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| Number | Title | Issue Date |
| 8124174 | Electroless gold plating method and electronic parts Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold pl... | 02/28/2012 |
| 7972651 | Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus A method for forming a multi-layered structure using a droplet-discharging device; the method comprises: (A) forming a first insulating-material layer covering the material-body surface by discharging a droplet of a first insulating material including a first photos... | 07/05/2011 |
| 7897198 | Electroless layer plating process and apparatus Electroless plating is performed to deposit conductive materials on work pieces such as partially fabricated integrated circuits. Components of an electroless plating bath are separately applied to a work piece by spin coating to produce a very thin conductive layer... | 03/01/2011 |
| 7883739 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and sele... | 02/08/2011 |
| 7820233 | Method for fabricating a flip chip substrate structure The present invention relates to a method to fabricate a flip chip substrate structure, which comprises: providing a carrier; forming a patterned resist layer on the surface of the carrier; forming sequentially a first metal layer, an etching-stop layer, and a secon... | 10/26/2010 |
| 7700149 | Method and apparatus for providing a deposition in vacuum for laminating a circuit board An approach is provided for depositing a material onto a printed circuit board layer. The approach includes steps of treating surface of a base film, forming a tie layer on the base film, forming a metal conductive layer on the tie layer, and depositing a metal on t... | 04/20/2010 |
| 7572480 | Method of fabricating a multilayer ceramic heating element A multilayer ceramic structure is formed by building up a plurality of layers by sequentially coating a substrate with a series of suspensions comprising particles in a fluid medium. A composition of the sequential layers are varied to produce a structure with the d... | 08/11/2009 |
| 7479297 | Method of manufacturing a multi-layered wiring board There provided a method of manufacturing a multi-layered wiring board having at least two conductor layers, an interlayer insulation layer provided between the conductor layers, and a conductor post that electrically connects the conductor layers, on a substrate. In... | 01/20/2009 |
| 7438945 | Method of producing multilayer interconnection board A method of producing a multilayer interconnection board is disclosed that includes the steps of processing a resin member on an interconnection layer by imprinting press, and removing residue of the resin member at the bottom of a via hole after forming the via hol... | 10/21/2008 |
| 7425346 | Method for making hybrid dielectric film A method of forming a hybrid inorganic/organic dielectric layer on a substrate for use in an integrated circuit is provided, wherein the method includes forming a first dielectric layer on the substrate via chemical vapor deposition, and forming a second dielectric ... | 09/16/2008 |
| 7418780 | Method for forming stacked via-holes in a multilayer printed circuit board An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coa... | 09/02/2008 |
| 7416759 | Wiring pattern formation method, wiring pattern, and electronic device In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a mater... | 08/26/2008 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7370412 | Method for connecting electronic device An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to th... | 05/13/2008 |
| 7371311 | Modified electroplating solution components in a low-acid electrolyte solution An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within... | 05/13/2008 |
| 7348783 | Multi-functional pH meter and fabrication thereof A multi-functional PH meter and the fabrication thereof are disclosed. The multi-functional pH meter immediately displays the measurement result on a liquid crystal display and saves in a compact flash card so as to provide portable functionality. In addition, the m... | 03/25/2008 |
| 7337537 | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. Th... | 03/04/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7325304 | Method of connecting probe pin to circuit board and method of manufacturing probe card There is provided a method of manufacturing a probe card that electrically connects a testing device and a device under test to transmit a signal between the testing device and the device under test. The method includes the steps of forming a probe pin on a probe pi... | 02/05/2008 |
| 7320173 | Method for interconnecting multi-layer printed circuit board A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer expos... | 01/22/2008 |
| 7318904 | Catalytic synthesis of metal crystals using conductive polymers A method of forming metal nanoparticles using a polymer colloid that includes at least one conductive polymer and at least one polyelectrolyte. Metal ions are reduced in water by the conductive polymer to produce the nanoparticles, which may be then incorporated in ... | 01/15/2008 |
| 7290332 | Method of constructing an interposer According to one aspect of the present invention, a method of constructing an interposer is provided. A conductive layer is formed on a nonconductive layer. The conductive layer has via portions, non-via portions, and first and second opposing surfaces. The first su... | 11/06/2007 |
| 7285305 | Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for con... | 10/23/2007 |
| 7281328 | Method of fabricating rigid-flexible printed circuit board The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an ext... | 10/16/2007 |
| 7257893 | Efficient wafer processing technology Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal... | 08/21/2007 |
| 7240431 | Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device A plating resist film 2 is formed on a wiring board substrate 1 as a core material of a multilayer printed wiring board, then a through-hole 3 is formed, and through-hole conductor 4 is formed along the wall surface of the through-hole | 07/10/2007 |
| 7229669 | Thin-film deposition methods and apparatuses Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material area of coverage and a second material is deposited over the first m... | 06/12/2007 |
| 7225536 | Precasting multi-layer PCB process A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recess... | 06/05/2007 |
| 7223349 | Method and apparatus for surface processing of printed wiring board A printed wiring board having a conductor pattern on which a pre-flux film of a stabilized quality is to be formed using a water-soluble pre-flux liquid. To this end, such an apparatus is used which includes an etching unit 12 for etching lands 5b | 05/29/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7175876 | Patterned coating method employing polymeric coatings Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring so... | 02/13/2007 |
| 7045198 | Prepreg and circuit board and method for manufacturing the same The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of ... | 05/16/2006 |
| 7036222 | Method for forming a multi-layer circuit assembly A method of making a multi-layer circuit assembly includes providing a core structure including an inner dielectric element having first and second metal layers on opposite surfaces thereof, forming one or more through vias extending through the metal layers and the... | 05/02/2006 |
| 7028400 | Integrated circuit substrate having laser-exposed terminals An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can further provide a selective plating feature by using a dielectric layer o... | 04/18/2006 |
| 7011862 | Method for producing wiring substrate An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of th... | 03/14/2006 |
| 6975453 | Multilayer electrically conductive anti-reflective coating The present invention comprises a multilayer inorganic anti-reflective coating with predetermined optical properties, for application on a flexible substrate. The coating comprises a stack consisting of five material layers, whereby the third layer is a dummy layer ... | 12/13/2005 |
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate havi... | 11/29/2005 |
| 6966110 | Fabrication of liquid emission device with symmetrical electrostatic mandrel A method of fabricating a liquid emission device includes a chamber having a nozzle orifice. Separately addressable dual electrodes are positioned on opposite sides of a central electrode. The three electrodes are aligned with the nozzle orifice. A rigid electricall... | 11/22/2005 |
| 6953600 | Conductive film forming composition, conductive film, and method for forming the same There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method for forming a film using the composition, a conductive film formed by... | 10/11/2005 |
| 6952871 | Method for manufacturing printed circuit boards It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks; subjecting said first face to a black oxide treatment (40); applyi... | 10/11/2005 |
