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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8071160 | Surface coating process A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70... | 12/06/2011 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7253106 | Manufacturable CoWP metal cap process for copper interconnects A method to electrolessly plate a CoWP alloy on copper in a reproducible manner that is effective for a manufacturable process. In the method, a seed layer of palladium (Pd) is deposited on the copper by an aqueous seeding solution of palladium acetate, acetic acid ... | 08/07/2007 |
| 7208197 | Method of depositing copper on a support A process for the deposition of copper on a support. The process includes bringing a copper precursor, in the vapor phase, into contact with a heated support, optionally in the presence of hydrogen. The copper precursor is in the form of a CuCl or CuBr composition i... | 04/24/2007 |
| 7026376 | Fluxing agent for underfill materials An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group o... | 04/11/2006 |
| 6610406 | Flame retardant molding compositions Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame ... | 08/26/2003 |
| 6132809 | Conformal coating using multiple applications A robotic conformal coating system has a end effector and multiple tiltable valves coupled to the end effector. The end effector is capable of X, Y and Z axis motion, as well as rotation about the Z axis. A programmable controller controls the movement of... | 10/17/2000 |
| 6090493 | Bismuth coating protection for copper Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth coating.... | 07/18/2000 |
| 6059983 | Method for fabricating an overcoated printed circuit board with contaminant-free areas A method of fabricating an overcoated printed circuit board having a clean area free of contamination from the overcoating material. A metal-clad substrate is etched to form first and second printed circuit traces on the substrate. The first and second pr... | 05/09/2000 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5755026 | Method of preventing condensation on a surface housing an electronic apparatus Moisture condensed on a circuit board can cause dendritic growth which can short out a circuit. Such sensitive areas are protected from condensation by filling cavities in an assembly with insulating material to exclude moisture bearing air. Foamed plasti... | 05/26/1998 |
| 5736190 | Exterior protective layer for an electrical component An electrical component comprising an electrical component having an exterior protective layer on at least a portion of a surface. The layer is a cured copolymer of a reaction between at least one oligomer having a terminal ethylenically unsaturated group... | 04/07/1998 |
| 5733597 | Snuff back controlled coating dispensing apparatus and methods Coating dispenser apparatus and methods which utilize a snuff back device for removing a small amount of coating material from the discharge passage of the dispenser upon shut-off thereof at the end of a coating run. A control is provided which discharges... | 03/31/1998 |
| 5703138 | Oxygen-curable coating composition An acrylate composition, especially useful for producing conformal coatings on circuit board assemblies, includes a photoinitiator and an air-curing system, the latter being comprised of a compound having multiple allyloxy groups in its molecule and a tra... | 12/30/1997 |
| 5561329 | Compositions for protecting semiconductor elements and semiconductor devices Curable silicone compositions comprise either (a) microparticles of a fluororesin which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin... | 10/01/1996 |
| 5549925 | Hybrid microcircuit glass-to-metal seal repair process A process for repairing leaking glass-to-metal seals of a hybrid microcircuit header. The process comprises the following steps. A leaking hybrid microcircuit header is delidded (has its lid removed). The leaking hybrid microcircuit header, generally with... | 08/27/1996 |
| 5543008 | Method of manufacture of a protective coating on an electronic assembly A protective coating for an electronic assembly on a circuit board is made from a pre-fabricated, roll-flattened plastic ribbon having desired pre-determined thickness. From the ribbon, a suitably shaped membrane piece is produced, e.g., by stamping or by... | 08/06/1996 |
| 5510138 | Hot melt conformal coating materials Conformal coating materials are provided for forming a protective conformal coating on the surface of an electronic assembly. The conformal coating materials are characterized by being hot melt materials, in that they are each initially a solid or semisol... | 04/23/1996 |
| 5496590 | Composition for treating copper and copper alloy surfaces and method for the surface treatment A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applie... | 03/05/1996 |
| 5466575 | Process for the manufacture of wholly microfabricated biosensors An efficient method for the microfabrication of electronic devices which have been adapted for the analyses of biologically significant analyte species is described. The techniques of the present invention allow for close control over the dimensional feat... | 11/14/1995 |
| 5458907 | Method of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit pattern A method of manufacturing a printed wiring board includes the following steps. A circuit pattern consisting of one material selected from the group consisting of copper and a copper alloy is selectively formed on an insulating substrate, and a solder resi... | 10/17/1995 |
| 5456817 | Surface treatment method of a copper foil for printed circuits There is disclosed a treating process whereby the thermal oxidation resistance on the shiny side of a copper foil is enhanced so that the shiny side will not discolor on heating to higher temperatures than usual, without impairing the foil's solder wettab... | 10/10/1995 |
| 5445873 | Room temperature curable solventless silicone coating compositions A room temperature curable solventless silicone coating composition includes (A) an organopolysiloxane end-blocked with a hydroxyl radical, (B) a tri- or tetra-hydrocarbonoxysilane or a partial hydrolyzate thereof, and (C) a curing catalyst in the form of... | 08/29/1995 |
| 5357673 | Semiconductor device encapsulation method In a semiconductor device encapsulation assembly (50; 60), a semiconductor device (21), preferably a pressure transducer, is mounted on a base (11) in a cavity (20) formed by the base and surrounding walls (15). Electrical connections, preferably wire bon... | 10/25/1994 |
| 5326589 | Method of protecting electronic or electric part The invention provides a method of protecting an electronic or electric part by coating the part with a silicone rubber composition comprising an organopolysiloxane, an organohydrogenpolysiloxane, an addition reaction catalyst, and a filler. When metal ox... | 07/05/1994 |
| 5302553 | Method of forming a coated plastic package The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic, silica or other plastic material is applied over a plastic packaged semiconductor device to seal the package from moisture.... | 04/12/1994 |
| 5294459 | Air assisted apparatus and method for selective coating Apparatus and methods for spray coating selected areas of a circuit board with an insulative coating material without coating regions of the circuit board to be left uncoated. A liquid spray device emits the coating material and an air assist attachment c... | 03/15/1994 |
| 5288526 | Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards Apparatus and process for curing conformal coatings on circuit boards being conveyed through a curing chamber within a UV oven. Warm air, exhausted from a lamp housing containing UV lamps for curing the coatings, is directed into a flash zone chamber thro... | 02/22/1994 |
| 5270117 | Preflux coating composition for copper A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene, process for protecting the solderability of co... | 12/14/1993 |
| 5268193 | Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are us... | 12/07/1993 |
| 5246730 | Process for conformal coating of printed circuit boards A method of applying a conformal coating to a printed circuit board and components attached thereto while leaving selected components attached thereto uncoated, comprises the steps of providing a printed circuit board having a multiplicity of components a... | 09/21/1993 |
| 5232758 | Non-hardening solvent removable hydrophobic conformal coatings A non-hardening, solvent removable hydrophobic conformal coating is provided for electronic devices, such as printed circuit boards. The coating material comprises a metal alkyl benzyl sulfonate, together with a carrier and a solvent. The metal alkyl benz... | 08/03/1993 |
| 5215801 | Silicone resin electronic device encapsulant An electronic device (12) is encapsulated by a curable material (15) which, prior to cure, comprises sixteen to twenty-three weight percent of a silicone resin, forty-six to seventy-three weight percent of silicon dioxide, four to fifteen weight percent o... | 06/01/1993 |
| 5175023 | Method for forming insulating coating material for electronic circuit board The present invention relates to an insulating coating material for an electronic circuit board, an insulating coating layer for an electronic circuit board, and a method for forming such insulating coating layer, and the insulating coating material is a ... | 12/29/1992 |
| 5165956 | Method of encapsulating an electronic device with a silicone encapsulant A silicone rubber potting compound contains an alkoxysilane (γ-glycidoxypropyltrimethoxysilane) as an adhesion promoter. Harmful effects caused by the adhesion promoter are alleviated by using as an additive a titanate having the form Ti(OR)4,... | 11/24/1992 |
| 5137846 | Method for forming a polycyanurate encapsulant An improved encapsulant for an electronic component package is composed of an inorganic powder dispersed in a polycyanurate resin binder. The encapsulant is formed by applying a curing mixture of the powder and a liquid vehicle composed predominantly of a... | 08/11/1992 |
| 5108784 | Composite polymer/desiccant coatings for IC encapsulation This invention is directed to composite coating for maintaining low moisture levels at the surface of solid substrates. One embodiment of the invention comprises a coating having a desiccant layer between layers of the same or different elastomeric polyme... | 04/28/1992 |
| 5088189 | Electronic manufacturing process A solder paste flux comprising an epoxy resin, a carboxylic acid, a substantially solid alcohol, cellulose, a catalyst, a solvent for the carboxylic acid and a synthetic resin; a solder paste incorporating this solder paste flux; and a surface mount elect... | 02/18/1992 |
| 5085893 | Process for forming a coating on a substrate using a silsesquioxane resin The present invention provides a relatively simple synthesis procedure for the formation of silane hydrolyzate compositions of the formula ##STR1## where R is hydrogen or a methyl group, n is an integer greater than about 8, and x is a number between... | 02/04/1992 |
| 5084323 | Ceramic multi-layer wiring substrate and process for preparation thereof Disclosed is a ceramic multi-layer wiring board comprising a multi-layer wiring board having a plurality of insulating layers and a plurality of refractory metal layers, which are alternately formed, the end portion of the outermost insulating layer among... | 01/28/1992 |
