Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Number | Title | Issue Date |
| 7195144 | Method for production of a component On production of a component, two primary pieces must often be fixed together to give one piece. In order to achieve the above, it is important that the two primary pieces are oriented in a particular manner during the fixing process, which provides some difficultie... | 03/27/2007 |
| 7166796 | Method for producing a device for direct thermoelectric energy conversion In devices used for the direct conversion of heat into electricity, or vice versa, known in the art as thermoelectric power generators, thermoelectric refrigerators and thermoelectric heat pumps, the efficiency of energy conversion and/or coefficient of performance ... | 01/23/2007 |
| 7048813 | Foil-form soldering metal and method for processing the same The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subj... | 05/23/2006 |
| 7041180 | Method for joining workpieces using soldering alloy A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum;... | 05/09/2006 |
| 6863746 | White gold compositions without nickel and palladium The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the pres... | 03/08/2005 |
| 6770105 | Method and device for treating fuel A fuel catalyst for improving combustion efficiency is provided that includes at least one hydride producing element, and at least one element of greater activity on the electrolytic scale than the hydride producing element and at least one element of lesser activit... | 08/03/2004 |
| 6767653 | Coatings, method of manufacture, and the articles derived therefrom A turbine component comprises a substrate; and a crystalline coating disposed on a surface of the substrate, wherein the crystalline coating comprises tin and yttrium in an amount greater than or equal to about 0.05 atomic percent based upon the total coating. A met... | 07/27/2004 |
| 6613275 | Non-precious dental alloy The present invention concerns a non-precious dental alloy, including the following components, with the approximate proportions, in weight, given in %: gold, between 0.5 and 4, molybdenum, between 4 and 6, tungsten, between 2 and 7, indium, be... | 09/02/2003 |
| 6319617 | Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T... | 11/20/2001 |
| 6306185 | Method and device for treating fuel A fuel catalyst for improving combustion efficiency is provided that includes at least one hydride producing element, and at least one element of greater activity on the electrolytic scale than the hydride producing element and at least one element of les... | 10/23/2001 |
| 6306516 | Article comprising oxide-bondable solder The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to prom... | 10/23/2001 |
| 6238823 | Non-stoichiometric AB5 alloys for metal hydride electrodes The present invention provides a non-stoichiometric alloy comprising a composition having the formula AB5+X an atomic ratio wherein A is selected from the group consisting of the rare earth metals, yttrium, mischmetal, or a combination thereof;... | 05/29/2001 |
| 6231693 | Alloy, in particular a solder alloy, for joining workpieces The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed ... | 05/15/2001 |
| 6156132 | Solder alloys Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0... | 12/05/2000 |
| 6071359 | Shot for use as ammunition Tin and zinc based shot for use as ammunition having a diameter of from 1.5 to 5.5 mm, containing, by weight, in addition to tin and the usual unavoidable contaminants, from 12 to 60% of zinc and from 0 to 5% of aluminum, but less than 0.1% of copper, les... | 06/06/2000 |
| 5871690 | Low-temperature solder compositions Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154°-162° C. The solder compositions have microstr... | 02/16/1999 |
| 5833921 | Lead-free, low-temperature solder compositions Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133°-167° C. The solders are lead-free and have low melting points maki... | 11/10/1998 |
| 5755896 | Low temperature lead-free solder compositions Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99°-124° C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting... | 05/26/1998 |
| 5728913 | Moisture based method of improving the performance of hydrocarbon fuels A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used internal and external combustion engines The catalyst is a base metal alloy catalyst including tin antimony, lead and mer... | 03/17/1998 |
| 5705695 | Quaternary Zintl composition (Et4 N)4 Au(Ag1-x Aux)2 Sn2 Te9 ! The quaternary Zintl material (Et4 N)4 Au(Ag1-x Aux)2 Sn2 Te9 ! that contains 1-D semiconducting chains composed of four metallic elements is prepared by treating ethylenediami... | 01/06/1998 |
| 5698160 | Lead-free alloys for use in solder bonding According to the present invention, an article of manufacture is provided having at least one region which includes a lead-free solder composition. The lead-free solder composition comprises an alloy of at least 50 wt. % tin and 7-30 wt. % zinc. An effect... | 12/16/1997 |
| 5637160 | Corrosion-resistant bismuth brass There is provided a machinable +ଲ brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100° C.-3... | 06/10/1997 |
| 5625118 | Method of improving the performance of hydrocarbon fuels A method of treating hydrocarbon fuels with a base metal catalyst is provided for improving the performance of hydrocarbon fuels used in internal and external combustion engines. The catalyst is a base metal alloy catalyst including tin, antimony, lead an... | 04/29/1997 |
| 5532076 | Hydrogen storage alloy and electrode therefrom A hydrogen storage alloy preferably used for electrodes in alkaline rechargeable battery is of the general formula: Zr1.2-a Tia Mnv Alw Nix My Crz wherein M represents at least o... | 07/02/1996 |
| 5514334 | Fine lead alloy wire for forming bump electrodes This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 05/07/1996 |
| 5462437 | Dental alloys for composite and porcelain overlays A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870° C. and 1230° C. and a coefficient of thermal expansion of between 15.5×10-6 and ... | 10/31/1995 |
| 5393723 | Catalyst for improving the combustion and operational qualities of hydrocarbon fuels The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percen... | 02/28/1995 |
| 5384090 | Fine wire for forming bump electrodes using a wire bonder This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 01/24/1995 |
| 5248476 | Fusible alloy containing bismuth, indium, lead, tin and gallium An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.... | 09/28/1993 |
| 5240172 | Solder alloy for dental and jewelry parts White solder alloys for dental and jewelry parts, with working temperatures around 1000° C., contain 38 to 70% by weight gold, 6 to 20% by weight palladium, 8 to 40% by weight silver, 1 to 6% by weight iron and/or cobalt, 0 to 10% by weight copper, 0-5% ... | 08/31/1993 |
| 5185125 | Dental alloy and amalgam thereof A dental alloy having, upon amalgamation, a desirable combination of physical properties and both a desirable condense time and carve time. The alloy contains from 48.75 to 50.75% silver, 20.25 to 21.75% copper, 28.25 to 29.25% tin, 0.05 to 0.8% palladium... | 02/09/1993 |
| 5075076 | Novel palladium-based alloys containing tin and their use in the glass industry The invention relates to a novel palladium-based alloy. This palladium-based alloy comprises tin in an amount, preferably of 5 to 20% by weight, which is sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially e... | 12/24/1991 |
| 5051235 | Novel palladium-based alloys containing indium bismuth, silver and copper The invention relates to a novel palladium-based alloy. This palladium-based alloy comprises at least one additional element selected from indium, bismuth, silver and copper, in an amount sufficient to impart an acceptable resistance to corrosion by molten gla... | 09/24/1991 |
| 5039479 | Silver alloy compositions, and master alloy compositions therefor A silver alloy composition exhibiting the desirable properties of reduced fire scale, reduced porosity, reduced grain size and reduced oxide formation when heated, consists essentially of the following parts by weight: about 89-93.5% silver, about 0.02-2%... | 08/13/1991 |
| 5019336 | Micro-additions to tin alloys Tin-based alloys that include micro-additions of certain elements avoid the discoloration that otherwise afflict those alloys when they are melted. The discoloration, which results from tin oxidation, correlates with poor performance of the alloys in fill... | 05/28/1991 |
| 5011658 | Copper doped low melt solder for component assembly and rework Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level... | 04/30/1991 |
| 4975244 | Non-ferrous soft soldering lead-tin-antimony alloy compositions Soft soldering compositions posessing equal or better melting, wetting and strength properties than conventional straight tin-lead solders but with a reduced tin content are disclosed. The compositions consist of 1-35 wt % tin, 5-30 wt % cadmium 0.05-2.5 ... | 12/04/1990 |
| 4904577 | Optical recording element and alloy for use therein There is disclosed an antimony, tin and indium alloy which contains an additional element. The additional element is selected from the group consisting of titanium, aluminum, magnesium, manganese, silver, bismuth, germanium, lead, tellurium, gold, zinc, c... | 02/27/1990 |
| 4902342 | Method for the manufacture of non-allergy creating precious metal objects A method and an apparatus for the manufacture of non-allergy creating objects, especially objects of metal for direct contact with the skin of a human body, for instance jewelery, watches, glasses etc. whereby completely pure metals, especially precious m... | 02/20/1990 |
| 4891184 | Low density heat resistant intermetallic alloys of the Al3 Ti type Low density, high temperature and aluminum-rich intermetallic alloys displaying excellent elevated temperature properties, including oxidation resistance, are disclosed. Based on the aluminum/titanium system, specifically modifications of Al3 T... | 01/02/1990 |
