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| Number | Title | Issue Date |
| 8153186 | Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an in... | 04/10/2012 |
| 7604835 | Method for manufacturing wiring substrate and method for manufacturing electronic device A method for manufacturing a wiring substrate includes the steps of (a) providing a first surface-active agent in first and second areas and of a substrate, (b) providing a second surface-active agent in the first area of the substrate, (c) providing a catalyst on t... | 10/20/2009 |
| 7572481 | Pattern forming method and pattern forming apparatus A pattern forming method, for laminating a layer of a pattern on a base by supplying to the base a material for forming the pattern from a supply section for supplying the material based on information of the pattern, comprises the step of adjusting a relative posit... | 08/11/2009 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7374813 | Constructive nanolithography A patterned organic monolayer or multiplayer film self-assembled on a solid substrate, the pattern consisting in a site-defined surface chemical modification non-destructively inscribed in the organic monolayer or multilayer by means of an electrically biased conduc... | 05/20/2008 |
| 7338613 | System and process for automated microcontact printing An automated process for microcontact printing is provided, comprising the steps of providing a substrate and a stamp; automatically aligning the substrate and stamp so that the stamp is aligned relative to the substrate to impart a pattern to the substrate at a des... | 03/04/2008 |
| 7285305 | Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for con... | 10/23/2007 |
| 7240431 | Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is formed along the wall surface of the through-hole | 07/10/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7198816 | Droplet ejection method of forming a film A droplet ejection patterning method of ejecting a dispersion formed by dispersing a convectable dispersoid in a dispersion medium onto a substrate including a lyophilic region and a lyophobic region. Due to a concentration difference of the dispersion, the disperso... | 04/03/2007 |
| 7175876 | Patterned coating method employing polymeric coatings Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring so... | 02/13/2007 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cob... | 01/02/2007 |
| 7147141 | Preconditioning via plug material for a via-in-pad ball grid array package A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. T... | 12/12/2006 |
| 7125586 | Kinetic spray application of coatings onto covered materials Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass to bo... | 10/24/2006 |
| 7114448 | Method for large-area patterning dissolved polymers by making use of an active stamp A method of patterning soluble materials on a substrate is described. In the method, a stamp is applied to a liquid carrier solution. The raised areas of the stamp removes mainly a liquid carrier leaving behind a precipitate while the non-raised areas of the stamp l... | 10/03/2006 |
| 7091127 | Methods and apparatus for patterning a surface The present invention provides methods and apparatus for locally patterning surfaces. In one such method, an oxidizable thioether is adsorbed onto a conductive surface. The surface is then contacted with a fluid medium. A conducting stamp is then brought into contac... | 08/15/2006 |
| 7029761 | Bonding layer for bonding resin on copper surface A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromi... | 04/18/2006 |
| 6966110 | Fabrication of liquid emission device with symmetrical electrostatic mandrel A method of fabricating a liquid emission device includes a chamber having a nozzle orifice. Separately addressable dual electrodes are positioned on opposite sides of a central electrode. The three electrodes are aligned with the nozzle orifice. A rigid electricall... | 11/22/2005 |
| 6952871 | Method for manufacturing printed circuit boards It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks; subjecting said first face to a black oxide treatment (40); applyi... | 10/11/2005 |
| 6616967 | Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturat... | 09/09/2003 |
| 6059983 | Method for fabricating an overcoated printed circuit board with contaminant-free areas A method of fabricating an overcoated printed circuit board having a clean area free of contamination from the overcoating material. A metal-clad substrate is etched to form first and second printed circuit traces on the substrate. The first and second pr... | 05/09/2000 |
| 6010969 | Method of depositing films on semiconductor devices by using carboxylate complexes A method of forming a film on a substrate using chemical vapor deposition techniques and carboxylate complexes. The complexes and method are particularly suitable for the preparation of semiconductor structures.... | 01/04/2000 |
| 6010769 | Multilayer wiring board and method for forming the same A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiri... | 01/04/2000 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5865920 | Method of forming electrode on ceramic green sheet and method of manufacturing multilayer ceramic electronic component In a method of forming an electrode on a ceramic green sheet, an electrode is formed on a support film by a thin film forming method, an adhesion inhibitor is formed on top of the electrode for protecting the same from adhesion of a ceramic slurry, and th... | 02/02/1999 |
| 5860585 | Substrate for transferring bumps and method of use A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) ... | 01/19/1999 |
| 5846598 | Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, co... | 12/08/1998 |
| 5839190 | Methods for fabricating solderless printed wiring devices Methods for making a printed wiring device including a substrate having a metal-plateable member and an electrical component having a metal plateable lead connected with the metal-plateable member, the lead and the member being electrically interconnected... | 11/24/1998 |
| 5832592 | Method of making a respiration sensor A plurality of flow sensors are fabricated on a single substrate. The substrate is laid out to provide the proper physical relationship of the individual sensors. The resulting multiple sensor structure may be effectively used as a respiration detector by... | 11/10/1998 |
| 5834062 | Material transfer apparatus and method of using the same A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) ... | 11/10/1998 |
| 5830533 | Selective patterning of metallization on a dielectric substrate A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the p... | 11/03/1998 |
| 5826329 | Method of making printed circuit board using thermal transfer techniques A method of making a printed circuit board using thermal transfer techniques to transfer electrically conductive coating from a thermal transfer ribbon to a non-conductive surface of a non-conductive receiver board. The electrically conductive material tr... | 10/27/1998 |
| 5750212 | Process for the deposition of structured metallic coatings on glass substrates This invention relates to a process for the application of conducting metallic, structured coatings on glass substrates, for example, for the manufacture of integrated circuits. The invention relies on placing a negative mask of the structure to be applie... | 05/12/1998 |
| 5741557 | Method for depositing metal fine lines on a substrate A method for forming a desired pattern of a material of conductive or non-conductive type on a variety of substrates. It is based on the use of a pen which essentially consists of a refractory tip wetted with the material in the molten state. The pen pref... | 04/21/1998 |
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.... | 12/09/1997 |
| 5686135 | Method of forming an electrically conductive contact on a substrate A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the margin... | 11/11/1997 |
| 5615828 | Method and apparatus for applying flux A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for ... | 04/01/1997 |
| 5603981 | Electrical connecting device and method for making same An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the ... | 02/18/1997 |
| 5569488 | Method of making multi-dielectric laminates The present invention relates to dielectric materials used in circuit board, radar and microwave applications and methods of making these materials. The dielectric materials of this invention are characterized by having a ground plane, at least two dielec... | 10/29/1996 |
| 5565235 | Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated co... | 10/15/1996 |
