Bizarre Patents
A fork with timer for providing a cue to a user after an elapsed period of time for indicating that another bite of food using the fork may be taken.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7923059 | Method of enabling selective area plating on a substrate A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that th... | 04/12/2011 |
| 7438945 | Method of producing multilayer interconnection board A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hol... | 10/21/2008 |
| 7429401 | Superconformal metal deposition using derivatized substrates The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal proce... | 09/30/2008 |
| 7425346 | Method for making hybrid dielectric film A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the substrate via chemical vapor deposition, and forming a second dielectric ... | 09/16/2008 |
| 7415761 | Method of manufacturing multilayered circuit board An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an... | 08/26/2008 |
| 7364666 | Flexible circuits and method of making same Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method. ... | 04/29/2008 |
| 7350297 | Method of manufacturing a wiring substrate A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece h... | 04/01/2008 |
| 7337537 | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. Th... | 03/04/2008 |
| 7331503 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 02/19/2008 |
| 7328506 | Method for forming a plated microvia interconnect A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element included in the surface. An opening formed in the EDL exposes the conductiv... | 02/12/2008 |
| 7319275 | Adhesion by plasma conditioning of semiconductor chip A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method c... | 01/15/2008 |
| 7281327 | Method for manufacturing double-sided printed circuit board An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface... | 10/16/2007 |
| 7279409 | Method for forming multi-layer bumps on a substrate A method for forming multi-layer bumps on a substrate includes depositing a first metal powder on the substrate, and selectively melting or reflowing a portion of the first metal powder to form first bumps. A second metal powder is then deposited on the first bumps,... | 10/09/2007 |
| 7273811 | Method for chemical vapor deposition in high aspect ratio spaces A method of depositing conformal film into high aspect ratio spaces includes the step of forming a gradient of precursor gas inside the space(s) prior to deposition. The gradient may be formed, for example, by reducing the pressure within the deposition chamber or b... | 09/25/2007 |
| 7255975 | Yield and line width performance for liquid polymers and other materials Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polym... | 08/14/2007 |
| 7247363 | Supported greensheet structure and method in MLC processing Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast t... | 07/24/2007 |
| 7243421 | Electrical connection of components A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material forming or being processed to form an electrical connection between the c... | 07/17/2007 |
| 7240419 | Method of manufacturing a magnetoresistance effect element A method of manufacturing a magnetoresistance effect element includes forming an insulating layer on a first ferromagnetic layer, forming an aperture reaching the first ferromagnetic layer by thrusting a needle from the top surface of the insulating layer, and depos... | 07/10/2007 |
| 7240431 | Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is formed along the wall surface of the through-hole | 07/10/2007 |
| 7214418 | Structure having holes and method for producing the same A structure having a hole, including a substrate, a first layer including an alumina hole, and a second layer disposed between the substrate and the fist layer, wherein the second layer contains silicon, and has a smaller hole than the alumina hole. ... | 05/08/2007 |
| 7213335 | Method for manufacturing printed circuit boards The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on ... | 05/08/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 05/01/2007 |
| 7208197 | Method of depositing copper on a support A process for the deposition of copper on a support. The process includes bringing a copper precursor, in the vapor phase, into contact with a heated support, optionally in the presence of hydrogen. The copper precursor is in the form of a CuCl or CuBr composition i... | 04/24/2007 |
| 7168164 | Methods for forming via shielding Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the condu... | 01/30/2007 |
| 7152318 | Method for manufacturing built-up printed circuit board with stacked type via-holes A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly... | 12/26/2006 |
| 7127812 | Process for producing a multi-layer printed wiring board A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the pos... | 10/31/2006 |
| 7100267 | Magnetic head, method for producing same, and magnetic recording and/or reproducing system A method for producing a magnetic head, including the steps of forming a magnetic body on a substrate, the magnetic body including a principal plane facing the substrate and a rear plane opposite to the principal plane; applying a beam to the rear plane of the magne... | 09/05/2006 |
| 7087517 | Method to fabricate interconnect structures A method includes forming a barrier layer on a substrate surface including at least one contact opening; forming an interconnect in the contact opening; and reducing the electrical conductivity of the barrier layer. A method including forming a barrier layer on a su... | 08/08/2006 |
| 7062850 | Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length A method of forming an electrical conductor, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and electromigraation-inhibiting material is deposited over the planar su... | 06/20/2006 |
| 7049223 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a... | 05/23/2006 |
| 6996903 | Formation of multisegmented plated through holes A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through non... | 02/14/2006 |
| 6995088 | Surface treatment of copper to improve interconnect formation The present invention provides, in one embodiment, a method of forming a copper layer (100) over a semiconductor substrate (105). The method comprises coating a copper seed layer (110) located over a semiconductor substrate with a protective age... | 02/07/2006 |
| 6995321 | Etched hole-fill stand-off An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the st... | 02/07/2006 |
| 6992001 | Screen print under-bump metalization (UBM) to produce low cost flip chip substrate A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducin... | 01/31/2006 |
| 6976306 | Modular method for manufacturing circuit board The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using basic components as the assembly units. The method comprises the ste... | 12/20/2005 |
| 6972146 | Structure having holes and method for producing the same A structure having a hole, including a substrate, a first layer including an alumina hole, and a second layer disposed between the substrate and the fist layer, wherein the second layer contains silicon, and has a smaller hole than the alumina hole. ... | 12/06/2005 |
| 6954985 | Method for plugging holes in a printed circuit board A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 10/18/2005 |
| 6938332 | Method for manufacturing multilayer ceramic substrates A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, ... | 09/06/2005 |
| 6926922 | PWB manufacture A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and co... | 08/09/2005 |
