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| Number | Title | Issue Date |
| 7604833 | Electronic part manufacturing method Provided is a method of manufacturing an electronic part in which a circuit element (3) is formed on a surface of a ceramic substrate (1) and conductive balls (2) are used as terminals of the electronic part. After the ceramic substrate (1 | 10/20/2009 |
| 7361869 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no de... | 04/22/2008 |
| 7041331 | Electronic device manufacture Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated ... | 05/09/2006 |
| 6954985 | Method for plugging holes in a printed circuit board A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 10/18/2005 |
| 6132809 | Conformal coating using multiple applications A robotic conformal coating system has a end effector and multiple tiltable valves coupled to the end effector. The end effector is capable of X, Y and Z axis motion, as well as rotation about the Z axis. A programmable controller controls the movement of... | 10/17/2000 |
| 6022583 | Method of encapsulating a wire bonded die A method of dispensing encapsulant material on a wire bonded die comprises dispensing a series of discrete, single-point droplets and a series of continuous beads within an area bounded by a dam. The encapsulant material spreads out from the droplets and ... | 02/08/2000 |
| 5871684 | Method of making lightweight, low thermal expansion microwave structures A method of making a lightweight, microwave electronic structure includes the steps of forming a rigid, glass structure having a desired density by a sol-gel process and thereafter uniformly coating the formed glass structure with an adherent and uniform ... | 02/16/1999 |
| 5776235 | Thick opaque ceramic coatings Thick opaque ceramic coatings are used to protect delicate microelectronic devices against excited energy sources, radiation, light, abrasion, and wet etching techniques. The thick opaque ceramic coating are prepared from a mixture containing phosphoric a... | 07/07/1998 |
| 5736190 | Exterior protective layer for an electrical component An electrical component comprising an electrical component having an exterior protective layer on at least a portion of a surface. The layer is a cured copolymer of a reaction between at least one oligomer having a terminal ethylenically unsaturated group... | 04/07/1998 |
| 5703138 | Oxygen-curable coating composition An acrylate composition, especially useful for producing conformal coatings on circuit board assemblies, includes a photoinitiator and an air-curing system, the latter being comprised of a compound having multiple allyloxy groups in its molecule and a tra... | 12/30/1997 |
| 5510138 | Hot melt conformal coating materials Conformal coating materials are provided for forming a protective conformal coating on the surface of an electronic assembly. The conformal coating materials are characterized by being hot melt materials, in that they are each initially a solid or semisol... | 04/23/1996 |
| 5496769 | Process for coating electronic components hybridized by bumps on a substrate The invention relates to a process for coating electronic components mounted on a substrate using a bump or ball hybridization method. It also relates to the coated electronic component obtained by performing this process. The process comprises placing bu... | 03/05/1996 |
| 5356659 | Metallization for semiconductor devices A low temperature chemical vapor deposition process is used to encapsulate aluminum conductors on the surface of a silicon substrate to form bimetallic conductors. The refractory material is desirably tungsten.... | 10/18/1994 |
| 5356656 | Method for manufacturing flexible amorphous silicon solar cell A method of manufacturing a flexible amorphous silicon solar cell includes the steps of: a) coating a PI varnish on a glass substrate; b) imidizing the PI varnish film; c) vacuum-depositing a metal film on the PI film; d) vacuum-depositing an amorphous si... | 10/18/1994 |
| 5275841 | Method for encapsulating integrated circuit A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encaps... | 01/04/1994 |
| 5180611 | Method for irradiation of printed wiring boards and the like An open-weave conveyor moves a printed wiring board through a region of radiant energy. The conveyor has a plurality of supporting projections extending from the major surface of the conveyor to minimize engagement between the conveyor and the board, prov... | 01/19/1993 |
| 5137846 | Method for forming a polycyanurate encapsulant An improved encapsulant for an electronic component package is composed of an inorganic powder dispersed in a polycyanurate resin binder. The encapsulant is formed by applying a curing mixture of the powder and a liquid vehicle composed predominantly of a... | 08/11/1992 |
| 5094983 | Method for manufacture of an integrated MOS semiconductor array A method of manufacture of an integrated MOS semiconductor array for the low-frequency range having MOS components and circuit paths arranged on a semiconductor substrate. Exposed surfaces between the circuit paths are made hydrophobic by germinating with... | 03/10/1992 |
| 5087479 | Method and apparatus for enveloping an electronic component A method forming a compressible intermediate layer between a chip and a chip envelope provides that an ultraviolet-curable gel that is metered onto the chip with a multiple needle arrangement. The multiple needle arrangement is conducted over the chip sur... | 02/11/1992 |
| 5019409 | Method for coating the top of an electrical device A method and apparatus for dispensing a thin coating of a highly viscous encapsulant liquid on to the top surface of a semiconductor device having been inner lead bonded. The coating is dispensed with a controlled thickness and is substantially planar. A ... | 05/28/1991 |
| 4911992 | Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsesquioxane resin and metal oxides This invention relates to materials produced by diluting in a solvent a platinum or rhodium catalyzed preceramic mixture of a hydrogen silsesquioxane resin and a metal oxide precursor selected from the group consisting of an aluminum alkoxide, a titanium ... | 03/27/1990 |
| 4842888 | Ceramic coatings from the pyrolysis in ammonia of mixtures of silicate esters and other metal oxide precursors Hydrolyzed or partially hydrolyzed mixtures of silicate esters and metal oxide precursors, are pyrolyzed at relatively low temperature in the presence of ammonia to form ceramic coatings on substrates such as electronic devices. The metal oxide precursors... | 06/27/1989 |
| 4822645 | Metallizing paste and a process for metallizing ceramic articles by using such a metallizing paste Metallizing pastes are disclosed, which contain, as inorganic materials, 15 to 50% by weight of a component to form a glass phase and 50 to 85% by weight of a metallic molybdenum powder. The glass phase essentially consists of 5 to 25% by weight of Al | 04/18/1989 |
| 4794018 | Partial immersion flow coating method and apparatus Apparatus and method for applying a coating material to a workpiece. The apparatus includes a coating material flow surface capable of supporting the workpiece. A coating material flow source provides substantially even flow of the coating material across... | 12/27/1988 |
| 4784872 | Process for encapsulating microelectronic semi-conductor and layer type circuits A process for encapsulating microelectronic hybrid semi-conductor circuits or microelectronic semi-conductor components in which the components, located on a substrate, receive a soft, sealable poured-on plastic coating, are covered with a plastic/metal c... | 11/15/1988 |
| 4749631 | Multilayer ceramics from silicate esters This invention relates to materials produced by diluting in a solvent a preceramic mixture of a partially hydrolyzed silicate ester which is applied to a substrate and ceramified by heating. One or more ceramic coatings containing silicon carbon, silicon ... | 06/07/1988 |
| 4684543 | Starting mixture for an insulating composition comprising a lead glass, silk-screening ink comprising such a mixture, and the use of said ink for the protection of hybrid microcircuits on ceramic substrates The invention relates to starting mixtures for an insulating composition comprising (a) a from about 70 to 80% by volume of vitreous phase comprising Al2 O3, SiO2, B2 O3, PbO, ZnO, CaO, and CuO and (b... | 08/04/1987 |
| 4587140 | Method for embedding electrical and electronic circuitry A method of protecting electrical or electronic circuitry by embedding said circuitry in a low molecular weight ethylene-alpha-olefin copolymer composition.... | 05/06/1986 |
| 4518631 | Thixotropic curable coating compositions The degree of thixotropic character exhibited by curable compositions comprising specified epoxide reactants, organosilicon reactants and fillers can be varied by varying the weight ratio of epoxide reactant to organosilicon reactant between values repres... | 05/21/1985 |
| 4287226 | Process for producing cover coated electronic circuits A process is described for producing electronic circuits in which a cover coat is used to protect the circuit elements. The process involves a series of steps including covering the electronic circuit, often before complete fabrication with a substance wh... | 09/01/1981 |
| 4238528 | Polyimide coating process and material A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a... | 12/09/1980 |
| 4172907 | Method of protecting bumped semiconductor chips A method of protecting from physical damage the upper surface of medium and large scale integrated IC circuit chips. Certain types of IC chips are provided with a plurality of input/output terminals, or bumps, which project above the upper surface of the ... | 10/30/1979 |
| 4163082 | U.V.-radiation method for decreasing surface tack of disposed organopolysiloxane greases and gels The surface tack of a silicone gel or grease which is adheringly disposed on a substrate is decreased by coating the surface of the disposed gel or grease with a U.V.-curable organopolysiloxane liquid composition and exposing the coating to ultraviolet li... | 07/31/1979 |
| 4073970 | Method of making electric heating unit An electrical cooking or heating unit comprising a plate of a glassy material including a selected portion thereof upon whose upper surface vessels are to be placed for cooking purposes. The lower surface of the selected portion of the plate is provided w... | 02/14/1978 |
