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| Number | Title | Issue Date |
| 8021712 | Wafer and manufacturing method of electronic component The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer according to the present invention, a plurality of elements connected to... | 09/20/2011 |
| 7611747 | Insulating material, method for producing insulating material, method for manufacturing multilayer circuit board This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a multi-layer circuit board using the insulating material. The invention provides... | 11/03/2009 |
| 7425350 | Apparatus, precursors and deposition methods for silicon-containing materials A method for making a Si-containing material comprises transporting a pyrolyzed Si-precursor to a substrate and polymerizing the pyrolyzed Si-precursor on the substrate to form a Si-containing film. Polymerization of the pyrolyzed Si-precursor may be carried out in ... | 09/16/2008 |
| 7351361 | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or elect... | 04/01/2008 |
| 7238613 | Diffusion-enhanced crystallization of amorphous materials to improve surface roughness Methods of forming a roughened surface through diffusion-enhanced crystallization of an amorphous material are disclosed. In one aspect, conductive hemispherical grain silicon can be formed through dopant diffusion-enhanced crystallization of one or more layers of a... | 07/03/2007 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 05/01/2007 |
| 7105200 | Method of producing thick-film sheet member A thick-film sheet member producing method including: (a) a support-body preparing step of preparing a support body having a film formation surface provided by a particle layer constituted by high-melting-point particles which are held together with a resin and whic... | 09/12/2006 |
| 6205658 | Method for formation of metal wiring A metal wiring forming process in which an insulating film is formed on the principal surface of a substrate. Grooves or via holes are formed in the insulating layer and then a barrier film and a metal film in this order are formed on the substrate. There... | 03/27/2001 |
| 6143362 | Chemical vapor deposition of titanium A titanium layer is formed on a substrate with chemical vapor deposition (CVD). First, a seed layer is formed on the substrate by combining a first precursor with a reducing agent by CVD. Then, the titanium layer is formed on the substrate by combining a ... | 11/07/2000 |
| 6133092 | Low temperature process for fabricating layered superlattice materials and making electronic devices including same A liquid precursor containing thallium is applied to a first electrode, RTP baked at a temperature lower than 725° C., and annealed at the same temperature for a time period from one to five hours to yield a ferroelectric layered superlattice material. A... | 10/17/2000 |
| 6083557 | System and method for making a conductive polymer coating This is a system and method of forming a conductive polymer optical coating on an infrared detection system. The apparatus may include an upper vacuum chamber, a shutter assembly mounted inside the upper vacuum chamber, a substrate holder disposed inside ... | 07/04/2000 |
| 6045866 | Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, ad... | 04/04/2000 |
| 5866197 | Method for producing thick crack-free coating from hydrogen silsequioxane resin This invention pertains to a method for producing crack-free, insoluble, greater than 1.25 μm thick coatings from hydrogen silsesquioxane resin compositions. The method for producing the coating comprises applying a fillerless hydrogen silsesquioxane res... | 02/02/1999 |
| 5863620 | Process and apparatus for coating printed circuit boards A process for coating printed circuit boards with a coating composition that is crosslinkable by electromagnetic radiation, especially UV radiation, using the roll coating process, is distinguished by the following process steps: a photopolymerisable, mel... | 01/26/1999 |
| 5861076 | Method for making multi-layer circuit boards The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention... | 01/19/1999 |
| 5800859 | Copper coating of printed circuit boards A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hyd... | 09/01/1998 |
| 5759616 | Process for producing microstructure components on a substrate In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the... | 06/02/1998 |
| 5736190 | Exterior protective layer for an electrical component An electrical component comprising an electrical component having an exterior protective layer on at least a portion of a surface. The layer is a cured copolymer of a reaction between at least one oligomer having a terminal ethylenically unsaturated group... | 04/07/1998 |
| 5730792 | Opaque ceramic coatings Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing tungsten car... | 03/24/1998 |
| 5725143 | Method and machine for wave soldering or tinning Wave soldering or tinning machine comprising: a solder reservoir; a means that forms at least one solder wave having a laminar form and including a flat surface; a means for bringing a piece to be soldered or tinned into contact with the laminar wave; and mean... | 03/10/1998 |
| 5723171 | Integrated circuit electrode structure and process for fabricating same An electrode for a ferroelectric electronic device is formed on an SiO2 isolation layer by depositing an adhesion layer, such as titanium, between about 25 Å and 500 Å thick, then a layer of a nobel metal, such as platinum, that is at least 1... | 03/03/1998 |
| 5689879 | Metal foil for printed wiring board and production thereof A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed... | 11/25/1997 |
| 5686172 | Metal-foil-clad composite ceramic board and process for the production thereof A metal-foil-clad composite ceramic board produced by impregnating by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetti... | 11/11/1997 |
| 5618576 | Lead frame manufacturing method A method for making a lead frame comprising overflow plating the lead frame to form a plating layer thereon; and heating the plated lead frame at a predetermined temperature to rearrange the plating layer. Therefore, the rearrangement of the overflow-plat... | 04/08/1997 |
| 5593720 | Process for making a multileveled electronic package A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in prepari... | 01/14/1997 |
| 5593499 | Dual air knife for hot air solder levelling A dual air knife assembly for removing excess solder and leveling any remaining solder on a passing circuit board with a gas from a gas source in accordance with the present invention includes a first and second air knife. The first air knife has a first ... | 01/14/1997 |
| 5560537 | Automatic soldering The automatic soldering of printed circuit boards wherein different boards can be simultaneously processed at different stations, e.g. a fluxing station, a preheating station and a soldering station. An identification station in advance of the fluxing sta... | 10/01/1996 |
| 5388754 | Method utilizing water soluble masking formulation for producing an article A water-soluble coating or other deposit is produced from a formulation that is comprised of a curable liquid substance and a dispersed, particulate effervescing agent. The formulation is particularly useful as a solder resist in the manufacture of PCBs, ... | 02/14/1995 |
| 5386624 | Method for underencapsulating components on circuit supporting substrates A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402),... | 02/07/1995 |
| 5363550 | Method of Fabricating a micro-coaxial wiring structure A method of fabricating a micro-coaxial wiring structure comprises forming a first insulation layer and patterning a trench therein. A first conductive layer is formed on the first insulation layer and having a shape conforming to the insulation layer and... | 11/15/1994 |
| 5356756 | Application of microsubstrates for materials processing Arrays of microfabricated hotplates have been used as substrate arrays for materials processing on a microscopic scale. Properties of individual elements (pixels) of the array, such as temperature and voltage bias, are controlled by addressing a given pix... | 10/18/1994 |
| 5290606 | Method for manufacturing a substrate for a printed circuit board In a method for the manufacture of a substrate for electrical components, a base of metallic material is first sandblasted and thereafter coated by means of a thermal process with a bonding layer of, for example, copper powder. Then the bonding layer is c... | 03/01/1994 |
| 5287620 | Process of producing multiple-layer glass-ceramic circuit board A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder ... | 02/22/1994 |
| 5268193 | Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are us... | 12/07/1993 |
| 5198264 | Method for adhering polyimide to a substrate A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator s... | 03/30/1993 |
| 5112428 | Wet lamination process and apparatus Apparatus for wet laminating a photopolymerizable film onto circuit board panels or other substrates. The apparatus is easily and quickly convertible from dry laminating to wet laminating with the rollers therefor mounted in bearing blocks which are inser... | 05/12/1992 |
| 5110384 | Process for making electrically conductive patterns A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supp... | 05/05/1992 |
| 5106462 | Process of producing copper plated resin article Process for producing a copper plated resin article by forming a uniform copper coating having excellent adhesive strength on a fiber-reinforced or unreinforced thermoplastic or thermosetting resin article having a heat deformation temperature higher than... | 04/21/1992 |
| 5076864 | Process for producing multilayer printed wiring board A process for producing a multilayer printed wiring board, characterized in that copper surface of internal layer(s) is chemically oxidized, thereby forming a brown or black, oxidized copper surface on the internal layer board; and said oxidized copper su... | 12/31/1991 |
| 5061550 | Multilayer material having a resistance layer formed on an electrically conductive layer and a multilayer board for a printed circuit board which has a resistance layer An article of manufacture in form of a multilayer material includes (a) a conductive layer made of an electrically highly conductive material, (b) a resistance layer formed on the conductive layer, the resistance layer being made of an electrical resistance materia... | 10/29/1991 |
