Class 420/577 - BISMUTH BASE

Subclass of Class 420 - Alloys or metallic compositions
Definition: Alloy, or metallic composition which contains over 50 percent of bismuth by weight.
No. of patents: 34
Last issue date: 03/13/2012

Number	Title	Issue Date
8133433	Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture The disclosure relates to fluorescent lamps and methods of manufacture wherein the mercury is dosed into the lamp in a solid material containing mercury, bismuth, indium and another metal. In one embodiment, the metal is selected from the group consisting of zinc, t...	03/13/2012
7192785	Water-soluble luminescent quantum dots and biomolecular conjugates thereof and related compositions and methods of use The present invention provides a water-soluble luminescent quantum dot, a biomolecular conjugate thereof and a composition comprising such a quantum dot or conjugate. Additionally, the present invention provides a method of obtaining a luminescent quantum dot, a met...	03/20/2007
7128981	Sliding member Disclosed is a sliding member including an overlay layer made of a Bi based alloy comprising Cu as an essential element and at least one element selected from the group of Sn and In, wherein the Bi based alloy comprises 0.1 to 10 mass % of Cu and 0.5 to 10 mass % in...	10/31/2006
6946190	Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di...	09/20/2005
6835332	PROCESS FOR PRODUCING AN ELECTRODE MATERIAL FOR A RECHARGEABLE LITHIUM BATTERY, AN ELECTRODE STRUCTURAL BODY FOR A RECHARGEABLE LITHIUM BATTERY, PROCESS FOR PRODUCING SAID ELECTRODE STRUCTURAL BODY, A RECHARGEABLE LITHIUM BATTERY IN WHICH SAID ELECTRODE STRUCTURAL BODY IS USED, AND A PROCESS FOR PRODUCING SAID RECHARGEABLE LITHIUM BATTERY A process for producing an electrode material for a rechargeable lithium battery, comprising the steps of mixing a metal compound (a) of a metal (a′) capable of being electrochemically alloyed with lithium, a transition metal compound (b) of a transition metal (b�...	12/28/2004
6703113	Pb-free solder composition and soldered article Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder compos...	03/09/2004
6468808	Water-soluble luminescent quantum dots and biomolecular conjugates thereof and related compositions and method of use The present invention provides a water-soluble luminescent quantum dot, a biomolecular conjugate thereof and a composition comprising such a quantum dot or conjugate. Additionally, the present invention provides a method of obtaining a luminescent quantum...	10/22/2002
6367683	Solder braze alloy The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in th...	04/09/2002
6319617	Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T...	11/20/2001
6306516	Article comprising oxide-bondable solder The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to prom...	10/23/2001
6156132	Solder alloys Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0...	12/05/2000
5833921	Lead-free, low-temperature solder compositions Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133°-167° C. The solders are lead-free and have low melting points maki...	11/10/1998
5755896	Low temperature lead-free solder compositions Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99°-124° C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting...	05/26/1998
5641454	Composite material having anti-wear property and process for producing the same Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80° to 280° C., and metallic dispersing particl...	06/24/1997
5593082	Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are available wherein a solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a low melting point...	01/14/1997
5569433	Lead-free low melting solder with improved mechanical properties We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising ...	10/29/1996
5505928	Preparation of III-V semiconductor nanocrystals Nanometer-scale crystals of III-V semiconductors are disclosed, They are prepared by reacting a group III metal source with a group V anion source in a liquid phase at elevated temperature in the presence of a crystallite growth terminator such as pyridin...	04/09/1996
5503475	Method for determining the carbon equivalent, carbon content and silicon content of molten cast iron In measuring a cooling curve by means of thermal analysis of cast iron, a compressed powder moulding or sintered moulding of tellurium, bismuth, boron, zinc and/or aluminum is fixed to the inner surface of a cooling curve measuring cup, and a melt is pour...	04/02/1996
5368814	Lead free, tin-bismuth solder alloys The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancin...	11/29/1994
5248476	Fusible alloy containing bismuth, indium, lead, tin and gallium An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking....	09/28/1993
5192377	Process of producing continuously cast monotectic aluminum-silicon alloy strip and wire In a process of producing strip or wire, which consists of a monotectic aluminum-silicon alloy comprising a matrix consisting of aluminum and an aluminum-silicon eutectic system and as a minority phase 1 to 50% by weight lead or bismuth included in said m...	03/09/1993
5126168	Preparation of group IIIA-VA compounds such as boron nitride, and of boron nitride films and coatings Lewis base-borane complexes such as (CH3)2 S.BHBr2 are utilized as molecular precursors for the formation of both bulk powders, films and coatings of boron nitride. The complexes are subjected to slow heating under an ammo...	06/30/1992
5098656	Alloys for electrically joining superconductors to themselves, to normal conductors, and to semi-conductors A unique class of bonding alloys and methods for their use are provided which enable the user to electrically join superconductive materials to themselves, to normal conductive materials, or to semi-conductors. The bonding alloys have enhanced wetting pro...	03/24/1992
5039576	Electrodeposited eutectic tin-bismuth alloy on a conductive substrate An electroplating bath, cell and method for the electrodeposition of a wide range of tin-bismuth alloys onto a conductive substrate comprises tin and bismuth ion in aqueous solution, and an alkyl sulfonic or polysulfonic acid or salt as the electrolyte. T...	08/13/1991
4975336	Article for data storage of magneto-optical disk this invention relates to an alloy material for data storage of magneto-optical disk (ADSMO), as well as its manufacturing process. ADSMO is based on manganese, bismuth and doped with aluminum atoms and silicon atoms or by aluminum atoms and boron atoms. ...	12/04/1990
4778541	Directional solidification and densification of permanent magnets having single domain Directional solidification of Bi and Mn compositions to produce magnetic single domain size MnBi particles with aligned morphologies....	10/18/1988
4764212	Thermoelectric material for low temperature use and method of manufacturing the same This invention relates to a method of manufacturing thermoelectric material which has the steps of quenching a thermoelectric alloy in a molten state at a quenching rate higher than 103 ° C./sec into a membrane or powdery form and subjecting t...	08/16/1988
4491679	Thermoelectric materials and devices made therewith The disclosed invention includes improved devices and materials for thermoelectric conversion, particularly for operation at temperatures of 300° C. and below. Disordered p-type semiconductor elements incorporate compound adjuvants of silver and lead to ...	01/01/1985
4358422	Low tin jewel metal alloy A bismuth-lead alloy containing lesser amounts of tin, antimony and zinc has been developed for use as a fusible metal, and particularly as a jewel metal alloy. The alloy meets the standards set by presently available jewel metals, has a lower melting tem...	11/09/1982
4244737	Method and alloy for introducing machinability increasing ingredients to steel Lead, bismuth and tellurium and/or sulfur are added to steel, to increase the machinability of the steel, in an addition alloy consisting essentially of 5-40 parts lead, 5-40 parts bismuth, up to 6 parts tellurium and up to 25 parts sulfur. The alloy cont...	01/13/1981
4236922	Dental alloy of bismuth-tin with additions of Ag, Sb and Cu A novel alloy comprising bismuth and tin which is characterized by the co-presence of silver and/or antimony. Particularly described is a dental alloy comprising: 1. 30 to 74 weight percent bismuth 2. 19 to 69.9 weight percent tin 3. Either A. Silver in an amo...	12/02/1980
4214903	Bismuth-tin-indium alloy Disclosed is a bismuth-tin-indium alloy consisting essentially of 53 to 76 weight % of bismuth, 22 to 35 weight % of tin and 2 to 12 weight % of indium. This alloy has excellent sealing property and oxidation resistance, and is suitable particularly to th...	07/29/1980
4173468	Alloy for soldering aluminum An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and...	11/06/1979
4083718	Bismuth-tin-indium-lead alloy Disclosed is a bismuth-tin-indium-lead alloy consisting essentially of 28 to 72 weight % of bismuth, 25 to 52 weight % of tin, 2 to 12 weight % of indium and 1 to 8 weight % of lead. This alloy has excellent sealing property and oxidation resistance, and ...	04/11/1978

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Class 420/577 - BISMUTH BASE