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An aircraft having vertical takeoff and landing capability provided with at least first and second laterally extending paddle wheels rotatable on a central axis perpendicular to the longitudinal axis of the aircraft fuselage and between its nose and tail.
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| Number | Title | Issue Date |
| 8152508 | Apparatus for manufacture of single-use dental floss holders The invention concerns a mold for forming a single-use floss holder containing a length of dental floss having a wax composition applied thereto, the mold including a first part having a first cavity disposed therein, the first cavity defined by a bottom base surfac... | 04/10/2012 |
| 8133047 | Injection molding metal mold and shaped article An injection-molding die including: a fixed die; a movable die; a cavity defined by the fixed die and the movable die; and a gate for injecting a melt resin into the cavity. The cavity includes: a flow-dividing structure that divides a flow of the melt resin injecte... | 03/13/2012 |
| 8123509 | Injection molding process for the preparation of an oral delivery device for the pharmaceutically active agent An injection molding process for the preparation of an oral delivery device comprising a core which contains a pharmaceutically active agent, having a coating with one or more openings leading to such a core. The invention also relates to devices produced by the pro... | 02/28/2012 |
| 8100681 | Molding a battery A mold for a battery, such as a secondary battery, and a method of molding a battery, such as a secondary battery, using the mold, uses a minimum amount of a molding substance, such as a resin, has its molding time shortened, and has a safety vent of a can being pre... | 01/24/2012 |
| 8079841 | Golf ball and golf ball mold The invention provides a golf ball manufactured using a mold having a top half and a bottom half, which ball has formed on a surface thereof, near a seam line corresponding to a parting line between the top and bottom halves of the mold, a recessed and/or raised mar... | 12/20/2011 |
| 7927086 | Manufacturing apparatus for use with a membrane electrode assembly and method for manufacturing same Disclosed herein is a membrane electrode assembly with a superior power generating efficiency and a method of manufacturing the same. Also disclosed is a manufacturing apparatus thereof wherein a gasket with an optimum thickness can be easily applied to the membrane... | 04/19/2011 |
| 7901196 | Molding apparatus incorporating pressure uniformity adjustment A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustme... | 03/08/2011 |
| 7887313 | Mold apparatus for resin encapsulation and resin encapsulation method To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Theref... | 02/15/2011 |
| 7798797 | Foaming die device for forming armrest A foaming die device is provided, in which can be directly placed a basic armrest unit having a shaft element and a connecting bracket rotatably secured to the shaft element. The foaming die device comprises a lower die, an upper die, and an auxiliary die element of... | 09/21/2010 |
| 7771181 | Gasket molding system for membrane electrode assemblies The present invention is a system for molding a gasket to a membrane electrode assembly. The system comprises a cavity defined at least in part by closable mold blocks, at least one injection gate for injecting gasket material into the cavity, a mount for retaining ... | 08/10/2010 |
| 7753667 | Resin-sealed mold and resin-sealed device A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched... | 07/13/2010 |
| 7744361 | Apparatus for forming hollow moldings having thin film on inner surface The method employs a stationary mold having depositing recesses equipped in its inside with a deposition element such as a target electrode, and movable molds made slidable. A primary molding is performed to form a body portion and a cover member to have joint porti... | 06/29/2010 |
| 7740465 | Casting mold for producing an optical semiconductor module A method and a casting mold for producing an optical semiconductor module is provided, wherein a semiconductor body having at least one optically active element on its top is introduced into a leadframe. Then conductive connections are established between the semico... | 06/22/2010 |
| 7713044 | Apparatus for producing a golf ball with deep dimples An apparatus and related techniques for making a golf ball with deep dimples are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides deep dimples that extend through the cover layer and/or into a layer or component underneat... | 05/11/2010 |
| 7695264 | Mold for forming golf ball There are provided a golf ball molding die capable of manufacturing a golf ball having a satisfactory surface condition, and a golf ball manufactured by using the die. The present golf ball molding die comprises at least two die bodies within which a cavity for mold... | 04/13/2010 |
| 7637729 | Modular articulating cement spacer mold The present teachings provide a modular articulating cement spacer mold for forming a temporary implant. The modular spacer mold includes a head component mold defining a first opening, a head connector positioned within the first opening of the head component mold,... | 12/29/2009 |
| 7618249 | Memory card molding apparatus and process A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is con... | 11/17/2009 |
| 7448861 | Resin molded semiconductor device and mold To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional ... | 11/11/2008 |
| 7427193 | Method and apparatus for forming a golf ball Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component undern... | 09/23/2008 |
| 7425122 | Method of manufacturing an in-mold laminate component A method is provided for manufacturing a painted plastic component such as painted air bag covers, side cladding or exterior bumpers, which includes a painted film sheet and a one-piece thermoplastic elastomeric structural carrier. A bottom contact surface of the fi... | 09/16/2008 |
| 7416397 | Waterproof slide fastener and apparatus for manufacturing the same A waterproof slide fastener and a manufacturing apparatus thereof are disclosed, wherein each fastener element has a coupling head, a neck portion, a body portion, and leg portions which are continuously fused and integrated, a terminal end is projected from a gap b... | 08/26/2008 |
| 7407832 | Method for manufacturing semiconductor package A die for encapsulating an IC structural body having bonding wires with a molten resin is provided with at least one first half having an ejector-pin-through-hole and at least one second half coupled together to form a cavity therebetween. An ejector pin having a mi... | 08/05/2008 |
| 7396222 | Insert molding die and method for molding hollow component A molding die includes an upper die, upper-die pins arranged in the upper die to be movable up and down, springs arranged in the upper die to urge the upper-die pins downwardly, a lower die, lower-die pins arranged in the lower die to be movable up and down and spri... | 07/08/2008 |
| 7393489 | Mold die for molding chip array, molding equipment including the same, and method for molding chip array Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block wher... | 07/01/2008 |
| 7387504 | Mold for a golf ball An improved mold for making a golf ball comprises a pair of mold cups which are assembled together at an angular interlock. An upper mold cup has a projection rim that mates with a recess in the lower mold cup to provide for a substantially perfect registration, whe... | 06/17/2008 |
| 7381041 | Injection mold assembly A method and assembly for molding golf balls is disclosed herein. The invention includes an injection mold assembly (20) with a first mold half (22a) having a plurality of cavities and at least one locating pin (92) and a second mold half... | 06/03/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7365369 | Nitride semiconductor device A nitride semiconductor device used chiefly as an LD and an LED element. In order to improve the output and to decrease Vf, the device is given either a three-layer structure in which a nitride semiconductor layer doped with n-type impurities serving as an n-type co... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7347683 | Mold and molding apparatus using the same A molding apparatus for patterning a workpiece includes a mold having a pattern to be transferred to the workpiece, with the pattern including recesses, a first support member for supporting the mold, and a second support member, arranged opposite to the first suppo... | 03/25/2008 |
| 7347964 | Method and apparatus for demolding a golf ball An apparatus and method for demolding golf balls from a mold cavity are disclosed. More specifically, an apparatus and method for demolding a golf ball from a mold cavity subsequent to forming a cover layer without the use of ejector or knockout pins are disclosed. ... | 03/25/2008 |
| 7348211 | Method for fabricating semiconductor packages A method for fabricating semiconductor packages is proposed. A plurality of substrates each having a chip thereon are prepared. Each substrate has similar length and width to the predetermined length and width of the semiconductor package. A carrier having a plurali... | 03/25/2008 |
| 7347963 | Method of molding resin to protect a resolver winding At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7 | 03/25/2008 |
| 7341613 | Filter elements having injection molded thermoplastic seals and methods of making same Seals for filter elements having filter packs with seals around the periphery thereof adjacent to one of the faces are produced by injection molding the seal onto the filter pack using an ethylene-propyleneterpolymer (EPDM) thermoplastic material. Preferably, the th... | 03/11/2008 |
| 7341687 | Method of forming a golf ball The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the p... | 03/11/2008 |
| 7335114 | Multilayer golf ball with a thin thermoset outer layer The present invention is directed towards a method of forming a multilayer golf ball which comprises a core, an inner cover layer and an outer cover layer. The steps include forming a golf ball core; molding an inner cover layer around said golf ball core with a mat... | 02/26/2008 |
| 7335006 | In-mould labelling An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void ... | 02/26/2008 |
| 7326041 | Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby ... | 02/05/2008 |
| 7323361 | Packaging system for semiconductor devices A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that has pre-formed gull-wing leads only on the source/gate side of the chi... | 01/29/2008 |
