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| Number | Title | Issue Date |
| 7348677 | Method of providing printed circuit board with conductive holes and board resulting therefrom A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 03/25/2008 |
| 7304780 | Backplane design for display panels and processes for their manufacture The present invention relates to a backplane design for display panels and processes for their manufacture. The invention provides cost-effective ways to manufacture a display panel because the manufacture does not involve the use of a patterned ITO substrate, flexi... | 12/04/2007 |
| 7290332 | Method of constructing an interposer According to one aspect of the present invention, a method of constructing an interposer is provided. A conductive layer is formed on a nonconductive layer. The conductive layer has via portions, non-via portions, and first and second opposing surfaces. The first su... | 11/06/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers... | 05/01/2007 |
| 7168164 | Methods for forming via shielding Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the condu... | 01/30/2007 |
| 7138334 | Systems for forming insulative coatings for via holes in semiconductor devices An insulative coating for an aperture of a semiconductor device component includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may be formed by programmed material consolidation processes, such as stereolithography. Such... | 11/21/2006 |
| 7036220 | Pin-deposition of conductive inks for microelectrodes and contact via filling A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produ... | 05/02/2006 |
| 6960261 | Apparatus for applying fluid An apparatus for applying fluid onto a substrate, in particular for glueing inner books, books, magazines and other substrates that need to be bound. The apparatus comprises a first slot nozzle, connectable with a fluid source, for applying a fluid film onto one sid... | 11/01/2005 |
| 6935023 | Method of forming electrical connection for fluid ejection device A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection de... | 08/30/2005 |
| 6903431 | Substrate method and apparatus This invention relates to an apparatus and methods for reducing the impedance mismatch problem encountered by differential signaling in conductive core substrates, while maintaining adherence to the common mode noise assumption. Specifically, the conductive paths th... | 06/07/2005 |
| 6612028 | Method for manufacturing a built-up circuit board Methods are provided for the manufacture of a conductive layer on an insulating layer and for the manufacture of a built-up circuit board, each include an innovative step of irradiating the surface of an insulating (resin) layer with ultraviolet light, so... | 09/02/2003 |
| 6139777 | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 μm and whose specific surface area ranges from 0.05 to 1.5 m2 /g, and (b) 70-30 ... | 10/31/2000 |
| 6117706 | Print circuit board The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of whic... | 09/12/2000 |
| 6021833 | Manufacturing line for multi-layered printed circuit boards A manufacturing line including a plurality of processing sections disposed in a series for manufacturing multi-layered printed circuit boards by continuously conveying and processing boards through the plurality of processing sections, in which the plural... | 02/08/2000 |
| 6010769 | Multilayer wiring board and method for forming the same A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiri... | 01/04/2000 |
| 5879738 | Method for fluid transport for the surface treatment of planar substrates An apparatus and method for treating the walls of apertures passing through a planar substrate with a fluid treatment solution. The method comprises placement of a pressurized fluid wedge beneath, above, or both beneath and above a planar substrate as it ... | 03/09/1999 |
| 5863620 | Process and apparatus for coating printed circuit boards A process for coating printed circuit boards with a coating composition that is crosslinkable by electromagnetic radiation, especially UV radiation, using the roll coating process, is distinguished by the following process steps: a photopolymerisable, mel... | 01/26/1999 |
| 5858452 | Method for fabricating wiring substrate with subminiature thru-holes The present invention is an electronic wiring substrate for sensors formed over a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through hole and the through hole itself have an essentially neglig... | 01/12/1999 |
| 5804256 | Method and device for coating printed-circuit boards The method of forming a multilayer printed circuit board includes applying a photopolymerizable coating append having a solid content of 70 to 95% by weight and a viscosity of 10 to 60 Pa.s of 25° C. to a surface of the applicator cooled to a temperature... | 09/08/1998 |
| 5778529 | Method of making a multichip module substrate A multichip module substrate for use in a three-dimensional multichip module, and methods of making the same, are disclosed. The substrate comprises a thin film structure, for routing signals to and from integrated circuit chips, formed over a rigid suppo... | 07/14/1998 |
| 5779836 | Method for making a printed wiring board Described is a method of making a double-sided printed wiring board (PWB) comprising a core of electrically conductive material to improve the thermal distribution and cross-talk shielding of the PWB. Relief apertures and separation slots are chemically m... | 07/14/1998 |
| 5758412 | Method of making a printed circuit board A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements on two opposed faces of a non-conductive substrate; b) coating the substrate and circuit elements with a de-sensitising material;... | 06/02/1998 |
| 5731047 | Multiple frequency processing to improve electrical resistivity of blind micro-vias A method of forming a blind-via in a laminated substrate by forming a first conductive layer. A dielectric layer is then formed on the first conductive layer. An exposed second conductive layer is formed on the dielectric layer, with the second conductive... | 03/24/1998 |
| 5729897 | Method of manufacturing multilayer foil printed circuit boards Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in insulator layers, with resist openings of surface structu... | 03/24/1998 |
| 5729893 | Process for producing a multilayer ceramic circuit substrate A method for producing a multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a main component formed onto a surface layer of the multila... | 03/24/1998 |
| 5699613 | Fine dimension stacked vias for a multiple layer circuit board structure A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions ... | 12/23/1997 |
| 5689263 | Antipilferage markers An antipilferage tag is disclosed which includes a resonant circuit adapted to receive an RF signal and to transmit a response signal when interrogated by said RF signal. The tag includes circuit components constituted by or fabricated from a metallized l... | 11/18/1997 |
| 5683758 | Method of forming vias A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.... | 11/04/1997 |
| 5680701 | Fabrication process for circuit boards A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the holes. To this end, the surface structure of the circuit bo... | 10/28/1997 |
| 5681444 | Electrical feedthroughs for ceramic circuit board support substrates Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass... | 10/28/1997 |
| 5593499 | Dual air knife for hot air solder levelling A dual air knife assembly for removing excess solder and leveling any remaining solder on a passing circuit board with a gas from a gas source in accordance with the present invention includes a first and second air knife. The first air knife has a first ... | 01/14/1997 |
| 5554412 | Solder spray leveller A horizontal solder leveller includes: solder spurge bars (21, 22) for providing downwardly and upwardly directed, distributed flow of solder, as a spray (25), through which a board (1) being tinned can pass to displace oil from contact pads on the board.... | 09/10/1996 |
| 5516545 | Coating processes and apparatus Processes and apparatus for uniformly coating discrete substrates by application of a controlled volume of fluid per unit surface area of a substrate. In one aspect, the invention provides a process comprising providing a fluid reservoir; and flowing flui... | 05/14/1996 |
| 5443672 | Process for coating circuit boards A process is disclosed for coating a circuit board with a photopolymerizable material which is applied by extension at temperatures of 100° to 180° C. followed by distributing the material under pressure by a roller.... | 08/22/1995 |
| 5376404 | Method of coating ridged plates, particularly printed circuit boards Method for applying liquid varnish coating over raised conductor pattern of a printed circuit board. The circuit board is passed through nip rolls at least one of which has a coating of liquid varnish thereon. The thickness of the coating on the nip roll ... | 12/27/1994 |
| 5374346 | Electroplating process and composition A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a hi... | 12/20/1994 |
| 5374331 | Preflux coating method Method for pretreatment of the metallic surfaces such as conductive patterns on printed wiring boards to protect against oxidation and/or other contamination. Boards are passed through successive stations to perform the following operations at least upon ... | 12/20/1994 |
| 5372670 | System for wet application of a dry film to a panel A system for wet application of a dry film, such as a photoresist, to a generally planar panel having upper and lower surfaces, such as a printed circuit board, is provided. The apparatus comprises rotatable upper and lower wetting rollers each having an ... | 12/13/1994 |
| 5371029 | Process for making a leadless chip resistor capacitor carrier using thick and thin film printing A process for forming a leadless chip resistor capacitor carrier by forming a first capacitor plate using a first thick film printing sequence and forming the second capacitor plate using a second thin film printing sequence.... | 12/06/1994 |
