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| Number | Title | Issue Date |
| 8147903 | Circuit pattern forming method, circuit pattern forming device and printed circuit board A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern ... | 04/03/2012 |
| 8142840 | Adhesion promotion in printed circuit boards An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is... | 03/27/2012 |
| 8110247 | Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials A method of depositing various materials onto heat-sensitive targets, particularly oxygen-sensitive materials. Heat-sensitive targets are generally defined as targets that have thermal damage thresholds that are lower than the temperature required to process a depos... | 02/07/2012 |
| 8105643 | Process for printing features with smaller dimensions The invention relates generally to a printing process. In particular, the invention relates to a printing process where a first-printed feature or vanishing trace causes a second-printed feature to have a smaller dimension than it would in the absence of the first-p... | 01/31/2012 |
| 8048479 | Method for placing material onto a target board by means of a transfer board A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material bath, wherein a first pressure acts on the material bath and a second ... | 11/01/2011 |
| 8034401 | Pattern forming method and pattern forming apparatus A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a shor... | 10/11/2011 |
| 7972650 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system us... | 07/05/2011 |
| 7820232 | Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the co... | 10/26/2010 |
| 7799370 | Method of forming through hole and method of manufacturing electronic circuit Provided is a method of manufacturing an electronic circuit. The method includes the steps of: forming a nucleus comprising thermo-expandable particles on a conductive layer provided on an insulating substrate; forming an insulating film on the conductive layer havi... | 09/21/2010 |
| 7771778 | Fabricating method of plastic substrate This invention relates to a fabricating method of a plastic substrate adapted to improve the stability of a display device fabrication process. The fabrication process utilizes the plastic substrate, which is inexpensive and easy to obtain. A fabricating method acco... | 08/10/2010 |
| 7767254 | Paste for solar cell electrode and solar cell In a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m2/g are used as the silver particles. The silver particles are preferab... | 08/03/2010 |
| 7722920 | Method of making an electronic device using an electrically conductive polymer, and associated products Described are methods of making an electronic device, such as an RFID tag, including fabricating an antenna by depositing an electrically conductive polymer onto a substrate. The electrically conductive polymer is electrically connected to an electronic component, s... | 05/25/2010 |
| 7718216 | Low temperature bumping process A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then a... | 05/18/2010 |
| 7704548 | Method for manufacturing wiring board A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an acco... | 04/27/2010 |
| 7651723 | Microelectronic fabrication system components and method for processing a wafer using such components A process chamber is provided which includes a gate configured to align barriers with an opening of the gate and an opening of the process chamber such that the two openings are either sealed or provide an air passage to the chamber. A method is provided and include... | 01/26/2010 |
| 7648730 | Paste for solar cell electrode and solar cell In a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m2/g are used as the silver particles. The silver particles are preferab... | 01/19/2010 |
| 7641934 | Process for the production of entry sheet for drilling and use thereof There are provided a process for the production of an entry sheet for drilling, comprising preparing a water-soluble resin composition solution by using a mixed solvent containing water and isopropyl alcohol in a specific ratio as a solvent of a water-soluble resin ... | 01/05/2010 |
| 7629019 | Method for forming wiring pattern, wiring pattern, and electronic apparatus A method for forming a wiring pattern in which a plurality of electrical wirings deposited onto a substrate is conductively connected with each other through a plurality of conductive posts, the method including relatively moving a discharge head having a plurality ... | 12/08/2009 |
| 7597928 | Material composition for packaging of light-sensitive components and method of using the same The invention pertains to a material composition for packaging. The composition comprises (a) an epoxy resin and (b) a curing agent, wherein the mixing ratio of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1. The invention also pertains to ... | 10/06/2009 |
| 7597929 | Method of manufacturing a wiring substrate A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening porti... | 10/06/2009 |
| 7585541 | Printed wiring board and method for manufacturing the same A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at... | 09/08/2009 |
| 7585540 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) patterning a surface-active agent on a substrate having first and second areas to be remained on the first area; (b) removing residues of the surface-active agent in the second area by wet-etch... | 09/08/2009 |
| 7517553 | Adhesive aid composition The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contai... | 04/14/2009 |
| 7514116 | Horizontal Carbon Nanotubes by Vertical Growth and Rolling Horizontal carbon nanotubes may be used for on-die routing and other applications. In one example, a catalyst is applied to a plurality of different points on a substrate. Carbon nanotubes are then grown vertically on the plurality of different points to form a plur... | 04/07/2009 |
| 7507434 | Method and apparatus for laminating a flexible printed circuit board An approach is provided for laminating layers for a flexible printed circuit board. The approach includes a method and apparatus for providing a base substrate and the surface of the base substrate is treated by radiating ion beams using a gas mixture including oxyg... | 03/24/2009 |
| 7476412 | Method for the metalization of an insulator and/or a dielectric The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized. | 01/13/2009 |
| 7429401 | Superconformal metal deposition using derivatized substrates The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal proce... | 09/30/2008 |
| 7427423 | Components with conductive solder mask layers A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a... | 09/23/2008 |
| 7425350 | Apparatus, precursors and deposition methods for silicon-containing materials A method for making a Si-containing material comprises transporting a pyrolyzed Si-precursor to a substrate and polymerizing the pyrolyzed Si-precursor on the substrate to form a Si-containing film. Polymerization of the pyrolyzed Si-precursor may be carried out in ... | 09/16/2008 |
| 7404981 | Printing electronic and opto-electronic circuits A method is provided for printing electronic and opto-electronic circuits. The method comprises: (a) providing a substrate; (b) providing a film-forming precursor species; (c) forming a substantially uniform and continuous film of the film-forming precursor species ... | 07/29/2008 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7381441 | Low metal porous silica dielectric for integral circuit applications The invention relates to the production of nanoporous silica dielectric films and to semiconductor devices and integrated circuits comprising these improved films. The nanoporous films of the invention are prepared using silicon containing pre-polymers and are prepa... | 06/03/2008 |
| 7381442 | Porogens for porous silica dielectric for integral circuit applications The invention relates to the production of nanoporous silica dielectric films and to semiconductor devices and integrated circuits comprising these improved films. The nanoporous films of the invention are prepared using silicon containing pre-polymers and are prepa... | 06/03/2008 |
| 7374977 | Droplet discharge device, and method for forming pattern, and method for manufacturing display device It is an object of the present invention to improve the usability of a material, and to provide a display device which can be manufactured by simplifying the manufacturing process and a manufacturing technique thereof. It is also an object of the invention to provid... | 05/20/2008 |
| 7364835 | Developer-soluble materials and methods of using the same in via-first dual damascene applications Wet-recess (develop) gap-fill and bottom anti-reflective coatings based on a polyamic acid or polyester platform are provided. The polyamic acid platform allows imidization to form a polyimide when supplied with thermal energy. The gap-fill and bottom anti-reflectiv... | 04/29/2008 |
| 7356905 | Method of fabricating a high frequency ultrasound transducer Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epo... | 04/15/2008 |
| 7350297 | Method of manufacturing a wiring substrate A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece h... | 04/01/2008 |
| 7351357 | Printing of organic conductive polymers containing additives Additives to organic conducting polymers are described which enhance adhesion and resolution of printed films while retaining adequate electrical conductivity. The conductive polymer films are useful in printing conductive portions of thin film transistors such as s... | 04/01/2008 |
| 7350298 | Method for fabricating circuit board with conductive structure A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second surfaces of a circuit board; forming a conductive layer on the first insu... | 04/01/2008 |
| 7342053 | Resin composition, adhesive film using the same and multilayer printed circuit board Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curi... | 03/11/2008 |
