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| Number | Title | Issue Date |
| 7662429 | Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between t... | 02/16/2010 |
| 7425346 | Method for making hybrid dielectric film A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the substrate via chemical vapor deposition, and forming a second dielectric ... | 09/16/2008 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7356921 | Method for forming a conductive layer pattern A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets o... | 04/15/2008 |
| 7340820 | Machine stator fabrication method A machine stator is fabricated by positioning pre-wound stator windings with respect to a laminated stator yoke and directly molding composite tooth tips into contact with respective teeth of the laminated stator yoke, or by positioning pre-wound stator windings aro... | 03/11/2008 |
| 7305761 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the gr... | 12/11/2007 |
| 7273791 | Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer A method for forming a metal/metal oxide structure that includes forming metal oxide regions, e.g. ruthenium oxide regions, at grain boundaries of a metal layer, e.g., platinum. Preferably, the metal oxide regions are formed by diffusion of oxygen through grain boun... | 09/25/2007 |
| 7261916 | Method of manufacturing thin-film antenna A method of manufacturing a thin-film antenna is disclosed. A substrate is provided and coated with an organic material layer. After both of the substrate and organic material layer have been dried, a conductive layer is formed on both the substrate and the organic ... | 08/28/2007 |
| 7244286 | Copper alloy powder for electrically conductive paste A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an ave... | 07/17/2007 |
| 7105200 | Method of producing thick-film sheet member A thick-film sheet member producing method including: (a) a support-body preparing step of preparing a support body having a film formation surface provided by a particle layer constituted by high-melting-point particles which are held together with a resin and whic... | 09/12/2006 |
| 7083744 | Terminal electrode compositions for multilayer ceramic capacitors The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors which have a metal oxide component selected from SnO2, V... | 08/01/2006 |
| 7069937 | Vertical proximity processor A method for processing a substrate is provided which includes generating a fluid meniscus on the surface of the vertically oriented substrate, and moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrat... | 07/04/2006 |
| 7019394 | Circuit package and method of plating the same A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to ... | 03/28/2006 |
| 6623803 | Copper interconnect stamping A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to th... | 09/23/2003 |
| 6616966 | Method of making lithographic contact springs A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which wi... | 09/09/2003 |
| 6238741 | Single mask screening process A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure prod... | 05/29/2001 |
| 6146716 | Conservatively printed displays and methods relating to same Display elements of computer screens and other information displays are printed using conservative printing techniques. Contemplated electronic components that can be conservatively printed at the display element level include switches, transistors, capac... | 11/14/2000 |
| 6143432 | Ceramic composites with improved interfacial properties and methods to make such composites A ceramic composite having a substrate bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880° C., and ceramic composites that are so constructed that to control internal stress or increase crack-resistance within t... | 11/07/2000 |
| 6117784 | Process for integrated circuit wiring Metal wiring is provided in an integrated circuit by sputter coating onto a semiconductor substrate a copper seed layer; depositing and patterning a photoresist; electroplating or electrolessly plating a metal within the openings of the photoresist; strip... | 09/12/2000 |
| 6095404 | Method for assembling high temperature electronics A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The s... | 08/01/2000 |
| 6087940 | Article surveillance device and method for forming A security tag and method for forming the tag in a substantially continuous in-line operation. The tag includes a substrate with first and second conductive elements separated by a dielectric layer and means establishing electrical contact between the fir... | 07/11/2000 |
| 6086946 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and sub... | 07/11/2000 |
| 6059172 | Method for establishing electrical communication between a first object having a solder ball and a second object A method for establishing electrical communication between a first and second object, comprising the steps of 1) obtaining a first object in electrical communication with at least one BLM, each at least one BLM in contact with a high melting point solder ... | 05/09/2000 |
| 6045856 | Process for producing a resistive element by diffusing glass A resistive element is produced by forming a substrate glazed with glass, printing or coating a resistive element-forming paste onto the substrate, calcining the paste in a first heating step to form an element comprising a film on the substrate and subje... | 04/04/2000 |
| 6022596 | Method for photoselective seeding and metallization of three-dimensional materials A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this... | 02/08/2000 |
| 5885750 | Tantalum adhesion layer and reactive-ion-etch process for providing a thin film metallization area A method for providing a thin film metallization area on a substrate is disclosed comprising the steps of: depositing a Ta adhesion layer on the surface of the substrate seed layer, conducting a photo resist process on the Ta adhesion layer to define the ... | 03/23/1999 |
| 5879739 | Batch process for forming metal plugs in a dielectric layer of a semiconductor wafer A batch process for the high-pressure forming of metal plugs in the dielectric layers of semiconductor wafers. After holes are etched in the dielectric layer of each wafer, and a layer of a metal such as aluminum deposited over the dielectric, both the et... | 03/09/1999 |
| 5814366 | Method of manufacturing multilayered ceramic substrate In a method of manufacturing a multilayered ceramic substrate, a capacitor layer is formed on a green sheet of a low temperature co-firable ceramic by means of printing. The green sheet with the capacitor layer and a plurality of other green sheets are la... | 09/29/1998 |
| 5803343 | Solder process for enhancing reliability of multilayer hybrid circuits A thick film hybrid multilayer circuit characterized by circuit components that are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high c... | 09/08/1998 |
| 5798138 | Method of selectively metallising an inner, electrically insulating surface of an open body A method of selectively metallising an inner, electrically insulating surface Si of an open body (3), comprising the following steps: (a) providing a roller (2) having a resilient outer surface So ; (b) providing a layer of a suitable wet ink ... | 08/25/1998 |
| 5784781 | Manufacturing process for organic chip carrier A manufacturing process for an organic chip carrier is disclosed which permits one to form a substantially bowl-shaped via hole in the substrate of the chip carrier, which makes it easy to deposit a conductive layer having a substantially uniform thicknes... | 07/28/1998 |
| 5784782 | Method for fabricating printed circuit boards with cavities A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized ... | 07/28/1998 |
| 5779870 | Method of manufacturing laminates and printed circuit boards Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit board (PCB) packages. By treatin... | 07/14/1998 |
| 5776551 | Use of plasma activated NF3 to clean solder bumps on a device A method for cleaning solder bumps on a substrate that may be employed in a flip-chip design, for example, is described. The method of cleaning includes placing the substrate having the solder bumps into a plasma reactor, introducing a source gas includin... | 07/07/1998 |
| 5766379 | Passivated copper conductive layers for microelectronic applications and methods of manufacturing same A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a copper layer on the metal layer, and annealing the metal an... | 06/16/1998 |
| 5739055 | Method for preparing a substrate for a semiconductor package A method for making a substrate for a semiconductor package comprising forming a conductive layer having a desired circuit pattern on the substrate; curing the conductive layer; and coining the cured conductive layer to make its surface uniform. The cured... | 04/14/1998 |
| 5733598 | Flexible wiring board and its fabrication method A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring b... | 03/31/1998 |
| 5733597 | Snuff back controlled coating dispensing apparatus and methods Coating dispenser apparatus and methods which utilize a snuff back device for removing a small amount of coating material from the discharge passage of the dispenser upon shut-off thereof at the end of a coating run. A control is provided which discharges... | 03/31/1998 |
| 5729893 | Process for producing a multilayer ceramic circuit substrate A method for producing a multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a main component formed onto a surface layer of the multila... | 03/24/1998 |
| 5724727 | Method of forming electronic component An electronic component (15) such as a printed circuit board (PCB) is formed using a sintering process. A layer of dielectric powder (11) is partially converted to a solid layer of dielectric material (14) by exposing selective portions of the powder (11)... | 03/10/1998 |
