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Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
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| Number | Title | Issue Date |
| 8017195 | Method for vibrational damping of gas turbine engine airfoils A coating system and coating method for damping vibration in an airfoil of a rotating component of a turbomachine. The coating system includes a metallic coating on a surface of the airfoil, and a ceramic coating overlying the metallic coating. The metallic coating ... | 09/13/2011 |
| 7998537 | Method for selectively removing hydrogen from molecules Methods for removing hydrogen from molecules are disclosed. In one embodiment, hydrogen-containing molecules are deposited on a solid substrate and are bombarded with hydrogen projectile particles. The particles may have energies of 5-100 eV, or more preferably 10-5... | 08/16/2011 |
| 7887890 | Method of manufacturing plastic substrate using plasma process and plastic substrate manufactured using the method Provided is a method of manufacturing a plastic substrate with lower auto-fluorescence and better specificity. The method includes: (a) preparing a plastic substrate having an Atomic Force Microscopic (AFM) surface roughness of Ra | 02/15/2011 |
| 7645494 | Pre-plating surface treatments for enhanced galvanic-corrosion resistance The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing ma... | 01/12/2010 |
| 7595096 | Method of manufacturing vacuum plasma treated workpieces A method of manufacturing vacuum plasma treated workpieces includes the steps of introducing at least one workpiece to be treated into a vacuum chamber; treating the workpiece in the vacuum chamber, thereby establishing a plasma discharge in the vacuum chamber by a ... | 09/29/2009 |
| 7569256 | Plasma CVD apparatus and dry cleaning method of the same In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which... | 08/04/2009 |
| 7374642 | Treatment process for improving the mechanical, catalytic, chemical, and biological activity of surfaces and articles treated therewith A continuous, uninterrupted two-step treatment process capable of forming nanometer scale physical structures on the surface of articles fabricated from metallic, ceramic, glass, or plastic materials, and then depositing a thin conformal coating on the nanostructure... | 05/20/2008 |
| 7372691 | Apparatus and method for joining two substrates A substrate attaching device (3) includes a vacuum chamber (31), a first electrostatic chuck (32) at least partly set in the vacuum chamber, and further includes a chuck body (321) with a plurality of gas releasing holes (322), a w... | 05/13/2008 |
| 7368151 | Antiscattering grid and a method of manufacturing such a grid An antiscattering grid for an X-ray imaging apparatus of the type comprising a substrate having a plurality of metallized partitions that together define a plurality of cells distributed over the substrate. The partitions allow passage of the X-rays emitted from a s... | 05/06/2008 |
| 7365026 | CHsacrificial layer for cu/low-k interconnects A semiconductor method of manufacturing involving low-k dielectrics is provided. The method includes depositing a hydrocarbon of the general composition CxHy on the surface of a low-k dielectric. The hydrocarbon layer is deposited by reacting a... | 04/29/2008 |
| 7361387 | Plasma enhanced pulsed layer deposition A process system and a deposition method for depositing a highly controlled layered film on a workpiece is disclosed. The basic component of the apparatus is a pulsing plasma source that is capable of either exciting or not-exciting a first precursor. The pulsing pl... | 04/22/2008 |
| 7361233 | Methods of hydrogen cleaning of metallic surfaces The pulsed partial pressure hydrogen cleaning of cobalt-based alloys in turbine components is achieved by disposing the component within a vacuum furnace and heating the component. Upon heating to about 1400° F., a partial pressure hydrogen gas and a vacuum are rep... | 04/22/2008 |
| 7354631 | Chemical vapor deposition apparatus and methods This invention includes chemical vapor deposition apparatus, methods of chemical vapor depositing an amorphous carbon comprising layer on a substrate, and methods of chemical vapor depositing at least one of Si3N4 and SixOy | 04/08/2008 |
| 7351607 | Large scale patterned growth of aligned one-dimensional nanostructures A method of making nanostructures using a self-assembled monolayer of organic spheres is disclosed. The nanostructures include bowl-shaped structures and patterned elongated nanostructures. A bowl-shaped nanostructure with a nanorod grown from a conductive substrate... | 04/01/2008 |
| 7347915 | Plasma in-situ treatment of chemically amplified resist A method for creating semiconductor devices by etching a layer over a wafer is provided. A photoresist layer is provided on a wafer. The photoresist layer is patterned. The wafer is placed in a process chamber. The photoresist is hardened by providing a hardening pl... | 03/25/2008 |
| 7326442 | Antireflective composition and process of making a lithographic structure An antireflective composition and a lithographic structure comprising a silicon-metal oxide, antireflective material derived from the composition. The antireflective composition comprises a polymer of formula I, | 02/05/2008 |
| 7316764 | System and method for performing sputter etching using independent ion and electron sources and a substrate biased with an a-symmetric bi-polar DC pulse signal A system and method for performing sputter etching includes an ion source that generates an ion current that is directed at a substrate and an electron source that generates an electron current directed at the substrate. Biasing circuitry biases the substrate with a... | 01/08/2008 |
| 7309515 | Method for fabricating an imprint mold structure The present invention is related to a method for fabricating an imprint mold which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more cap... | 12/18/2007 |
| 7309652 | Method for removing photoresist layer and method for forming metal line in semiconductor device using the same Disclosed are a method for removing a photoresist layer and a method for forming a metal line using the same. The method for removing a photoresist pattern, including the steps of: forming a bottom layer on a substrate by using the photoresist pattern as a mask; and... | 12/18/2007 |
| 7300684 | Method and system for coating internal surfaces of prefabricated process piping in the field The coating of internal surfaces of a workpiece is achieved by connecting a bias voltage such that the workpiece functions as a cathode and by connecting an anode at each opening of the workpiece. A source gas is introduced at an entrance opening, while a vacuum sou... | 11/27/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7288769 | Method for the production of and protective layer for a layer of luminescent material A protective layer is provided for an image detector used for an x-ray image. This image detector comprises a layer of luminescent material that is to be protected against mechanical stress and moisture. A polymeric protective layer is disposed thereupon and is hard... | 10/30/2007 |
| 7288284 | Post-cleaning chamber seasoning method A method for seasoning a process chamber is disclosed. The seasoning method includes providing a seasoning film on the interior surfaces of a process chamber, typically after cleaning of the chamber. ... | 10/30/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7273821 | Method for producing a porous coating The present invention relates to a process for producing a porous layer adhering to a substrate, which comprises the steps: a. preparation of a composition comprising an organic polymer constituent and an inorganic-organic constituent and/or an inorgani... | 09/25/2007 |
| 7270854 | Method for forming a head having improved spin valve properties A method for forming a magnetic head having an improved PtMn layer, including forming a PtMn layer by ion beam deposition, forming an antiparallel (AP) pinned layer structure above the PtMn layer, and forming a free layer above the AP pinned layer structure. The met... | 09/18/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7250197 | Plasma treatment of contact lens and IOL Intraocular lenses or contact lenses 20 are placed on a lower spindle 34 and held there by a vacuum in conduit 34. Noble and reactive gases 56, 58 are introduced and a voltage is applied across upper spindle 32 and lower spindle | 07/31/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7250196 | System and method for plasma plating An exemplary system and method for plasma plating are provided to generate a deposition layer on a substrate. The method for plasma plating includes positioning a substrate within a vacuum chamber, positioning a depositant in a filament within the vacuum chamber, re... | 07/31/2007 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer Disclosed is a method for depositing a metal layer on an interconnect structure for a semiconductor wafer. In the method, a metal conductor is covered by a capping layer and a dielectric layer. The dielectric layer is patterned so as to expose the capping layer. The... | 07/10/2007 |
| 7238412 | Thermally and electrically conducting high index contrast multi-layer mirrors and devices An optical device is provided. The optical device includes a plurality of high index layers. The optical device also includes a plurality of low index layers. The optical device is formed by creating alternating layers of the plurality of high layers and the plurali... | 07/03/2007 |
| 7229915 | Method for manufacturing semiconductor device A first insulating film, a second insulating film, a third insulating film, an antireflective film, and a resist film are formed in this order on a lower-layer wiring. After dry etching the third insulating film and the second insulating film, using the resist film ... | 06/12/2007 |
| 7226869 | Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing Methods for forming a protective polymeric coating on a silicon or silicon-carbide electrode of a plasma processing chamber are provided. The polymeric coating provides protection to the underlying surface of the electrode with respect to exposure to constituents of... | 06/05/2007 |
| 7223702 | Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each... | 05/29/2007 |
| 7223446 | Plasma CVD apparatus and dry cleaning method of the same In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which... | 05/29/2007 |
| 7220448 | Glass molding die and renewing method thereof A glass molding die and renewing method thereof. The molding die for molding glass includes a substrate, a first noble metal layer overlying the substrate, a second noble metal layer overlying the first noble metal layer, a carbon-containing third noble metal layer ... | 05/22/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7221495 | Thin film precursor stack for MEMS manufacturing This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a ... | 05/22/2007 |
