring pads of material deposited on a surface of a workpiece using an inspection system that senses a deposited pad of material and determines pad height values at a plurality of locations across the pad, and a shape classifier that rec... | 03/16/1999 |
| 5879738 | Method for fluid transport for the surface treatment of planar substrates An apparatus and method for treating the walls of apertures passing through a planar substrate with a fluid treatment solution. The method comprises placement of a pressurized fluid wedge beneath, above, or both beneath and above a planar substrate as it ... | 03/09/1999 |
| 5863598 | Method of forming doped silicon in high aspect ratio openings A method of forming a doped silicon film on a substrate. According to the present invention, a substrate is placed in a reaction chamber and heated. Next, a silicon containing gas is fed into the reaction chamber to produce a silicon containing gas partia... | 01/26/1999 |
| 5711806 | Printed circuit board processing apparatus A machine for use in chemically processing printed circuit board work pieces includes an inner basin within an outer basin. The inner basin holds a chemical liquid bath through which the printed circuit board work pieces are passed by a conveyor in a hori... | 01/27/1998 |
| 5690805 | Direct metallization process A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate i... | 11/25/1997 |
| 5622752 | Methods and system for applying a uniform coating to a moving workpiece using an ultrasonic spray head A printed circuit board ("PCB") is moved on a conveyor towards an ultrasonic spray head ("head") that is mounted below the PCB on a guide rail. The guide rail and the direction of motion of the PCB define an acute angle. When the PCB reaches a predetermin... | 04/22/1997 |
| 5595943 | Method for formation of conductor using electroless plating A method for forming a conductor circuit is provided which comprises depositing and filling a conductor metal in recessions of insulator in the form of grooves or holes using an electroless plating solution, the conductor metal being deposited and filled ... | 01/21/1997 |
