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| Number | Title | Issue Date |
| 8124173 | Process for packaging electronic devices A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an e... | 02/28/2012 |
| 8034402 | Method for producing ceramic compact and ceramic part A ceramic compact is provided having a patterned conductor is obtained by coating the patterned conductor with a slurry and then hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic co... | 10/11/2011 |
| 7964236 | Use of nanomaterials in secondary electrical insulation coatings Use of the barrier property effect of nanomaterials to improve the electrical insulation resistance, corrosion protection and bond strength properties of electromagnetic devices. The beneficial effects are realized with nanomaterial loadings of 1-20%, and preferably... | 06/21/2011 |
| 7811626 | Printed circuit board and method of manufacturing the same Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predet... | 10/12/2010 |
| 7758913 | Spin-on protective coatings for wet-etch processing of microelectronic substrates New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably compri... | 07/20/2010 |
| 7740899 | Electronic device having lead and cadmium free electronic overglaze applied thereto The present invention provides an electronic device having a lead-free and cadmium-free glass composition applied thereto and fired to form an acid resistant overglaze, and a method of overglazing an electronic device using the lead-free and cadmium-free glass compo... | 06/22/2010 |
| 7691433 | Method for structured application of molecules to a strip conductor and molecular memory matrix The invention relates to a method for a structured application of molecules on a strip conductor and to a molecular memory matrix. The inventive method makes it possible, for the first time, to economically and simply apply any number of molecular memory elements on... | 04/06/2010 |
| 7368491 | Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a po... | 05/06/2008 |
| 7342185 | Compression column load cell with compensation for off center loading errors Simple and inexpensive electrical compensation for off-axis and off-center loading sensitivity is possible in compression column load cells having a pair of compensation strain gages in series with each of the main strain gages in the load cell. The compensation gag... | 03/11/2008 |
| 7304102 | Process for making encapsulant for opto-electronic devices An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of r... | 12/04/2007 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7297370 | Curable encapsulant composition, device including same, and associated method An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionali... | 11/20/2007 |
| 7282241 | Patterned, high surface area substrate with hydrophilic/hydrophobic contrast, and method of use Nanoporous structures are constructed that have hydrophilic regions separated by hydrophobic regions. The porous, hydrophilic regions have reaction sites suitable for use in a bioassay application and have a higher density of reaction sites than that of a non-porous... | 10/16/2007 |
| 7270056 | Print stripper for ESD control A system may include a static dissipative device to secure a semiconductor component, and a printer to print indicia on the semiconductor component while the semiconductor component is secured with the static dissipative device. ... | 09/18/2007 |
| 7255823 | Encapsulation for oled devices An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the... | 08/14/2007 |
| 7238390 | Coating precursor and method for coating a substrate with a refractory layer The purpose of the invention is a coating precursor comprising a silicone resin and a mineral filler capable of chemically reacting so as to produce a solid layer on a substrate and a cohesive refractory layer after a calcination operation. The precursor may also in... | 07/03/2007 |
| 7223517 | Lithographic antireflective hardmask compositions and uses thereof Compositions and techniques for the processing of semiconductor devices are provided. In one aspect of the invention, an antireflective hardmask composition is provided. The composition comprises a fully condensed polyhedral oligosilsesquioxane, {RSiO1.5}... | 05/29/2007 |
| 7223525 | Process for generating a hard mask for the patterning of a layer A process for generating a hard mask for the patterning of a first layer includes applying a second layer, which includes carbon, to the first layer that is to be patterned. A third layer, which includes silicon and carbon, is spun onto the second layer and an organ... | 05/29/2007 |
| 7224040 | Multi-level thin film capacitor on a ceramic substrate In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer betwe... | 05/29/2007 |
| 7220520 | Photosensitive resin compositions A photosensitive resin composition comprising: (d) at least one polybenzoxazole precursor polymer (e) at least one compound having structure VI V1—Y—V2 VI wherein Y is ... | 05/22/2007 |
| 7219421 | Method of a coating heat spreader A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PC... | 05/22/2007 |
| 7205249 | CVD plasma assisted low dielectric constant films A method and apparatus for depositing a low dielectric constant film by reaction of an organosilane or organosiloxane compound and an oxidizing gas at a low RF power level from 10–250 W. The oxidized organosilane or organosiloxane film has good barrier properties ... | 04/17/2007 |
| 7201022 | Systems and methods for filling voids and improving properties of porous thin films Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or ... | 04/10/2007 |
| 7172927 | Warpage control of array packaging During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-in... | 02/06/2007 |
| 7153724 | Method of fabricating no-lead package for semiconductor die with half-etched leadframe A series of grooves are etched in a leadframe to be used in fabricating a group of semiconductor packages at locations where the leadframe will later be sawed to separate the semiconductor packages. In variations of the process, the grooves may be wider or narrower ... | 12/26/2006 |
| 7094068 | Load board A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC f... | 08/22/2006 |
| 7080447 | Method of manufacturing solder mask of printed circuit board A solder mask manufacturing method adapted to apply a solder mask on a surface of a substrate of a circuit board, said surface is provided with a conductor pattern having an unsheltered portion and a sheltered portion which is covered by said solder mask. The method... | 07/25/2006 |
| 7066314 | Modular belt carrier for electronic components Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing ... | 06/27/2006 |
| 7052987 | Method for fabricating a low capacitance wiring layout Integrated circuits having multi-level wiring layouts designed to inhibit the capacitive-resistance effect, and a method for fabricating such integrated circuits, is described. The integrated circuits have at least two planes of wiring adjacent to each other and ext... | 05/30/2006 |
| 7026376 | Fluxing agent for underfill materials An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group o... | 04/11/2006 |
| 7020959 | Method of making conductive stud for magnetic recording devices Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head el... | 04/04/2006 |
| 7018678 | Electronic device manufacture Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits. ... | 03/28/2006 |
| 7014888 | Method and structure for fabricating sensors with a sacrificial gel dome A method and structure that protects interior electrical components of a pressure sensor (4) from corrosive particles using a sacrificial gel dome (30) to form a vent (34) in a protective gel (32) that covers electrical components that ca... | 03/21/2006 |
| 7009286 | Thin leadless plastic chip carrier A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas... | 03/07/2006 |
| 6969641 | Method and system for integrated circuit packaging According to one embodiment of the invention, a method of packaging integrated circuits includes disposing an integrated circuit chip outwardly from a first surface of a substrate, positioning the integrated circuit chip and the substrate between a first mold press ... | 11/29/2005 |
| 6703186 | Method of forming a conductive pattern on a circuit board A method of forming a conductive circuit pattern on a circuit board having a first region, on which a desired conductive circuit pattern is to be formed, and a second region. The method includes the step of applying a coating including a solution with con... | 03/09/2004 |
| 6699350 | Dielectric structure and method of formation A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively formed on the first layer, wherein the sticker layer inclu... | 03/02/2004 |
| 6696173 | Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same Described are conductor track structures on a nonconductive support material, especially fine conductor track structures, which are comprised of a base containing a heavy metal and a metallized coating applied to this, and a method for their production. T... | 02/24/2004 |
| 6695200 | Method of producing electronic part with bumps and method of producing electronic part Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed... | 02/24/2004 |
| 6676991 | Etch resist using printer technology The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad... | 01/13/2004 |
