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| Number | Title | Issue Date |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7371453 | Decorative sheet, molded article, and motor vehicle provided with the same A decorative sheet includes a base member, made of a resin material and having a first and a second principal surfaces opposite to each other, a decoration layer provided on the first principal surface of the base member and having a pattern area representing a pred... | 05/13/2008 |
| 7372127 | Low cost and versatile resistors manufactured from conductive loaded resin-based materials Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The cond... | 05/13/2008 |
| 7348080 | Low temperature polyimide adhesive compositions and methods relating thereto The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an... | 03/25/2008 |
| 7270845 | Dielectric composition for forming dielectric layer for use in circuitized substrates A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including... | 09/18/2007 |
| 7261916 | Method of manufacturing thin-film antenna A method of manufacturing a thin-film antenna is disclosed. A substrate is provided and coated with an organic material layer. After both of the substrate and organic material layer have been dried, a conductive layer is formed on both the substrate and the organic ... | 08/28/2007 |
| 7255912 | Antistatic conductive grid pattern with integral logo The present invention relates to an article comprising a substrate having thereon at least one antistatic layer, wherein said antistatic layer comprises at least one conductive material, and wherein said antistatic layer comprises areas of patterned coverage, and wh... | 08/14/2007 |
| 7199697 | Alloy type thermal fuse and material for a thermal fuse element An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation stability after an operation can be sufficiently assured, and a fuse element ... | 04/03/2007 |
| 7179679 | Fabrication of multilayered thin films via spin-assembly An process of forming multilayer thin film heterostructures is disclosed and includes applying a solution including a first water-soluble polymer from the group of polyanionic species, polycationic species and uncharged polymer species onto a substrate to form a fir... | 02/20/2007 |
| 7127812 | Process for producing a multi-layer printed wiring board A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the pos... | 10/31/2006 |
| 6979523 | Toner material and method utilizing same A toner particle adapted for use in electrostatic image formation, comprising a polymer and flakes of metal dispersed in the polymer. ... | 12/27/2005 |
| 6976306 | Modular method for manufacturing circuit board The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using basic components as the assembly units. The method comprises the ste... | 12/20/2005 |
| 6954985 | Method for plugging holes in a printed circuit board A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 10/18/2005 |
| 6627118 | Ni alloy particles and method for producing same, and anisotropic conductive film A crystalline Ni alloy particle for an anisotropic conductive film comprising Ni and a metalloid element such as P, B, etc. and having a structure in which a Ni intermetallic compound phase is precipitated can be produced by preparing substantially amorph... | 09/30/2003 |
| 6612028 | Method for manufacturing a built-up circuit board Methods are provided for the manufacture of a conductive layer on an insulating layer and for the manufacture of a built-up circuit board, each include an innovative step of irradiating the surface of an insulating (resin) layer with ultraviolet light, so... | 09/02/2003 |
| 6139904 | Method of making a printed board A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plur... | 10/31/2000 |
| 6136513 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of... | 10/24/2000 |
| 6123995 | Method of manufacture of multilayer circuit boards A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the... | 09/26/2000 |
| 6059983 | Method for fabricating an overcoated printed circuit board with contaminant-free areas A method of fabricating an overcoated printed circuit board having a clean area free of contamination from the overcoating material. A metal-clad substrate is etched to form first and second printed circuit traces on the substrate. The first and second pr... | 05/09/2000 |
| 5883219 | Integrated circuit device and process for its manufacture The invention relates to an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a porous dielectric material positioned on the circuit lines. The dielectric material comprises the reacti... | 03/16/1999 |
| 5858149 | Process for bonding semiconductor chip An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insu... | 01/12/1999 |
| 5832595 | Method of modifying conductive lines of an electronic circuit board and its apparatus A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of com... | 11/10/1998 |
| 5830307 | Production method for substrate having projecting portions A method for manufacturing a substrate having a surface with projections. A printing plate, with a least one part formed from a ferromagnetic material, and which has viscous material penetrating portions for forming projections on a flat surface, is broug... | 11/03/1998 |
| 5804256 | Method and device for coating printed-circuit boards The method of forming a multilayer printed circuit board includes applying a photopolymerizable coating append having a solid content of 70 to 95% by weight and a viscosity of 10 to 60 Pa.s of 25° C. to a surface of the applicator cooled to a temperature... | 09/08/1998 |
| 5801092 | Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor devices This invention provides a process for making an insulation layer for use in microelectronic devices, whereby capacitive coupling and propagation delay in the microelectronic devices are reduced. This invention can include the formation of a stable solutio... | 09/01/1998 |
| 5795618 | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as w... | 08/18/1998 |
| 5766674 | Method of producing a printed wiring board In a method of producing a printed wiring board, solder layers are formed on pads beforehand. After the solder layers have been covered with a solder resist, the solder layers are caused to flow so as to render only the portion of the solder resist overly... | 06/16/1998 |
| 5766825 | Method of forming a resin laying in a surface laminated circuit A method of forming a surface laminated circuit printed circuit board (SLC) where a photosensitive thermosetting resin in solution is applied atop a circuitized substrate. The method starts with the step of concentrating and solidifying the photosensitive... | 06/16/1998 |
| 5750291 | Image-forming process A process for the formation of a patterned resist of a photocurable material on a circuit board, the uncured portion of which is water soluble. The process includes the steps of forming a layer of an aqueous emulsion of a photocurable material upon the ci... | 05/12/1998 |
| 5737837 | Manufacturing method for magnetic head junction board A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is f... | 04/14/1998 |
| 5729897 | Method of manufacturing multilayer foil printed circuit boards Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in insulator layers, with resist openings of surface structu... | 03/24/1998 |
| 5723573 | Thermosetting polyquinolines Thermosetting polyquinoline polymers, methods for preparing the polymers, and methods for curing the polymers are provided. The polymers incorporate quinoline repeat units and end groups which include a reactive acetylene functionality. On heat treatment,... | 03/03/1998 |
| 5721007 | Process for low density additive flexible circuits and harnesses An additive electrical circuit (5) on a flexible substrate (1) fabricated by; metallization of the substrate, applying a mask pattern comprising a plating resistant material, applying a conductive circuit material in a circuit pattern that is uncovered by... | 02/24/1998 |
| 5716760 | Method for plating a substrate to eliminate the use of a solder mask A novel process for plating a substrate without solder mask wherein the substrate is coated with a polymer catalyst to assist adhesion of conductive metal to the substrate. Next, a first plating mask photopolymer, or plating resist, is coated over the pol... | 02/10/1998 |
| 5716663 | Multilayer printed circuit Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a rea... | 02/10/1998 |
| 5705219 | Method for coating surfaces with finely particulate materials A method for coating surfaces of a non-conductor with finely particulate solid particles by substrate-induced coagulation, including the steps of: contacting the non-conductor with a first solution containing a first polar solvent and at least one coagula... | 01/06/1998 |
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions ... | 12/23/1997 |
| 5689879 | Metal foil for printed wiring board and production thereof A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed... | 11/25/1997 |
| 5689263 | Antipilferage markers An antipilferage tag is disclosed which includes a resonant circuit adapted to receive an RF signal and to transmit a response signal when interrogated by said RF signal. The tag includes circuit components constituted by or fabricated from a metallized l... | 11/18/1997 |
| 5633034 | Process for forming a circuit assembly The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an e... | 05/27/1997 |
