A simulation environment for the sport of boxing utilizing a robotic machine interface system which carries a person
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7404916 | Process for producing polyurethane moldings Cellular or compact polyurethane moldings are produced by conveying at least one isocyanate component and at least one polyol component by a metering machine in dispensing manner into a mixing chamber via component lines to form a polyurethane reaction mixture. Subs... | 07/29/2008 |
| 7370565 | Apparatus for mixing explosive materials and for filling of ordnance Described herein is apparatus for the mixing of explosive materials utilising a static mixer (26) for combining pre-mix explosive material and hardener prior to introducing the combined mixture into any ordnance (38). ... | 05/13/2008 |
| 7335965 | Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structur... | 02/26/2008 |
| 7301190 | Structures and methods to enhance copper metallization Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a meta... | 11/27/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7276788 | Hydrophobic foamed insulators for high density circuits A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive s... | 10/02/2007 |
| 7268413 | Bipolar transistors with low-resistance emitter contacts Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching spe... | 09/11/2007 |
| 7262130 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have... | 08/28/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7253521 | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in combination with diffusion barriers, rather than aluminum, to form the wi... | 08/07/2007 |
| 7240689 | Multiple component mixing head The invention relates to a mixing head and to a method of mixing at least one polyol component and at least one isocyanate component and where appropriate additives, to form a polyurethane reaction mixture. ... | 07/10/2007 |
| 7230037 | Method for mixing a polyol component and an isocyanate component The present invention relates to a method for the continuous mixing of at least one polyol component and at least one isocyanate component and optionally additives to form a polyurethane reaction mixture in a stirrer mixer with an axially conveying stirrer. ... | 06/12/2007 |
| 7229663 | Display comprising a cholesteric liquid-crystal in hardened gelatin and method for making the same A method of making a liquid-crystal sheet material, useful for displays, having polymer-dispersed cholesteric liquid crystals, comprising the steps of providing a emulsion comprising dispersed cholesteric liquid crystal domain and a solution comprising gelatin and a... | 06/12/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7207391 | Selectable fixed flow large scale fire fighting nozzle with selectable additive proportioning and light weight cost effective construction An industrial scale fire fighting nozzle and method, the nozzle having a selectively adjustable discharge gap and providing for gap coordinated, independently selectable additive proportioning ratio selection, the method including discharging fire fighting fluid at ... | 04/24/2007 |
| 7192547 | Method for manufacturing a golf product A process for reaction injection molding a polyurethane material for a layer of a golf ball is disclosed herein. The layer is preferably a cover for the golf ball. The process discloses preferred pressure parameters and mass flow parameters for reaction injection mo... | 03/20/2007 |
| 7192996 | Manufacturing solvent-free solid paint A method and apparatus for manufacturing small batches of solid paint is disclosed, which method includes a first step of providing a component of the solid paint as a liquid in a heated mixing container that has a base and sides and includes a stirrer for stirring ... | 03/20/2007 |
| 7192989 | Method and expansion device for preparing expanded thermoplastic microspheres The present invention relates to a method of preparing expanded thermoplastic microspheres, comprising charging thermally expandable microspheres into an expansion device comprising rotating feeding means enveloped by a hollow body, and one or more scrapers. The inv... | 03/20/2007 |
| 7186102 | Apparatus and method for low-density cellular wood plastic composites A low-pressure CO2 tank or an air compressor with a refrigerated air dryer is attached either at or after the vent zone of a standard twin-screw extruder. During or after extrusion, the gas is dissolved in the wood-plastic melt. The CO2 expands... | 03/06/2007 |
| 7182221 | Dispensing system and method of manufacturing and using same with a dispenser tip management A mixing module for use in a dispenser system having a housing with a front end, a rear end and an interior opening between the front and rear end, and the housing having a cap covering at the front end. A rod and a mixing chamber are received within the interior op... | 02/27/2007 |
| 7182897 | Method of storing material into which gas saturates A method of storing a material into which a gas saturates, before the material is foamed in a metal mold. The material into which a gas saturates is stored at a predetermined ambient pressure and predetermined ambient temperature to maintain a gas saturated state, t... | 02/27/2007 |
| 7178978 | Fluid mixing apparatus and method This invention relates to devices, methods, and systems for mixing materials, and in particular provides linkages and containers such as syringes in operative arrangement such that actuation of the linkages can move material from one container to another thereby mix... | 02/20/2007 |
| 7135112 | Flocculation apparatus for treating colloidal suspensions A flocculation apparatus and method for treating colloidal suspensions. The apparatus includes a suspension inlet, a suspension outlet and an inner cone mounted centrally in a conical outer housing. The inner cone and/or the outer housing is rotatable relative to on... | 11/14/2006 |
| 7131602 | Aerosol product The present invention provides an aerosol product, which sprays a large number of independent bubbles in the form of soap bubbles. More specifically, the aerosol product, which sprays a large number of independent bubbles in the form of soap bubbles, is provided by ... | 11/07/2006 |
| 7128552 | Self-cleaning mold valve for a molding system A mold valve assembly includes a mold valve chamber having an output port and an injection chamber in communication with the mold valve chamber. A first actuator drives an injection piston within the injection chamber to drive mixture material from an inlet port int... | 10/31/2006 |
| 7118362 | Pellet-type foams of non-crosslinked polypropylene resin having lower melting point and process and device for producing the same and molded foams therefrom The present invention relates to a pellet-type non-crosslinked polypropylene foam having a melting point of 125 to 140° C., and a process and device for producing said foam. Since the pellet-type foams of non-crosslinked polypropylene of the present invention has a... | 10/10/2006 |
| 7105914 | Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion implantation followed by a selective deposition of metal lines for the i... | 09/12/2006 |
| 7107601 | Foam molding method and apparatus According to this invention, there is provided a molding method and apparatus which increase the gas permeation speed in obtaining a foamed resin molded product by letting a gas permeate a molten resin material. To achieve this object, a chip- or pellet-like resin m... | 09/12/2006 |
| 7101163 | Process and apparatus for the continuous production of slabstock foam Slabstock foam free of cavities can be produced without any restriction, i.e. also from rapidly reacting chemical systems, by introducing the liquid reaction mixture from underneath, in front of, and/or through an optionally swivellable floor plate, wherein the floo... | 09/05/2006 |
| 7093972 | Tri-tilt mixing head A mixing head assembly comprising a housing having an input mix chamber passageway and a non-perpendicular output passageway. The assembly also includes a first input including a first nozzle for injecting a first fluid into the input mix chamber passageway and a se... | 08/22/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7083403 | Apparatus for supplying a resin material to an injection molding machine An apparatus for supplying a resin material to an injection molder comprises a vessel for storing a resin material, gas supplying means for supplying an inert gas to the vessel which is not a super-critical state, and material supplying means for supplying the resin... | 08/01/2006 |
| 7083115 | Spray gun with removable heat jacket A spray gun having a relatively simple outer heat jacket designed to accommodate a multiplicity of fluid supply lines connected to the spray gun while effectively heating and maintaining the supply fluids directed through the gun to the desired temperature for optim... | 08/01/2006 |
| 7074368 | Batch-type polyester polymerization apparatus A batch-type polyester polymerization apparatus manufactured by assembling a conventional batch-type apparatus with a thin film tower. The batch-type polyester polymerization apparatus is advantageous in that oligomer is polymerized while forming a polyester thin fi... | 07/11/2006 |
| 7066401 | Lance-type liquid reducing agent spray device A lance-type spraying assembly for directing a reducing agent into a combustion zone or discharging combustion gases for Nox emission control. The spraying assembly including a lance body having an inlet end and a downstream end and a spray nozzle arranged at the do... | 06/27/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
| 7056837 | Process of insulating a semiconductor device using a polymeric material A dielectric material formed by contacting a low dielectric constant polymer with liquid or supercritical carbon dioxide, under thermodynamic conditions which maintain the carbon dioxide in the liquid or supercritical state, wherein a porous product is formed. There... | 06/06/2006 |
| 7029162 | Process and apparatus for continuous mixing of slurry with removal of entrained bubbles The present system comprises an apparatus and a process for continuously dispersing fine particles in a liquid. The apparatus comprises a mixer that has at least one inlet for receiving the fine particles and liquid and an outlet. The mixer further comprises a barre... | 04/18/2006 |
| 7008202 | Method and apparatus for forming thermoplastic resin foam The present invention relates to the step of plasticizing a thermoplastic resin material by rotatably driving a screw (20). Also included in the method is the step of injecting an inert gas into a screw cylinder (1) to permeate the melted resin and inj... | 03/07/2006 |
| 6995470 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 02/07/2006 |