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| Number | Title | Issue Date |
| 7829135 | Method and apparatus for forming multi-layered circuit pattern In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to... | 11/09/2010 |
| 7785658 | Method for forming metal wiring structure A method for forming a metal wiring structure includes: (i) providing a multi-layer structure including an exposed wiring layer and an exposed insulating layer in a reaction space; (ii) introducing an —NH2 or >NH terminal at least on an exposed surface of the insu... | 08/31/2010 |
| 7763311 | Method for heating a substrate prior to a vapor deposition process A method for depositing a thin film on a substrate in a vapor deposition system is described. Prior to the deposition process, the substrate is provided within the vapor deposition system and coupled to an upper surface of a substrate holder within the vapor deposit... | 07/27/2010 |
| 7638161 | Method and apparatus for controlling dopant concentration during BPSG film deposition to reduce nitride consumption A method and apparatus for controlling dopant concentration during borophosphosilicate glass film deposition on a semiconductor wafer to reduce consumption of nitride on the semiconductor wafer. In one embodiment of the invention, the method starts by placing a subs... | 12/29/2009 |
| 7604834 | Formation of dielectric film by alternating between deposition and modification The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite dielectric film, the composite dielectric film having a k value of about... | 10/20/2009 |
| 7410666 | Metal nitride carbide deposition by ALD The present methods provide tools for growing conformal metal thin films, including metal nitride, metal carbide and metal nitride carbide thin films. In particular, methods are provided for growing such films from aggressive chemicals. The amount of corrosive chemi... | 08/12/2008 |
| 7374941 | Active reactant vapor pulse monitoring in a chemical reactor A method and apparatus for determining changes in a supply system, designed to supply repeated pulses of a vapor phase reactant to a reaction chamber is disclosed. One embodiment involves providing the reactant source, and a gas conduit to connect the reactant sourc... | 05/20/2008 |
| 7335591 | Method for forming three-dimensional structures on a substrate A method of forming a resist layer on a non-planar surface of a substrate includes placing the non-planar surface into an electrophoretic resist. While the non-planar surface is in the electrophoretic resist, an electrical voltage is applied between the substrate an... | 02/26/2008 |
| 7326444 | Methods for improving integration performance of low stress CDO films Methods of preparing a carbon doped oxide (CDO) layer with a low dielectric constant ( | 02/05/2008 |
| 7323411 | Method of selective tungsten deposition on a silicon surface In one embodiment, a selective tungsten deposition process includes the steps of pre-flowing silane into a deposition chamber, pumping down the chamber, and then selectively depositing tungsten on a silicon surface. The silane pre-flow helps minimize silicon consump... | 01/29/2008 |
| 7311947 | Laser assisted material deposition A method of forming a film on a substrate includes activating a gas precursor to form a material on the substrate by irradiating the gas precursor with electromagnetic energy at a frequency tuned to an absorption frequency of the gas precursor. ... | 12/25/2007 |
| 7297361 | In-line deposition processes for circuit fabrication A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by ... | 11/20/2007 |
| 7273811 | Method for chemical vapor deposition in high aspect ratio spaces A method of depositing conformal film into high aspect ratio spaces includes the step of forming a gradient of precursor gas inside the space(s) prior to deposition. The gradient may be formed, for example, by reducing the pressure within the deposition chamber or b... | 09/25/2007 |
| 7270848 | Method for increasing deposition rates of metal layers from metal-carbonyl precursors A method for increasing deposition rates of metal layers from metal-carbonyl precursors by mixing a vapor of the metal-carbonyl precursor with CO gas. The method includes providing a substrate in a process chamber of a deposition system, forming a process gas contai... | 09/18/2007 |
| 7268365 | Volatile copper (II) complexes and reducing agents for deposition of copper films by Atomic Layer Deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... | 09/11/2007 |
| 7261916 | Method of manufacturing thin-film antenna A method of manufacturing a thin-film antenna is disclosed. A substrate is provided and coated with an organic material layer. After both of the substrate and organic material layer have been dried, a conductive layer is formed on both the substrate and the organic ... | 08/28/2007 |
| 7246570 | Indication film for temperature and temperature distribution measurement and related method A method of determining temperature and temperature distribution over the surface of an object includes (a) applying a temperature sensitive film composed of material displaying change in color as a function of temperature on a surface of an object; and (b) comparin... | 07/24/2007 |
| 7238616 | Photo-assisted method for semiconductor fabrication The present invention provides a processing system comprising a remote plasma activation region for formation of active gas species, a transparent transfer tube coupled between the remote activation region and a semiconductor processing chamber, and a source of phot... | 07/03/2007 |
| 7229502 | Method of forming a silicon nitride layer A method of forming a silicon nitride layer is provided. A deposition furnace having an outer tube, a wafer boat, a gas injector and a uniform gas injection apparatus is provided. The wafer boat is positioned within the outer tube for carrying a plurality of wafers.... | 06/12/2007 |
| 7201943 | Methods of forming atomic layers of a material on a substrate by sequentially introducing precursors of the material A thin film is formed using an atomic layer deposition process, by introducing a first reacting material including tantalum precursors and titanium precursors onto a substrate. A portion of the first reacting material is chemisorbed onto the substrate. Then, a secon... | 04/10/2007 |
| 7199255 | Imino-amide catalysts for olefin polymerization The present invention provides a catalyst precursor, a catalyst system comprising the precursor, and a polymerization method using the catalyst system, an embodiment of the precursor is selected from the following structures: | 04/03/2007 |
| 7195801 | Manufacturing process for storing and transferring evaporation material A manufacturing system capable of enhancing reliability and luminance of a light emitting element is provided which uses an EL material of very high purity in evaporation. The system is also capable of using an EL material efficiently. Instead of a glass jar, a cont... | 03/27/2007 |
| 7179335 | In situ adaptive masks A variable adaptive mask is provided that can be dynamically modified in situ in a physical vapor deposition process. The mask comprises a fixed mask portion, a plurality of channels extending through the fixed mask portion, a control mechanism for controlling throu... | 02/20/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7087774 | Volatile copper(II) complexes and reducing agents for deposition of copper films by atomic layer deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... | 08/08/2006 |
| 7088004 | Flip-chip device having conductive connectors Semiconductor devices having a passivation layer formed over their major electrodes and individual electrical connectors connected to the electrodes by conductive attach material through openings in the passivation layer are described. ... | 08/08/2006 |
| 7081421 | Lanthanide oxide dielectric layer A ruthenium gate for a lanthanide oxide dielectric layer and a method of fabricating such a combination gate and dielectric layer produce a reliable structure for use in a variety of electronic devices. The lanthanide oxide dielectric layer is formed by depositing l... | 07/25/2006 |
| 7063981 | Active pulse monitoring in a chemical reactor A method and apparatus for determining changes in a supply system, designed to supply repeated pulses of a vapor phase reactant to a reaction chamber is disclosed. One embodiment involves providing the reactant source, and a gas conduit to connect the reactant sourc... | 06/20/2006 |
| 7033641 | Gas separating unit and method for manufacturing the same A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, ... | 04/25/2006 |
| 6955726 | Mask and mask frame assembly for evaporation A mask frame assembly includes a frame having an opening and a mask having at least two unit mask elements. Both ends of each unit mask element are fixed to the frame in a state of tension. The unit mask elements include a unit masking pattern, and overlap each othe... | 10/18/2005 |
| 6943066 | Active matrix backplane for controlling controlled elements and method of manufacture thereof An electronic device is formed from electronic elements deposited on a substrate. The electronic elements are deposited on the substrate by advancing the substrate through a plurality of deposition vacuum vessels, with each deposition vacuum vessel having at least o... | 09/13/2005 |
| 6616966 | Method of making lithographic contact springs A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which wi... | 09/09/2003 |
| 6245380 | Method of forming bonding pad A method of forming bonding pad commences by forming a conformal barrier layer on a provided inter-metal dielectric layer. A first metal layer is formed on the barrier layer to partially fill the trench. A thin glue layer is formed on the first metal laye... | 06/12/2001 |
| 6239018 | Method for forming dielectric layers A method for forming dielectric layers is described. Wiring lines are formed on a provided semiconductor substrate. Spacers are formed on the sidewalls of the wiring lines. A liner layer is formed on the wiring lines and on the spacers by a first HDPCVD s... | 05/29/2001 |
| 6143377 | Process of forming a refractory metal thin film A process for forming a refractory metal thin film on a substrate by subjecting a gaseous mixture containing a halide of a refractory metal and the hydrogen gas to a plasma chemical vapor deposition, comprising the step of adjusting a mixing ratio of the ... | 11/07/2000 |
| 6143362 | Chemical vapor deposition of titanium A titanium layer is formed on a substrate with chemical vapor deposition (CVD). First, a seed layer is formed on the substrate by combining a first precursor with a reducing agent by CVD. Then, the titanium layer is formed on the substrate by combining a ... | 11/07/2000 |
| 6140215 | Method and apparatus for low temperature deposition of CVD and PECVD films Method and apparatus are disclosed for low temperature deposition of CVD and PECVD films utilizing a gas-dispersing showerhead position within one inch of a rotating substrate. The showerhead is positioned a suitable distance below a gas-dispensing appara... | 10/31/2000 |
| 6136693 | Method for planarized interconnect vias using electroless plating and CMP An improved and new method for fabricating conducting vias between successive layers of conductive interconnection patterns in a semiconductor integrated circuit has been developed. The method utilizes a first CMP step to form a barrier lined contact hole... | 10/24/2000 |
| 6133147 | Process for selective metal deposition in holes of semiconductor device A process for preparing a metallic interconnecting plug in a semiconductor device which comprises the steps of: i) forming an insulating layer on the surface of a semiconductor substrate or a metal underlayer of the semiconductor device, ii) forming a hol... | 10/17/2000 |
| 6124186 | Deposition of device quality, low hydrogen content, hydrogenated amorphous silicon at high deposition rates with increased stability using the hot wire filament technique A method or producing hydrogenated amorphous silicon on a substrate, comprising the steps of: positioning the substrate in a deposition chamber at a distance of about 0.5 to 3.0 cm from a heatable filament in the deposition chamber; maintaining a pressure... | 09/26/2000 |
