Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 7621732 | Molding apparatus for manufacturing semiconductor device A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which... | 11/24/2009 |
| 7462024 | Apparatus for molding a trim panel assembly having a narrow transition radius In at least certain embodiments, the present invention relates to a trim panel and an apparatus and method of making the same. In at least one embodiment, the trim panel comprises a first portion and a second portion with a transition portion extending therebetween ... | 12/09/2008 |
| 7427193 | Method and apparatus for forming a golf ball Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component undern... | 09/23/2008 |
| 7413425 | Resin sealing mold and resin sealing method A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respectiv... | 08/19/2008 |
| 7367793 | Mold with movable core insert A mold includes a first board (10), a second board (20), and a core insert (30). The first board is mounted on the second board, and the core insert is slidably mounted between the first board and the second board, under the control of an adjust... | 05/06/2008 |
| 7364683 | Rotary automatic transfer rail for injection molding Methods and assemblies related to a rotary automatic transfer rail for injection molding are disclosed. In one aspect, the invention includes a mold assembly. The mold assembly may include first, second, and third mold plates. The mold plates may be positioned gener... | 04/29/2008 |
| 7347963 | Method of molding resin to protect a resolver winding At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7 | 03/25/2008 |
| 7341687 | Method of forming a golf ball The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the p... | 03/11/2008 |
| 7335006 | In-mould labelling An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void ... | 02/26/2008 |
| 7302995 | Apparatus and method for injection-molding products An apparatus for injection-molding products, comprising an injection mold (2) divisible into at least two parts (6, 8) such that consequently at least one mold cavity (14) is cleared, wherein on at least one part of the injection mold guiding me... | 12/04/2007 |
| 7278845 | Concrete-block-making machine The invention relates to a concrete-block-making machine having a part which is displaceable via a linear drive, the linear drive comprising a drive unit and a linear guide for guide rollers, the drive unit comprising at least one linear motor and the linear guide c... | 10/09/2007 |
| 7267538 | Adjustable knockout This disclosure is directed to an adjustable knockout rod for use in conjunction with injection molding machines. The knock-out rod disclosed herein is preferably formed of a round bar having a plurality of annular notches or undercuts formed at uniform intervals al... | 09/11/2007 |
| 7264755 | Lens molding apparatus and related methods An adjustable mold includes a distortable boundary, a flexible membrane, and a pressurizer, and method of use thereof. Pressure is applied to the flexible membrane, which causes the membrane to distort over the boundary. The shape of the boundary and the distortion ... | 09/04/2007 |
| 7255320 | Mold for a plastic filter A mold, for molding a cylindrical filter having a narrow-pitched mesh structure through resin injection molding, has a cavity divided into sections radially freely attachable/detachable. The sections of the cavity being formed as stacked assemblies bodies each havin... | 08/14/2007 |
| 7241414 | Method and apparatus for molding a semiconductor device A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface... | 07/10/2007 |
| 7238014 | Manufacturing method of an electronic device package A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of t... | 07/03/2007 |
| 7217381 | Systems, methods and apparatuses for manufacturing dosage forms Systems, methods and apparatuses for manufacturing dosage forms, and to dosage forms made using such systems, methods and apparatuses are provided. Novel compression, injection molding, and thermal setting molding modules are disclosed. One or more of such modules m... | 05/15/2007 |
| 7214338 | Method and device for producing an electric insulator made from plastic A device including, and a method for producing, an electric insulator made of plastic, the insulator having a centrally arranged core made of glass fiber reinforced plastic, and having a plurality of insulation screens arranged coaxially around the core in an offset... | 05/08/2007 |
| 7204683 | Molding die for covering optical fiber and optical fiber cover forming device A mold is provided in which a molding portion, formed between joint surfaces of upper and lower molds superimposed one upon the other, is filled with UV curable resin after arranging a coating formation portion of an optical fiber in the molding portion, the coating... | 04/17/2007 |
| 7191999 | Variable height sideforms An improvement to concrete casting machines of the casting bed type in which the side forms are constructed and arranged to stay in an upright position at all times but may be raised and lowered. ... | 03/20/2007 |
| 7178779 | Resin molding die and production method for semiconductor devices using the same A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being ... | 02/20/2007 |
| 7175405 | Compression molding machine A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by th... | 02/13/2007 |
| 7172927 | Warpage control of array packaging During the curing process of the package strips, especially during post encapsulant cure (PEC), undesirable warpage of package strips occurs. A carrier having angled lands and side-insertion clamp structures with angled clamp fins may be used to control this cure-in... | 02/06/2007 |
| 7156633 | Apparatus for encapsulating a multi-chip substrate array A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carri... | 01/02/2007 |
| 7153116 | Resin molding machine The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a moldi... | 12/26/2006 |
| 7147447 | Plastic semiconductor package having improved control of dimensions A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The enc... | 12/12/2006 |
| 7128869 | Method and device for producing shell-shaped, plastic parts reinforced with fibre mats A process and a production installation for producing shell-shaped, fiber-reinforced plastic parts are provided. The plastic parts can be produced efficiently, in an automated manner which is flexible with respect to the process and workpiece and is operationally re... | 10/31/2006 |
| 7128860 | Production of composite insulators by injecting different screens onto an insulator shank The invention relates to the production of composite insulators consisting of a shank in the form of a bar or a tube, which is provided with a covering and which comprises plate-like screens which are distanced from each other. The covering and the screens are made ... | 10/31/2006 |
| 7114939 | Encapsulating brittle substrates using transfer molding A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold... | 10/03/2006 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an inte... | 09/26/2006 |
| 7098082 | Microelectronics package assembly tool and method of manufacture therewith A method of manufacturing a microelectronic package comprising, in one embodiment, providing a package substrate, coupling a device substrate to the package substrate, and assembling a bifurcated mold around the device and package substrates, the bifurcated mold inc... | 08/29/2006 |
| 7097439 | Manufacturing device and manufacturing method for synthetic resin hollow molded body A manufacturing device for a synthetic resin hollow molded body molds a first split assembly member, a second split assembly member, and a third split assembly member by a first injection, and joints each of contact portions of the three members with a corresponding... | 08/29/2006 |
| 7089661 | Method for packaging small size memory cards A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated ... | 08/15/2006 |
| 7087199 | Process for the manufacture of an article covered with a supple insert Process for the manufacture of an article comprising a rigid support element of which a “show” face is partially covered by a supple covering. The covering is connected to a relatively rigid holding element having its own shape and a strength such that it is not... | 08/08/2006 |
| 7074032 | Injection mechanism for injection molding machine An injection mechanism for an injection molding machine includes a front plate carrying an injection cylinder. A guide rod is arranged fixedly relative to the front plate, and defines a longitudinal guiding axis. A movable plate is arranged movably relative to said ... | 07/11/2006 |
| 7062889 | Door A peripherally encapsulated product, such as an oven door outer shell, is molded in accordance with this invention by placing a piece of glass between mold clamping portions of relatively movable closed bodies when the latter are in an open position. Preferably both... | 06/20/2006 |
| 7008575 | Resin sealing mold and resin sealing method A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respectiv... | 03/07/2006 |
| 7001561 | Right angle tube connector A method and apparatus for molding a right angle connector onto a tube end portion. The tube end portion is positioned in a mold cavity; an axially extending core is positioned in the mold cavity with the axis of the core at a right angle to the axis of the tube end... | 02/21/2006 |
| 6923632 | Method and apparatus for forming a casting which includes an insert An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a ... | 08/02/2005 |
| 6910874 | Apparatus for encapsulating a multi-chip substrate array A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carri... | 06/28/2005 |
